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Epoxy resin adhesive and preparation method thereof

A technology of epoxy resin and adhesive, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of long gel time, poor product toughness, strong irritation, etc., and achieve low heat release and rapid curing , the effect of improving toughness

Active Publication Date: 2013-12-18
浙江东大树脂科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The system of epoxy resin and aliphatic polyamine has poor toughness, high toxicity and strong irritation during operation; while the system of epoxy resin and polyamide has good toughness and low toxicity, but the gel time is relatively long , the gel time is as long as 5 hours at 25°C, and it usually takes 7 days to achieve a certain curing strength

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Component A: bisphenol A type epoxy resin: 80 parts by weight, carboxyl-terminated nitrile rubber modified bisphenol A type epoxy resin: 20 parts by weight, titanium dioxide: 30 parts by weight;

[0030] Component B: polythiol curing agent (3380s polythiol provided by Shenzhen Jiadida): 70 parts by weight, modified amine curing agent (5408 modified amine curing agent provided by Shenzhen Jiadida): 30 parts by weight Parts, hydrophobic fumed silica: 2 parts by weight, KH-550: 3 parts by weight, microsilica powder: 30 parts by weight, phthalocyanine blue: 0.1 parts by weight;

[0031] Weigh 1600g of 128 resin by weight, add 400g of carboxy-terminated nitrile rubber modified epoxy resin into a mixing instrument with a vacuum device, stir while heating at a stirring speed of 60 rpm, and heat up to 60°C. Turn on the dispersion, stir and disperse for 15 minutes at a stirring speed of 60 rpm and a dispersion speed of 800 rpm while vacuuming. Stop the machine, add 600g of tita...

Embodiment 2

[0035] Component A: bisphenol A type epoxy resin: 70 parts by weight, carboxyl-terminated nitrile rubber modified bisphenol A type epoxy resin: 15 parts by weight, titanium dioxide: 20 parts by weight;

[0036] Component B: polythiol curing agent (3380s polythiol provided by Shenzhen Jiadida): 40 parts by weight, modified amine curing agent (5408 modified amine curing agent provided by Shenzhen Jiadida): 60 parts by weight Parts, hydrophobic fumed silica: 3 parts by weight, KH-560: 1 part by weight, microsilica powder: 15 parts by weight, phthalocyanine blue: 0.05 parts by weight;

[0037] Weigh 1400g of E44 resin by weight, add 300g of carboxy-terminated nitrile rubber modified epoxy resin into a mixing instrument with a vacuum device, stir while heating at a stirring speed of 50 rpm, and heat up to 70°C. Turn on the dispersion, stir and disperse for 10 minutes at a stirring speed of 50 rpm and a dispersion speed of 500 rpm while vacuuming. Stop the machine, add 400g of tita...

Embodiment 3

[0041] Component A: bisphenol A epoxy resin: 85 parts by weight, carboxyl-terminated nitrile rubber modified bisphenol A epoxy resin: 30 parts by weight, titanium dioxide: 40 parts by weight;

[0042] Component B: polythiol curing agent (3380s polythiol provided by Shenzhen Jiadida): 60 parts by weight, modified amine curing agent (5408 modified amine curing agent provided by Shenzhen Jiadida): 40 parts by weight Parts, hydrophobic fumed silica: 0.5 parts by weight, KH-560: 2 parts by weight, silicon micropowder: 20 parts by weight, phthalocyanine blue: 0.2 parts by weight;

[0043] Weigh 1700g of E51 resin by weight, add 600g of carboxyl-terminated nitrile rubber modified epoxy resin into a mixing instrument with a vacuum device, stir while heating at a stirring speed of 80 rpm, and heat up to 50°C. Turn on the dispersion, stir and disperse for 20 minutes at a stirring speed of 80 rpm and a dispersion speed of 600 rpm while vacuuming. Stop the machine, add 800g of titanium d...

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Abstract

The invention provides an epoxy resin adhesive comprising a component A and a component B. The component A comprises 70-85 parts by weight of bisphenol A epoxy resin, 15-30 parts by weight of toughness modified bisphenol A epoxy resin and 20-40 parts by weight of a first filler; and the component B comprises 40-70 parts by weight of a polymercaptan curing agent, 30-60 parts by weight of a modified amine curing agent and 15-30 parts by weight of a second filler. According to the two-component epoxy resin adhesive provided by the invention, introduction of the toughness modified bisphenol A epoxy resin into the component A and compound of the modified amine curing agent and polymercaptan curing agent in the component B improve toughness of the epoxy resin adhesive, and the epoxy resin adhesive can be quickly cured at room temperature.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to an epoxy resin adhesive and a preparation method thereof. Background technique [0002] With the aggravation of environmental pollution, more and more attention has been paid to environmental issues, and traditional petrochemical energy can no longer meet people's growing energy demand. With the development of science and technology, the photovoltaic industry has gradually replaced some functions of petrochemical energy. The most widely used raw materials in the photovoltaic industry are polycrystalline silicon wafers and monocrystalline silicon wafers. The cutting and production of monocrystalline silicon wafers and polycrystalline silicon wafers is an important link in the entire industrial chain. During the cutting process of crystalline silicon wafers, adhesives are needed to fix the crystal holder and glass, glass and ingot, so adhesives are indispensable auxiliary mater...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J163/00C09J11/04C08G59/66C08G59/56
Inventor 吴进罗伟琪杨长剑
Owner 浙江东大树脂科技股份有限公司
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