High-strength high-mobility epoxy resin grouting material and preparation method thereof
A technology of epoxy resin grouting and high fluidity, applied in the field of epoxy resin materials, can solve the problems of slowing down curing speed, slowing down heat release, inability to meet, etc., to reduce curing heat release, realize self-leveling, and easy construction. Effect
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Example Embodiment
[0040] Example 1
[0041] The composition of the high-strength and high-fluidity epoxy resin grouting material of this embodiment is as follows:
[0042] Table 1
[0043]
[0044]
[0045] The mass ratio of component A, component B and component C is 127:38:801.2, that is, 1:0.3:6.3.
[0046] The preparation method is as follows:
[0047] Take each component A and mix to obtain component A;
[0048] Take each B component and mix to obtain B component;
[0049] Take each C component and mix to obtain C component.
[0050] During the on-site construction, first mix the A component and the B component evenly, and then add the C component, and then the grouting construction can be done. After construction, no maintenance is required. The compressive strength for 3 days at 20°C is 70MPa, and the specific properties are shown in Table 4 below (refer to the "Cement Mortar Strength Test" GB / T17671-1999 standard for testing).
Example Embodiment
[0051] Example 2
[0052] The composition of the high-strength and high-fluidity epoxy resin grouting material of this embodiment is as follows:
[0053] Table 2
[0054]
[0055] The mass ratio of component A, component B and component C is 127.5:50:701, that is, 1:0.4:5.5. The preparation and construction methods are the same as in Example 1.
Example Embodiment
[0056] Example 3
[0057] Components A and B are the same as in Example 1.
[0058] The composition of the high-strength and high-fluidity epoxy resin grouting material of this embodiment is as follows:
[0059] table 3
[0060]
[0061] The mass ratio of component A, component B and component C is 127:38:451, which is 1:0.3:3.6. The preparation and construction methods are the same as in Example 1.
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