20 results about "Coplanar lines" patented technology

An antenna element according to one embodiment of the present technology comprises a dielectric substrate, a conductor portion, a dielectric waveguide, a power supply portion, and a plurality of opening grooves. The conductor portion includes a line conductor layer provided along the dielectric substrate. In the dielectric waveguide, an end surface of the dielectric substrate serves as an antenna opening. The power supply portion is formed in the line conductor layer and comprises a coplanar line, a slot line that opens toward the dielectric waveguide, and a line converting portion that connects the coplanar line and the slot line. The plurality of opening grooves are formed in the conductor portion and are provided on both sides of the slot line so as to open toward the dielectric waveguide.

Exemplary embodiments are disclosed of automotive broadband transparent antennas. The transparent antennas can be, for example, configured for placement or application directly on vehicle glass or in between layers of vehicle glass, such as glass roofs, windshields, sunroofs, or other vehicle glass structures. In an exemplary embodiment, an antenna system can include a substrate with conductive structure, which can be formed, for example, of metal or other conductive material(s). A radiating area is formed of a conductive mesh or other structure that is windshield transparent or other vehicle glass transparent. The radiating element is in electrical communication with a connector. The connector can be, for example, coaxial cable, coaxial connector, coplanar lines, coaxial, coplanar, waveguide or conductive pad connector, FAKRA connector, HFM® connector, Mate-AX connector, other RF transfer means, or other appropriate connector for a given application. A ground area partially surrounds the radiating area. The ground area is formed of a conductive mesh or structure that is windshield transparent or other vehicle glass transparent.

Provided is an optical semiconductor device capable of reducing inductance. An optical semiconductor device (1) according to one embodiment includes a support member (10) having a first pattern (11) for signal transmission and a second pattern (12) having a reference potential that forms a coplanar line with the first pattern (11) on a surface; a modulator (21) having a first electrode (23) provided on a back surface (21c) and connected to the second pattern (12) of the support member (10), and a second electrode (24) provided on a surface (21b) and connected to the first pattern (11) of the support member (10); and a first connection portion (30) having one end connected to the second pattern (12) of the support member (10) and the other end connected to the first electrode (23) of the modulator (21), the surface (21b) of the modulator (21) and the surface (10b) of the support member (10) facing each other.

A multilayer substrate according to an embodiment of the present technology is provided with a plurality of conductor layers and an interlayer connection section. The plurality of conductor layers has a line conductor layer having a coplanar line and a pair of adjacent conductor layers neighboring the line conductor layer. The interlayer connection section has a plurality of columnar conductors connecting the plurality of conductor layers to each other. The multilayer substrate is such that, in a frequency band used by the coplanar line, a path of a return current is configured such that transmission loss due to the return current flowing through the columnar conductors between the coplanar line and the pair of adjacent conductor layers is prevented.

Embodiments of the present application provide a method, device, computer readable medium and equipment for calibrating a binocular camera. The method comprises: obtaining a first captured image and a second captured image captured by each camera for the same captured content; determining feature point information corresponding to each calibration image in the first captured image and the second captured image to determine target calibration information corresponding to the binocular camera, and determining a first conversion matrix and a second conversion matrix of each captured image to a coplanar line alignment plane; performing depth recognition on a face image to be detected included in each captured image to determine corresponding depth information; and comparing the depth information with an actual distance to determine whether a calibration result is valid. The technical solution of the embodiments of the present application can improve the calibration efficiency of the binocular camera and ensure the accuracy of the calibration result.

To suppress unstable operation caused by propagation in a substrate in a high-speed semiconductor device.SOLUTION: A semiconductor device includes a semiconductor substrate, a coplanar line, and a resistive film. The coplanar line includes a signal line formed on the front surface side of the semiconductor substrate and a ground metal. The resistive film is formed between the surface of the semiconductor substrate and the ground metal or between the surface of the semiconductor substrate and a region where no metal is present on the semiconductor substrate. The ground metal and the resistive film are insulated from each other.SELECTED DRAWING: Figure 1

A first signal lead pin is bent such that one end is connected to a first signal line of a differential coplanar line, and the other end is apart from a mounting surface. A second signal lead pin is bent such that one end is connected to a second signal line of the differential coplanar line, and the other end is apart from the mounting surface. A ground lead pin is bent such that one end is connected to a ground line of the differential coplanar line, and the other end is apart from the mounting surface.

