Encapsulating method and encapsulating module for LED chip

Abstract

The invention discloses an encapsulating method and an encapsulating module for an LED chip, solving the problems of heat dissipation and cost of LED encapsulation application. The technical scheme ofthe invention is that the method comprises the following steps: opening at least one through hole on a first insulating layer of a FR4 base material; filling the through hole through electroplating high-thermal conductive metal to form a metal column; electroplating or laminating a metal copper layer to be closely connected with the metal column to form a heat diffusing surface; pressing a secondinsulating layer on the metal copper layer, and forming a groove at the part of plating the metal column; coating copper cabling on the second insulating layer by electrical interconnection to form acopper coating layer; constantly laminating a third insulating layer on the copper coating layer, and increasing depth of the groove, and forming a groove with an inclined angle; coating a reflectionlayer on the surface of the groove; arranging a gap on a fourth insulating layer on the uppermost layer of the FR4 base material; encapsulating the LED chip on the metal plated position in the groove, binding the LED chip to the copper coating layer through gold threads, and coating phosphor powder on the LED chip; and injecting silica gel on the LED chip to form a lens. The method is applicablein the filed of LED chip encapsulation.

Description

technical field [0001] The invention relates to a packaging method and a packaging structure of an LED chip, in particular to a COB (Chip On Board) packaging method and a packaging module of a high-power white LED chip. Background technique [0002] The packaging structure of existing high-power LED chips is as follows: figure 1 As shown, the high-power LED chip 10 is packaged on a copper-based support 14 to form a single light-emitting device. In application, the LED chip 10 is soldered to the substrate 19 . The surface of the metal substrate 16 is covered with an insulating layer 17 and a copper clad layer (also referred to as a wiring layer) 18 made of copper foil. The LED chip 10 is electrically connected to the copper clad layer 18 through solder. The metal substrate 16 is generally made of high thermal conductivity metals such as aluminum and copper, and the insulating layer 17 is generally made of polymer materials. Due to the presence of multiple thermal interfac...

AI Technical Summary

Problems solved by technology

This method reduces the thermal interface of the LED package and improves heat dissipation to a certain extent, but the solder wires are exposed on the substrate, and there are still certain problems in reliability.

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