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Power type white LED based on fluorescence lens

A power type, LED chip technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems such as the packaging method does not break through the LED chip, the phosphor crystal structure is complex, and the promotion and application are hindered, and the thermal stability is superior. , Improve the luminous efficiency and thermal stability, easy to achieve effect

Inactive Publication Date: 2011-01-19
CHONGQING UNIV
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still two serious problems in the way of using these two types of new phosphors to package power-type white light LEDs: one is that their packaging methods have not yet broken through the traditional structure of LED chips, phosphors, and optical epoxy resin combinations; the other is that These two types of phosphors appeared late, the technology is immature, the crystal structure of phosphors is complex, the synthesis conditions are harsh, and the cost is high. At present, there are great obstacles to popularization and application.
Therefore, people are eager to propose a new packaging structure for power-type white light LEDs that abandons the idea of ​​phosphor powder modification and can solve the poor thermal stability of the traditional structure.

Method used

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  • Power type white LED based on fluorescence lens
  • Power type white LED based on fluorescence lens
  • Power type white LED based on fluorescence lens

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Embodiment Construction

[0012] see figure 1 , in the traditional white LED packaging structure, the heat generated by the blue LED chip 7 during operation will have a greater impact on the phosphor-doped LED optical epoxy resin adhesive layer 6 . Under the action of heat, the phosphor in the adhesive layer 6 is prone to adverse changes, resulting in low overall thermal stability of the white LED, prone to problems such as color coordinate drift, luminous efficiency, and luminous flux decline.

[0013] In order to solve the problem of low thermal stability of traditional white LEDs, the present invention proposes an innovative white LED packaging structure. see figure 2 , in the present invention, the LED packaging structure includes LED chips 3, electrodes 8, reflective cups 9, and heat sinks 10 in flip-chip packaging. The fluorescent lens 1 is used as a three-in-one functional device with fluorescent conversion, optical light distribution, and packaging protection; the reflector 9 and the flip-ch...

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Abstract

The invention discloses a power type white LED based on a fluorescence lens, comprising an LED chip packaged by flip-chip bonding, an electrode, a reflective cup and a heat sink, wherein the fluorescence lens doped with light-emitting ions serves as a functional device with three functions of fluorescence conversion, optical light distribution and package protection. The invention has the technical effects that a glass-based fluorescence lens with high heat stability is adopted to realize more superior overall heat stability of the power type white LED; the heat dissipation efficiency and the light emitting efficiency of the LED chip are improved, thereby improving the overall light-emitting efficiency and the thermal stability of the power type white LED and overcoming the defect of coordinate drifting of illuminant colors brought by the fact that optical epoxy resin is easy to age and turn to yellow; and the package process has clear steps and is simple, therefore the overall package process of the power type white LED is simple and is easy to operate and realize.

Description

technical field [0001] The invention relates to a white light LED for illumination, more specifically to a power type white light LED based on a fluorescent lens. technical background [0002] At present, the realization of white light LED (light emitting diode) for lighting mainly adopts the combination method of blue LED chip, yellow light phosphor powder and optical epoxy resin. A lot of related research has been carried out. But at present, cerium-doped yttrium aluminum garnet (YAG:Ce) yellow phosphor is widely used as the fluorescent conversion substance in white LEDs for lighting, and this phosphor has the defect of poor thermal stability, see figure 1 , in the traditional power white LED package structure, the heat generated by the blue LED chip (7) during operation will have a greater impact on the fluorescent powder-doped adhesive layer (6). Under the action of heat, the phosphor powder in the adhesive layer (6) is prone to change the lattice structure of its matr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/58
CPCH01L2224/16H01L2224/48091H01L2224/8592
Inventor 雷小华金雷陈伟民章鹏
Owner CHONGQING UNIV
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