Provided is a quantum device capable of suppressing reduction in performance of quantum bit even when a quantum chip is flip-chip mounted on an interposer. A quantum chip (10) is flip-chip mounted on an interposer (20) by a bump (30). A coplanar line (12) coupling adjacent quantum bits is formed on the quantum chip (10). A gap (22) is provided, in the interposer (20), at a location facing a center conductor (12a) of the coplanar line (12). A second ground electrode (24) is formed around gap (22). The interposer (20) has a connection electrode (40) connecting the second ground electrode (24) around the gap (22). A bump (30A) formed in the vicinity of the connection electrode (40) is connected to the first ground electrode (12b) and the second ground electrode (24).

The application discloses a kind of adjustment structure and adjustment method suitable for line structured light and line array camera coplanar, it is related to line array camera imaging light source is line structured light class technical field, adjustment structure includes: bottom plate;Line array camera and line structured light source are respectively arranged in the left and right ends of the bottom plate;Rotary adjustment mechanism for rotary adjustment to line structured light source, so that the light emitted by line structured light source and the light emitted by line array camera are parallel or coincident, the line structured light source is assembled on the rotary adjustment mechanism;Flip adjustment mechanism for flip adjustment to line structured light source, so that the light emitted by line structured light source and the light emitted by line array camera intersect or coincide, the rotary adjustment mechanism is assembled on the flip adjustment mechanism, and the flip adjustment mechanism is assembled on the bottom plate.The line structured light source is adjusted by the above-mentioned rotary adjustment mechanism and flip adjustment mechanism to meet the collinear requirement, and the adjustment coplanar mode is simple, and the adjustment work time is shortened.

The present invention provides a millimeter wave radio communication device that can be fabricated easily.　The millimeter wave radio communication device includes a first power feed circuit layer, an antenna layer, and a bonding part. The first power feed circuit layer includes: a first substrate made of glass or ceramic and having a first surface and a second surface; a metal layer provided on the second surface and having a first opening; and a first transmission line formed from a microstrip line, strip line, coplanar line, slot line, or post-wall waveguide formed on the first substrate. The antenna layer includes: a second substrate made of resin or glass and having a third surface and a fourth surface; and an antenna element which is formed on the fourth surface and which communicates in the millimeter-wave band. The bonding part bonds the metal layer provided on the second surface of the first substrate of the first power feed circuit layer and the third surface of the second substrate of the antenna layer. The first opening and the antenna element are electrically coupled such that power can be fed from the first transmission line to the antenna element through the first opening.

This utility model discloses a wiring structure for PCB impedance lines, including a PP insulating layer and several PCB impedance lines evenly distributed above or below the PP insulating layer. The PCB impedance lines are straight lines, and the angle between the wiring direction of the PCB impedance lines and the warp or weft yarn bundles of the fiberglass cloth in the PP insulating layer is 4-6°. This utility model effectively solves the problem in the prior art where the impedance value of the PCB impedance lines is greatly affected by dielectric constant fluctuations and is prone to failure because they are perpendicular or parallel to the warp and weft directions of the PP fiberglass cloth.

An optical modulator includes: a substrate; a coplanar line, on the substrate, including a first ground wire, a second ground wire, and a signal wire, between the first ground wire and the second ground wire, coupled to each of the first ground wire and the second ground wire; a waveguide, between the first ground wire and the signal wire along the coplanar line on the substrate in plan view of the substrate, including an input portion and an output portion for an optical signal, the output portion configured to output an optical signal input from the input portion and modulated using a signal that propagates along the coplanar line; and an adjustment member, between the second ground wire and the signal wire along the coplanar line on the substrate in plan view of the substrate, not including an input portion or an output portion for an optical signal.

According to the present invention, one end of a first signal pin (106) is connected to a first signal line (103) of a differential coplanar line (102), and the other end is bent away from a mounting surface. One end of a second signal pin (107) is connected to a second signal line (104) of a differential coplanar line (102), and the other end is bent away from the mounting surface. One end of a ground pin (108) is connected to a ground line (105) of the differential coplanar line (102), and the other end is bent away from the mounting surface.

