The utility model discloses an optical
chip packaging structure, which is applied to the technical field of
chip packaging. According to the utility model, the light absorption
coating is added on the upper surface of the receiving
chip, and the light absorption
coating can reduce the reflection of light on the surface of the receiving chip or the transparent plastic
package layer, so as to reduce the
crosstalk in the
package; and meanwhile, the transparent plastic
package layer forms a notch at the position of part of the light absorption
coating, so that the area of a
crosstalk channel can be reduced, and the bulge of the light-proof bracket is arranged in the notch, so that light can be further blocked, and a traditional
optical barrier can be replaced. Wherein the light absorption coating is added on the surface of the receiving chip and can be realized at a
wafer end in batches, so that the efficiency can be improved and the cost can be reduced; in addition, the notch can be formed in a mode of forming a groove through
cutting or mold pressing, and a mode of forming a groove through built-in optical barriers is replaced, so that the packaging operation process can be reduced, the difficulty can be reduced, the production efficiency and the yield can be improved, and the purpose of reducing the cost can be achieved.