114 results about "Coplanar lines" patented technology

Provided is a semiconductor device including an interconnect substrate, a transmission line which is formed on the interconnect substrate, and a circuit component which is mounted over the interconnect substrate and has a ground plane. The transmission line includes a first portion and a second portion that is connected to the first portion. The first portion and the ground plane constitute a microstrip line. The second portion and ground line constitute a coplanar line.

Methods and systems for a 60 GHz leaky wave high gain antenna are disclosed and may include communicating RF signals using one or more or more leaky wave antennas (LWAs) in a wireless device. The LWAs may be integrated in metal traces on a chip, a package, and/or a printed circuit board (PCB). The metal traces may supply voltage signals to one or more circuits on the chip, package, and/or PCB. The voltage signals may include DC bias voltages, and/or signals at a frequency that is lower than a resonant frequency of the LWAs. The LWAs may include microstrip or coplanar lines where a cavity height of the LWAs is dependent on a spacing between the lines. An angle of the wireless signals with a surface of the chip, package, and/or PCB may be dynamically configured. The LWAs may be configured via switches in the chip, package, and/or PCB.

A delay line system able to reduce the microwave loss by reducing the effective dielectric loss and dielectric constant of the system including a signal line, dielectric system with opened trench or slot filled up with the air or lower dielectric loss material, a ground plane, and a system of switches if the line is to be variable. The delay line proposed in this invention could be made of any type of signal line configuration, for example: micro-strip line, strip line, or coplanar line. The signal line can also be made as single ended or differential pairs of any configurations. The delay line systems based on the fundamental techniques provided in this invention can be used for on-chip devices where the delay line is laid on the oxide or dielectric material, or in a traditional PCB implementation such as FR4.

A tunable dielectric structure includes a first layer of dielectric material, a second layer of dielectric material positioned adjacent to the first layer of dielectric material, with the second layer of dielectric material having a dielectric constant that is less than the dielectric constant of the first layer of dielectric material, and electrodes for applying a controllable voltage across the first dielectric material, thereby controlling a dielectric constant of the first dielectric material, wherein at least one of the electrodes is positioned between the first and second layers of dielectric material. The dielectric materials can be formed in various shapes and assembled in various orientations with respect to each other. The tunable dielectric structure is used in various devices including coaxial cables, cavity antennas, microstrip lines, coplanar lines, and waveguides.

A high-frequency circuit device includes a dielectric member 1, a shielding conductor 2 surrounding the dielectric member 1, a support member 3 for fixing and supporting the dielectric member 1, and a pair of transmission lines 4 each of which is formed of a microstrip-line. Each of the transmission lines includes a substrate 6 formed of a dielectric material, a strip conductor 5, and an earth conductor layer 9. An end portion of the strip conductor 5 faces part of the dielectric member 1 and functions as a coupling probe for input/output coupling. Each of the transmission lines 4 is formed of a strip line, a mictostrip line, a coplanar line or the like, and has low-loss when connected to a circuit board.

In a RF coupler that has high transmission efficiency in a broad range and that uses an RF printed layered circuit board, strong electrostatic coupling is obtained between circuits, and electromagnetic coupling is also used; C-shaped loops (1, 2) that have parts cut out face the surfaces of a dielectric plate having a thickness t; terminals (1a, 1b) connected to the two ends of the loop (1) are used as primary terminals; terminals (2a, 2b) of the loop (2) are used as secondary terminals; and coplanar lines (4) extend from these terminals along the surface of the dielectric plate up to terminals (41, 42). Therefore, the portions where the loops overlap are couplers, the coplanar lines are secondary transmission lines, and a wide variety of antennas not limited to dipoles may be connected to terminals (4a, 4b).

An optical module having a flexible substrate having, even after actual manufacturing steps, excellent transmission characteristics of high-frequency signals and an advantage that electromagnetic field radiation is reduced even when it is connected with a package. The flexible substrate used in external connection of the package of the optical module uses a flexible substrate having a coplanar line to which a lead pin is fixedly attached, a grounded coplanar line which is in contact with the coplanar region, and a microstrip line which is in contact with the grounded coplanar line. The flexible substrate has an electrode layout in which an electromagnetic field component of a surface ground line and a signal line is more dominant than an electromagnetic field component of a back-surface ground line and the signal line in a region of the coplanar line adjacent to the grounded coplanar line.

A signal line is formed in the a-th layer (a≧2) of a multi-layered interconnect layer and a redistribution layer. A plain line is formed in the b-th layer (b<a) of the multi-layered interconnect layer and the redistribution layer and overlaps with the signal line when seen in a plan view. Two coplanar lines that are formed in the c-th layer (b≦c≦a) of the multi-layered interconnect layer and the redistribution layer, extend in parallel to the signal line when seen in a plan view, and interpose the signal line therebetween. A distance h from the signal line to the plain line is smaller than a distance w from the signal line to the coplanar lines. A power supply line, a ground line, and another signal line are not located within the range of the height equal to the distance w from the signal line above the signal line.

