Thin-film packaging structure, thin-film packaging method and display panel

Abstract

The invention relates to a thin-film packaging structure, a thin-film packaging method and a display panel. The thin-film packaging structure comprises a substrate base plate, an organic adhesive layer and a packaging film layer, wherein the packaging film layer covers the organic adhesive layer; the organic adhesive layer is made into groove structures and dam structures formed by limitation of the groove structure in a non-display area; the groove structures and the dam structures are arranged around a display area; at least one of the groove structures and the dam structures is of a windingextending structure or a latticed structure. The thin-film packaging structure, the thin-film packaging method and the display panel disclosed by the embodiment of the invention have the beneficial effects that the organic adhesive layer is arranged on the non-display area of the substrate base plate, and a plurality of groups of groove structures with winding extending or latticed structures aredesigned on the organic adhesive layer, so that the path of water-oxygen invasion is prolonged and the bending resistance of the edge area of the display panel also can be improved; simultaneously, due to embedding combination of the groove structures and the dam structures, the water-oxygen blocking capability is improved, simultaneously the occupied space is smaller and the narrow-frame designis realized.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a thin film packaging structure, a thin film packaging method and a display panel. Background technique [0002] An organic light-emitting display device is a current-mode semiconductor light-emitting device, which has the advantages of active light emission, high luminous efficiency, and no viewing angle limitation, and has been more and more widely used in the fields of lighting and display. The organic light-emitting display device emits light through the internal OLED device, and the OLED device is very sensitive to external factors such as water vapor and oxygen, and the stability of the OLED device exposed to water vapor and oxygen will be deteriorated and the service life will be reduced. Therefore, adopting an effective packaging structure to prevent the intrusion of water vapor and oxygen can prolong the service life of the OLED device. [0003] At present, in the thin...

AI Technical Summary

Problems solved by technology

Although this method can overcome the problems of low elasticity of the inorganic layer and easy fracture, and the poor barrier ability of the organic layer to water vapor and oxygen, water vapor and oxygen can easily enter the OLED device from the peripheral area of ​​the OLED device through the gap between the organic layer and the inorganic layer. internally, resulting in a decline in the light-emitting performance of the OLED device, and more seriously, may cause the entire organic light-emitting device to fail to work

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