81 results about "Optical barrier" patented technology

This invention is in the field of medical devices. Specifically, the present invention provides fluidic systems having a plurality of reaction sites surrounded by optical barriers to reduce the amount of optical cross-talk between signals detected from various reaction sites. The invention also provides a method of manufacturing fluidic systems and methods of using the systems.

An optical proximity sensor assembly includes an optical proximity sensor with an IR LED emitting light having an infrared wavelength, an IR photo detector sensitive to the infrared wavelength, an optical barrier blocking direct light rays from the LED to the IR photo detector and permitting reflected light rays to reach the at least one photo detector; and an electronic integrated circuit with an amplifier for amplifying a signal detected by the photo detector, an analog to digital converter, LED drivers, noise reduction and ambient light cancellation circuitry, and a digital interface for communication with a microcontroller. The optical proximity sensor is accommodated on a wearable carrier. A single sensor may include a plurality of identical or different LEDs, a plurality of photodiodes, or both. Also, several sensors may be placed on a person's skin along a vascular path to obtain data relating to blood flow and artery stiffness.

Embodiments disclosed therein generally pertain to selectively strengthening glass. More particularly, techniques are described for selectively strengthening cover glass, which tends to be thin, for electronic devices, namely, portable electronic devices. In certain embodiments, selectively strengthening glass, such as cover glass, can be used to provide optical barriers (or channels) internal to the glass. The electronic devices can also provide for camera integration behind the cover glass.

An optical particle counter has a gain-apertured laser cavity producing laser light, an inlet jet providing fluid flow into a particle detecting region within the laser cavity, the inlet jet having an inlet jet orifice; a detection optics assembly located to collect light scattered from particles with the detecting region for producing an output signal indicative of the particles; and an optical barrier complex located to reduce noise as compared to the gain-apertured system without the optical barrier complex for fluid flow rates greater than or equal to about 0.1 cubic feet per minute. The optical barrier complex inhibits laser light from illuminating turbulent eddy currents originating on the interior walls of the inlet jet. The optical barrier complex includes one or more physical apertures, one or more optical stops, or both which are located to prevent laser light from illuminating the eddy currents.

An image sensor includes a substrate, at least an optical device, at least a dielectric layer, and at least a wave-guide tube disposed upon the optical device. The wave-guide tube has an optical barrier disposed on a sidewall thereof and a filter layer filled in the wave-guide tube. The structure of the wave-guide tube has the advantages of shortening light path, focusing, and preventing undesirable crosstalk effect between different optical devices.

An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.

An image-sensing device includes a substrate, at least one optic component, at least one dielectric layer and at least a waveguide set above the optic component. Sidewall of the waveguide is set with a optic-shielding layer, and the waveguide is embedded with a filling layer. Therefore, the device can effectively shorten optic path, focus light, and avoid bridging phenomenon between different optic paths to improve sensitivity of the image-sensing device.

A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material.

Cavity lasers exhibit a relatively high beam quality (e.g., M²<1.25) despite a relatively small cavity length (e.g., 50-53 mm) for a high (e.g., ≧10 watt) output power device. This enables the construction of physically smaller laser and optical assemblies without sacrificing performance. Reduction of optical photonic interference, which can impair imaging performance, is also facilitated. Laser and optical assemblies may utilize an aperture defined within an optical barrier element to reduce the divergence of the light beam emanating from a diode-pumping laser.

Electromagnetic radiation barriers and waveguides, including barriers and waveguides for light, are disclosed. The barriers and waveguides are fabricated by directing charged particles, for example, ions, into crystalline substrates, for example, single-crystal sapphire substrates, to modify the crystal structure and produce a region of varying refractive index. These substrates are then heated to temperatures greater than 200 degrees C. to stabilize the modified crystal structure and provide the barrier to electromagnetic radiation. Since the treatment stabilizes the crystal structure at elevated temperature, for example, above 500 degrees C. or above 1000 degrees C., the barriers and waveguides disclosed are uniquely adapted for use in detecting conditions in harsh environments, for example, at greater than 200 degrees C. Sensors, systems for using sensors, and methods for fabricating barriers and waveguides are also disclosed.