A variable capacitance element includes a coplanar line or signal conduction and a movable body, which are vertically displaced through a supporting bar and which are provided on a substrate. A movable electrode is provided between a first driving electrode and second and third driving electrodes which are movable electrodes. Voltage is applied between the movable electrodes, such that one of the movable electrodes is pressed against the coplanar line through a dielectric film. Thus, high frequency signals conducting through the coplanar line are shut off. When voltage is applied between the other electrodes, the movable electrode and the dielectric film are moved apart from the coplanar line. Thus, high frequency signals are conducted through the coplanar line.

The high-frequency wiring board of the present invention is a wiring board that includes first coplanar lines and second coplanar lines formed on a different layer than the first coplanar lines; the first coplanar lines and second coplanar lines being connected at the line ends of each. The first coplanar lines are provided with a first signal line (10) and a first planar ground pattern (30a) formed on the same wiring layer as the first signal line (10). The second coplanar lines are provided with second signal line (11) formed on a wiring layer that differs from that of the first signal line (10), a second planar ground pattern 32 formed on the same wiring layer as the second signal line, and a first ground pattern (30b) formed on the same wiring layer as the first coplanar lines. The end of the first planar ground pattern (30a) and the end of the first ground pattern (30b) are connected and thus unified. In this high-frequency wiring board, the second planar ground pattern (32) is separated from the connection portion at the end of the first planar ground pattern (30a) in the direction in which the second coplanar lines extend from the vicinity of the connection portion of the first signal line and the second signal line.

A high frequency coupler (2) comprising first and second coupler patterns (11, 12) each having an annular shape broken at one location and formed, facing each other, on the front and rear surfaces of a circuit board (10) consisting of a dielectric and being t thick. The terminals (11a, 11b) of the first coupler pattern (11) serve as unbalanced terminals, and the terminals (12a, 12b) of the second coupler pattern (12) serve as unbalanced terminals from which coplanar lines (41, 42) are led out along the rear surface and connected with a balanced antenna (5). Since the first and second coupler patterns (11, 12) are kept in an electrostatic capacity coupling state as well as in a magnetic induction coupling state, the coupler high in transmission efficiency in a broad band can be realized.

A transmission line with a bending portion is provided, which line comprises any one of a coplanar line, another coplanar waveguide line formed on the dielectric substrate under which a ground layer is provided and a coplanar strip line. A chamfered portion is provided on the outer angular portion of the bending portion of the signal wiring conductor and a triangular conductor is disposed to an inner angular portion thereof. Given that length of the chamfered portion is defined as a, and length of the wiring edge side of the triangular conductor is defined as b and width of the signal wiring conductor is defined as c, it is arranged such that a is greater than b+c×square root of 2. Thereby, a transmission line or an optical module of smaller reflection loss at the bending portion thereof and of improved high-frequency characteristics is provided.

A multielement planar antenna has a substrate, a plurality of antenna element pairs disposed on a first main surface of said substrate, each of the antenna element pairs including first and second antenna elements each made of a circuit conductor, a metal conductor disposed on a second main surface of the substrate, and a slot line defined in the metal conductor. Each of the antenna element pairs has a microstrip line interconnecting the first and second antenna elements. The slot line crosses the microstrip lines and is electromagnetically coupled to the microstrip lines for feeding the first and second antenna elements. The slot line is fed at its central area by a microstrip line or a coplanar line.

A design of a vertical cavity surface emitting laser chip suitable for high speed data communication. An intracavity contact to the doped layers of the bottom mirror is formed so that both contacts are on the top epitaxial side of the wafer. These main structural features can be used to reduce the bond pad capacitance by a suitable spatial separation of metallizations of the p and n contact. The bond pads are processed as a short symmetric coplanar line in a ground signal ground configuration which allows flexible device testing and packaging. A significant capacitance between the pads of the center strip and the outer ground strips is avoided by etching the doped semiconductor layers between these strips down to the semi-insulating substrate. This design avoids pad metallizations and the corresponding critical photolithographic steps over large height differences from the vertical cavity surface emitting laser mesa top to the substrate. This insures good lithographic fidelity and makes the process reproducible.

The invention relates to a ferro-electricity film phase shifter, pertaining to the field of microwave engineering technology, which comprises a coplanar line structure that comprises a transmission line constituted by a general conductive film and ground planes on both sides thereof. Aequilate slots are arranged between the ground planes and the transmission line, interdigited capacitor structures are arranged mutually and periodically on the transmission line and the ground planes on both sides thereof, the conductive film is directly fixed on to the substrate of an underlay, and ferro-electricity films are provided in the slots between the mutually interdigited transmission line and the ground planes. The intedigited capacitor structure of the invention places equal attention to advantages of simple manufacturing technology of a general intedigited capacitor and to that a parallel plate capacitor structure can highly concentrate impressed electric field into the ferro-electricity film, thus realizing the advantage of large phase shifting capacity under low voltage and having potential and broad practical prospect.

Fundamental interconnect systems for connecting high-speed electronics elements are provided. The interconnect systems consists of signal line, dielectric system with open trench or slot filled up with air or lower dielectric loss material, and the ground plane. The signal line could be for example, microstripline, strip line, coplanar line, single line or differential pairs. The interconnect system can be used for on-chip interconnects or can also be used for off-chip interconnects. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables.