Photo-thermal dual-curing anisotropic conductive adhesive film and preparation method thereof

Abstract

The invention relates to a photo-thermal dual-curing anisotropic conductive adhesive film and a preparation method thereof. The anisotropic conductive adhesive film is prepared from raw materials in percentage by mass as follows: 35%-45% of epoxy resin, 10%-25% of acrylic resin, 5%-10% of a cross-linking agent, 2%-7% of a diluent, 0.6%-1% of a photoinitiator, 2.5%- 4% of a thermal curing agent, 5%-10% of an accelerant, 0.5%-2% of a silane coupling agent and 20%-35% of conductive balls. The preparation method comprises steps as follows: the raw materials are blended, subjected to rotary coating and then subjected to ultraviolet exposure processing, and the anisotropic conductive adhesive film is prepared. The anisotropic conductive adhesive film has good conductive performance, excellent weather fastness, low curing temperature, long storage time, high curing degree and high bonding strength; the preparation process is simple, the cost is low, and the application prospect is broad.

Description

technical field

[0001] The invention belongs to the field of anisotropic conductive adhesive film, and in particular relates to a photothermal dual curing anisotropic conductive adhesive film and a preparation method thereof. Background technique

[0002] Today in the 21st century, with the rapid changes in science and technology, electronic devices are also constantly updated and improved, and gradually develop in the direction of portability, lightness, high speed, and high performance. Various electronic devices such as mobile phones, tablet computers, global positioning systems, etc. Gradually achieve the goal of lighter, thinner and smaller. As a traditional soldering material, tin-lead metals occupy a pivotal position in the field of electronic packaging, but their environmental pollution limits their wide application. Conductive adhesives based on polymers are relatively green and environmentally friendly materials that can well solve the problem of fine-pitch connec...