A system for manufacturing an irrigation pipe (100) comprising

• • an extrusion unit (300)
  • a calibrator unit (400)
  • a cooling unit (600) for cooling the irrigation pipe (100) in a cooling liquid (30)
  • a traction unit (500) for drawing the irrigation pipe (100) in the cooling unit (600)

the cooling unit comprising a device for detecting holes (102) in the wall of the irrigation pipe (100) and arranged for being immersed in the cooling liquid (30), this device for detecting holes comprising at least one optical transmitter (1) and at least one optical receiver (2) which define an optical barrier (10),

this device being arranged so that the holes (102) in the irrigation pipe (100) located below this device produce gas bubbles (20) which modify this optical barrier (10).

An optical waveguide device is provided for receiving light that has a guided mode and an unguided mode. The device comprises an optically transmissive substrate having first and second substantially opposite surfaces, an input end, and an output end. An optical waveguide region is disposed within the substrate and extends from the input to the output. A plurality of electrodes is disposed on the first surface at predetermined locations with respect to the waveguide region. The device includes a plurality of optical barriers each disposed proximate one of the first and second surfaces and positioned to block a different optical path of the unguided mode.

An optical film comprises a first transparent film substrate, a matte layer arranged on the first transparent film substrate and having irregularities, the matte layer having a coefficient of static friction of not larger than 0.3 and a maximum height roughness Rz of not less than 0.05 μm to not larger than 8 μm.

A method for wafer level fabricating a plurality of optoelectronic devices, starting with a wafer that includes a plurality of light detector sensor regions, includes attaching each of a plurality of light source dies to one of a plurality of bond pads on a top surface of the wafer that includes the plurality of light detector sensor regions. The method also includes attaching, to the wafer, a preformed opaque structure made off-wafer from an opaque material, wherein the preformed opaque structure includes opaque vertical optical barriers. Additionally, solder balls or other electrical connectors are attached to the bottom of the wafer. The wafer is diced to separate the wafer into a plurality of optoelectronic devices, each of which includes at least one of the light detector sensor regions, at least one of the light source dies and at least two of the solder balls or other electrical connectors.

A backlight module unit and a backlight module are provided. The backlight module unit includes a first light source, a second light source, and an optical barrier. A light source interval is defined between the first light source and the second light source, while a barrier interval is defined between the optical barrier and the second light source. Because the barrier interval is substantially shorter than a half of the light source interval, the backlight module unit mixes the light evenly, and prevents the dark bands from forming due to the disposition of the optical barrier. Thereby, the backlight module that comprises the plural aforesaid backlight units will have no dark bands, mix light evenly, and be thin overall.

A safety device for a machine has a first machine part for carrying out a working movement towards a second machine part. It also has at least a first and a second optical barrier moving along with the first machine part during the working movement. The first optical barrier runs ahead of the first machine part by a first distance, and the second optical barrier is arranged at a second distance from the first optical barrier. A control unit is designed to stop the working movement of the first machine part when the first optical barrier is interrupted. A test unit allows to test whether the second optical barrier has been interrupted once the first machine part has been stopped. A blocking unit serves for blocking the working movement as a function of the test result from the test unit. Using this safety device it is possible to determine an overtravel of the first machine part in a simple and reliable manner. Furthermore, an optical sensor barrier can be used to detect the position for a switchover between a rapid motion and a creep motion of the machine without requiring additional position sensors.

The present invention relates to a protective barrier device for covering an intraoral camera comprising: a flexible plastic body, said body having an opening for inserting the intraoral camera; and a hard clear plastic window at the distal end of the plastic body. The flexible plastic body is of sufficient length to cover the entire length of an appendage of the intraoral camera. The window aligns with a camera lens of the intraoral camera when the plastic body is placed over the appendage and may be constructed of a fog-resistant plastic.

Described herein are techniques to reduce or remove the impact of secondary path photons and/or charge carriers on storage bins of an integrated device to improve noise performance, and thus, sample analysis. Some embodiments relate to optical rejection techniques such as including an optical barrier positioned to block at least some photons from reaching the storage bins. Some embodiments relate to electrical rejection techniques such as including an electrical barrier configured to block at least some charge carriers from reaching the storage bins along at least one secondary path. Some embodiments relate to an integrated device in which at least one storage bin is shaped and/or positioned relative to the photodetector to facilitate receipt of some charge carriers (e.g., fluorescent emission charge carriers) and/or photons and to impede receipt of other charge carriers (e.g., noise charge carriers) and/or photons.