Process for encapsulating square flat outer-pin-free encapsulating structure

Abstract

The invention relates to a process for encapsulating a square flat outer-pin-free encapsulating structure. The encapsulating structure comprises a chip, a metal structure, a metal wire and a plastic encapsulating material; the encapsulating process comprises the following steps: manufacturing grooves with preset depth between adjacent inner pins and in connecting parts between the inner pins and other parts of the metal structure; adhering the chip to a preset position of the upper surface of the metal structure; connecting an input/output port of the chip with the inner pin which is positioned on the metal structure and corresponds to the input/output port through the metal wire; performing plastic encapsulation on the upper surface of the metal structure by the plastic packaging material so as to protect the chip, the metal wire and the upper surface of the metal structure; and thinning the metal structure upwards from the bottom plane of an encapsulating body with exposed metal after the plastic encapsulation so as to separate the adjacent inner pins and separate the inner pins from the other parts of the metal structure.

Description

technical field [0001] The invention relates to an electronic component packaging process, in particular to a packaging process of a square flat package structure without external leads, which makes pin arrangement more free and flexible, and can simplify the process. Background technique [0002] Package refers to connecting the input and output ports of the circuit on the chip to external joints or pins with metal wires, so as to connect with other devices or circuit boards. Package form refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of installing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also connects the contacts on the chip to the pins of the package shell with metal wires, and these pins pass through the pins on the printed circuit board. The wires are connected with other devices, so as to realize the connection between the internal chip and the external circuit. ...

AI Technical Summary

Problems solved by technology

That is, when the spacing between inner pins decreases exponentially due to the increase of circuit density, it becomes more and more difficult to realize the separation of inner pins by cutting, and there will be many restrictions in terms of design

In particular, burrs and bridging are likely to occur when individual inner pins are separated by cutting

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