Image sensor module and forming method thereof

An image sensor and image sensing technology, which is applied in radiation control devices and other directions, can solve the problems of image sensor module performance that needs to be improved, and achieve the effects of superior structural performance, high flexibility, and reduced design cost

Inactive Publication Date: 2014-07-30
CHINA WAFER LEVEL CSP
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  • Abstract
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Problems solved by technology

[0005] However, in the prior art, when the image sensing unit and the signal processing unit are formed on o

Method used

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  • Image sensor module and forming method thereof
  • Image sensor module and forming method thereof
  • Image sensor module and forming method thereof

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Embodiment Construction

[0047] It can be seen from the background art that the existing chip packaging including the image sensing unit and the signal processing unit is difficult, and the performance of the formed image sensor module needs to be improved.

[0048] It is found through research that in the prior art, the image sensing unit and the signal processing unit are usually packaged on the same chip. To form a signal processing chip on an image sensor chip, it is a difficult technology to consider the arrangement and interconnection between the two, which will lead to an increase in the difficulty of the packaging process; at the same time, the cost of the image sensor chip is high , after the signal processing chip is arranged on the image sensing chip, in order to consider the interconnection between the signal processing chip, the area of ​​the image sensing chip will inevitably be increased, resulting in a significant increase in the packaging process cost; and, due to the signal processing...

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Abstract

The invention discloses an image sensor module and a forming method of the image sensor module. The image sensor module comprises a PCB substrate, a metal layer, an image sensing chip, a signal processing chip and welding protrusions. The PCB substrate is provided with a hole penetrating through the PCB substrate, the metal layer is arranged on the surface of the PCB substrate, the image sensing chip is inversely arranged above the PCB substrate, the image sensing chip is provided with an image induction area and a bonding pad surrounding the image induction area which is arranged above the hole, the bonding pad is electrically connected with the metal layer, the signal processing chip is inversely arranged above the PCB substrate, the signal processing chip is electrically connected with the metal layer, and the welding protrusions are arranged on the surface of the metal layer. The packaging performance of the image sensor module is improved, and the production cost of the image sensor module is reduced.

Description

technical field [0001] The invention relates to semiconductor packaging technology, in particular to an image sensor module and its forming method. Background technique [0002] An image sensor chip is a chip that senses external light and converts it into an electrical signal. After the image sensor chip is manufactured, a series of packaging processes are performed on the image sensor chip to form a packaged image sensor for use in various electronic devices such as digital cameras and digital video cameras. [0003] The traditional image sensor packaging method is usually packaged by wire bonding (Wire Bonding). However, with the rapid development of integrated circuits, longer leads make the product size unable to meet the ideal requirements. Therefore, wafer-level packaging (WLP: Wafer Level Package) has gradually replaced wire bonding packaging as a more commonly used packaging method. Wafer-level packaging technology has the following advantages: the entire wafer ca...

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Application Information

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IPC IPC(8): H01L27/146
Inventor 王之奇喻琼王蔚
Owner CHINA WAFER LEVEL CSP
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