Airborne spray cooling system for cooling circulating water by using ram air and evaporative refrigeration cycle

Abstract

The invention discloses an airborne spray cooling system for cooling circulating water by using ram air and an evaporative refrigeration cycle, and belongs to the cooling field of airborne high-heat-flux-density equipment. The system is mainly used for solving the continuous heat dissipation of high-heat-flux-density surfaces such as an airborne radar chip and a laser weapon and mainly includes awater tank, a compressor, an evaporator, a cold water inlet, a cold water outlet, a refrigerant inlet, a refrigerant outlet, a phase change material, an expansion valve, a condenser, a phase change material heat exchanger, a ram air inlet, a spray chamber, a to-be-cooled surface, a nozzle, a flow meter, a flow control valve and a water pump. The system, by using the latent heat of vaporization ofwater, cools the surface of a high-temperature electronic device in the spray chamber, uses the ram air as a main cold source, uses an evaporative refrigeration cycle as an auxiliary cold source, usestwo phase change materials as an intermediate energy storage medium to correspond to the two cold sources, and selects a cold source combination mode according to the surface temperature. The systemis safe, stable, and energy-efficient in operation, and meets the cooling needs in airborne complex environments.

Description

Technical field [0001] The invention relates to an airborne spray cooling system using stamping air and evaporative refrigeration cycle to cool circulating water, belonging to the field of airborne high heat flux electronic equipment cooling. Background technique [0002] With the rapid development of airborne radar technology, power amplifier chips have developed from silicon chips and GaAs chips to the third-generation semiconductor GaN chips. Several projects of the U.S. Navy and Air Force have shown that the heat flux density of GaN chips under research has reached 500W / cm 2 , the heat flux density of future chips will exceed 1000W / cm 2 . At the same time, with the continuous improvement of military aircraft maneuverability, stealth performance, and defense performance requirements, technologies such as high-power laser technology, high integration and miniaturization of electronic components have been developed rapidly. Laser weapons will generate megawatt-level heat...

AI Technical Summary

Problems solved by technology

[0005] Some patents have proposed the application method of spray cooling in the airborne field. For example, patent ZL201510072716.7 proposes a cooling system based on air expansion refrigeration for airborne heating elements. The main feature is the use of turbines as refrigeration devices and power sources. When this solution is put into use, the turbine cooling storage must be used first for spray cooling, and the cooling storage time is long, so it cannot be put into use at any time; the structure is complex and the equipment space is large, and it is difficult to install on military aircraft

Patent ZL201510072716.7 proposes a cooling system for onboard heating elements based on air expansion refrigeration. The main feature is that the turbine is used as the cooling device and power source. In this solution, the cooling source is completely provided by the turbine, which increases the original turbine refrigeration of the aircraft. The load of the system is not good for the long-term stable operation of the aircraft

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