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Epoxy resin base damping packaging material

A technology of epoxy resin and flexible epoxy resin, applied in other chemical processes, chemical instruments and methods, etc., to achieve the effects of good fluidity, gentle curing reaction, and low heat release

Inactive Publication Date: 2008-05-28
张向宇
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current general epoxy resin encapsulation materials are difficult to meet the above conditions

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] An epoxy resin damping encapsulation material is composed of A and B components. Component A is composed of 45 parts of E-54 epoxy resin, 50 parts of glycidyl ether type flexible epoxy resin, and 5 parts of polyurethane epoxy resin. Component B is composed of 8 parts of diethylenetriamine, 25 parts of diethylenetriamine propylene oxide butyl ether and 2 parts of γ-aminopropyltriethoxysilane mixed uniformly.

[0016] Proportion during use: mix uniformly according to the mass parts A:B=100:30~45.

[0017] Curing conditions: 48 hours at 20-25°C; or 2 hours at 20-25°C, and then 4 hours at 60°C.

Embodiment 2

[0019] An epoxy resin damping encapsulation material is composed of A and B components. Component A is composed of 40 parts of CYD-127 epoxy resin, 50 parts of glycidyl ether type flexible epoxy resin, and 10 parts of polyurethane epoxy resin. Component B is composed of 8 parts of triethylenetetramine, 40 parts of 651 low-molecular polyamide and 2 parts of γ-aminopropyltriethoxysilane mixed uniformly.

[0020] Proportion during use: mix evenly according to the mass parts A:B=100:45~65.

[0021] Curing conditions: 48 hours at 20-25°C; or 2 hours at 20-25°C, and then 4 hours at 60°C.

Embodiment 3

[0023] An epoxy resin damping encapsulation material is composed of A and B components. Component A is composed of 40 parts of E-51 epoxy resin and 60 parts of glycidyl ether type flexible epoxy resin. Component B is composed of 100 parts of 650 low-molecular polyamide, 15 parts of diethylenetriamine propylene oxide butyl ether and 2 parts of γ-aminopropyl triethoxysilane. =100:100 and mix well.

[0024] Curing conditions: 48 hours at 20-25°C; or 2 hours at 20-25°C, and then 4 hours at 60°C.

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Abstract

The invention relates to a damping package material of epoxy resin group, which consists of component A and component B, wherein the component A is composed of 0-90 parts of bisphenol A epoxy resin, 0-60 parts of polyurethane epoxy resin, 20-90 parts of flexible epoxy resin according to part by weight, the component B is composed of 25-55 parts of aliphatic amine, 10-45 parts of aliphatic cyclic amine, 0-80 parts of versamid and 0-8 parts of silane coupling agent according to part by weight, the parts are mixed uniformly according to part by weight of A:B=100:15-100. The invention has the advantages that the mixture has good mobility, the solidification reaction is mild, the condensate has good mechanical property and good tensile shear strength with metals, the invention can resist high and low temperature impact, thermal aging and humidity heat aging, the condensate does not erode rigid aluminium alloy, steel, aldary and PVC plastics in sealed humidity heat condition, the solidification shrinkage ratio is low, with the damping coefficient (tan delta max>=0.5). Particularly, the invention has instantaneous high impact property and the operational temperature is from -54 DEG C to 70 DEG C.

Description

technical field [0001] The invention belongs to the field of high polymer damping materials, and in particular relates to an epoxy resin-based damping encapsulation material. technical background [0002] Packaging materials are produced and developed with the emergence of electronic components and integrated circuits, and finally developed into today's packaging industry. Under the ever-changing trend of electronic technology, electronic components and integrated circuits are moving towards ultra-large-scale, ultra-high-speed, high-density, high-power, high-precision, miniaturization, lightweight, precision, high-performance and multi-functional The direction is developing rapidly, therefore, higher and higher requirements are put forward for packaging; and the progress of packaging technology has promoted the improvement of electronic components and integrated circuits. In short, they are a close relationship of interdependence and mutual promotion. While the developed c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/10C08L63/02C08K5/54C08L75/08C08L77/00
Inventor 张向宇张隽华
Owner 张向宇
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