This invention pertains to composite materialmanufacturing technology and relates to a method and structure for curing and stamping at the chamfered position of a honeycomb sandwich structure autoclave. A thermally conductive material is laid on the plane where the stamping position of the honeycomb sandwich structure is located, extending from the stamping position to the center of the plane; the thermally conductive material is positioned between the release film, the breathable felt, and the vacuum bag.