Fused quartz micro-hemispheric resonance gyroscope packaged based on SOI and processing method of fused quartz micro-hemispheric resonance gyroscope

A hemispherical resonant gyroscope and fused silica technology, applied in the fields of micro-electromechanical and inertial navigation, can solve the problems of increasing the cost and difficulty of MEMS packaging, and achieve the effects of simplifying the packaging process, enhancing the dynamic performance, and increasing the facing area.

Active Publication Date: 2017-07-18
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the variety of MEMS devices, MEMS packaging has particularity and diversity. In addition to the function of IC packaging, MEMS packaging also needs to solve the problem of information and energy exchange with the outside world, which increases the cost of MEMS packaging. and difficulty

Method used

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  • Fused quartz micro-hemispheric resonance gyroscope packaged based on SOI and processing method of fused quartz micro-hemispheric resonance gyroscope
  • Fused quartz micro-hemispheric resonance gyroscope packaged based on SOI and processing method of fused quartz micro-hemispheric resonance gyroscope
  • Fused quartz micro-hemispheric resonance gyroscope packaged based on SOI and processing method of fused quartz micro-hemispheric resonance gyroscope

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Experimental program
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Effect test

Embodiment 1

[0038] Such as Figure 1-3As shown, a fused silica microhemispherical resonator gyroscope based on SOI package, including glass substrate, SOI sealed shell, fused silica microhemispherical shell resonator, microhemispherical shell supporting column, reference electrode, 8 sensitive electrodes, 16 six Excitation electrodes, circular metal pads and cylindrical electrode through holes; the glass substrate is set at the bottom of the SOI sealed shell to form a closed cavity structure, the fused silica micro-hemispherical shell resonator is set at the center of the glass base, and the reference electrode is set at the fused The upper surface of the glass substrate at the center of the quartz micro-hemispherical shell resonator, the top of the micro-hemispherical shell support column is connected to the inner top surface of the hemisphere of the fused quartz micro-hemispherical shell resonator, and the bottom is connected to the reference electrode; 8 sensitive electrodes are evenly ...

Embodiment 2

[0054] It is basically the same as the embodiment 1, except that: the diameter of the hemispherical shell resonator is 2000 μm, and the thickness is 10 μm;

Embodiment 3

[0056] Basically the same as embodiment 1, the difference is: based on the processing method of the fused silica microhemispherical resonant gyroscope of SOI package, 8 sensitive electrodes in step (9) and 16 excitation electrodes in step (10) use silicon The wafer is processed and bonded so that it is respectively located on the upper surface of the glass substrate directly below the lip of the resonator of the micro-hemispherical shell and on the upper surface of the glass substrate outside the lip of the micro-hemispherical shell.

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Abstract

The invention discloses a fused quartz micro-hemispheric resonance gyroscope packaged based on an SOI and a processing method of the fused quartz micro-hemispheric resonance gyroscope. The fused quartz micro-hemispheric resonance gyroscope packaged based on the SOI comprises a glass substrate, an SOI sealing shell, a fused quartz micro-hemispheric shell resonator, a micro-hemispheric shell support post, a reference electrode, 8 sensitive electrodes, 16 exciting electrodes, a round metal bonding pad and a cylindrical electrode through hole. The electrodes are located below a spherical shell lip, so that an eccentric error caused by a problem of bonding alignment accuracy when the micro-hemispheric shell resonator and the electrode are assembled can be avoided; and an outer lip edge is added to the spherical shell lip, so that the opposite area of the electrode and the spherical shell lip is increased and the detection accuracy can be improved. The advantages of an SOI wafer are fully utilized and the micro-hemispheric resonance gyroscope is packaged, so that the packaging technology of the whole gyroscope is greatly simplified; and the micro-hemispheric resonance gyroscope is provided with 8 sensitive electrodes and 16 exciting electrodes, so that an all-angle working mode can be adopted and the dynamic property of the micro-hemispheric resonance gyroscope is strengthened.

Description

technical field [0001] The invention relates to the field of micro-electromechanical and inertial navigation, in particular to a fused quartz micro-hemisphere resonant gyroscope based on SOI packaging and a processing method thereof. Background technique [0002] With the development of 3-D MEMS (Micro-Electro-Mechanical Systems), the size of microsystems is shrinking to meet the needs of miniaturization and high integration. As an important inertial device for detecting the rotation of moving bodies, gyroscopes are widely used in the field of inertial navigation. In terms of realized performance, compared with other types and structures of gyroscopes, the hemispherical resonant gyroscope has unparalleled advantages. As a miniaturized product of the hemispherical resonant gyroscope, the micro-hemispherical resonant gyroscope has the potential to achieve high performance. [0003] At present, in the manufacturing process of the micro-hemispheric resonant gyroscope, most of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01C19/56
CPCG01C19/56
Inventor 夏敦柱高海钰
Owner SOUTHEAST UNIV
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