A transmission line comprises: a first transmission line having a signal line conductor; a second transmission line having a signal line conductor formed in a layer different from that of the signal line conductor of the first transmission line; and a connection portion having a connection via for electric interlayer connection of the signal line conductors, wherein the first transmission line is a microstrip line having the signal line conductor and a ground conductor, the second transmission line is a coplanar line having the signal line conductor and two ground conductors formed to sandwich the signal line conductor, and the connection portion includes two ground connection conductors electrically connected to each of the ground conductor of the first transmission line and the two ground conductors of the second transmission line so as to surround a part of at least one of the signal line conductors and the connection via in a plan view.

A transmission line (1) includes: a first transmission line including a signal line conductor (11); a second transmission line including a signal line conductor (21) formed in a layer different from the signal line conductor (11); and a connection part (30) including a signal line narrow section (31) that is connected to an end (E12) of the signal line conductor (11) and is narrower than each of the signal line conductor (11) and the signal line conductor (21), and a connection via (33) that interlayer connects the signal line conductor (11) and the signal line conductor (21) via the signal line narrow section (31). The first transmission line is a microstrip line that includes the signal line conductor (11) and a ground conductor (12), and the second transmission line is a coplanar line that includes the signal line conductor (21) and ground conductors (22a, 22b) formed so as to sandwich the signal line conductor (21).

A microwave diplexer intended for miniature satellites incorporates an antenna port (1), a transmitting port (2), a receiving port (3), and a transmitting filter (4) in between the transmitting port (2) and the antenna port (1), as well as a receiving filter (5) in between the receiving port (3) and the antenna port (1). All ports (1, 2, 3) and both filters (4, 5) of the diplexer are shaped on a single common printed circuit board (10) featuring a dielectric substrate (11) with the first and second metallization layer (12, 13) on its both sides, and metal delimiting structures (14) on the side walls of the printed circuit board (10). The transmitting filter (4) and the receiving filter (5) are bandpass filters of the substrate-integrated waveguide structure, and each of the filters is formed of hexagonal cavities (20) delimited with metallization layers (12, 13) of the printed circuit board (10) and the side walls in the form of metallized via-holes (15) between the metallization layers (12, 13). The hexagonal cavities (20) are connected to one another with windows (31) in the lines of metallized via-holes (15) and non-conducting slots (32) in the metallization layers (12, 13), where the slots are formed on the selected neighbouring side walls of the hexagonal cavities (20). The antenna port (1), transmitting port (2), and receiving port (3) take the form of coplanar lines formed on the printed circuit board (10) between its edges and the side walls of the hexagonal cavities (20), where the walls serve as the inlets and outlets for both filters (4, 5). The coplanar lines are connected with these hexagonal cavities (20) via the inlet slots (33) in the form of non-conducting lines in the metallization layer, where the transmitting filter (4) and the receiving filter (5) are separated from each other with an electromagnetic barrier in the form of complementary lines of metallized via-holes (15).

The invention relates to an electro-optical Mach-Zehnder modulator (1) comprising an input divider, first and second main waveguides (10p, 20p), and an output combiner (3). It also includes a first coplanar RF line (30) associated with the first main waveguide (10p). Finally, it includes a first additional waveguide (10a), not coupled to the input divider (2) and the output combiner (3), and having a positioning relative to a central track (33), dimensions, and doping profile symmetrical to those of the first main waveguide (10p), with respect to a plane of symmetry (Ps) orthogonal to the main plane (XY), parallel to the first main (10p) and additional (10a) waveguides, and passing through a center of the central track (33). Figure for the abstract: Fig. 2A

Provided is a high-frequency circuit board which suppresses loss in a transmission mode conversion from a microstrip line to a coplanar line and can be manufactured through a simple process. A high-frequency circuit board according to the present disclosure comprises: a ground layer; a dielectric layer formed on the ground layer; a line including N layers of strip lines formed on the dielectric layer; and laminated ground conductors installed on the same plane as the strip lines of each of the second to N-th layers among the N layers of strip lines and on both sides, in the propagation direction of a high-frequency signal, of the strip lines of each of the second to N-th layers. In a cross section orthogonal to the propagation direction of the high-frequency signal, the intensity of an electric field generated in the ground layer from the lines and an electric field generated in the laminated ground conductors from the lines gradually change in N stages.

An optical modulator includes: a substrate; a coplanar line, on the substrate, including a first ground wire, a second ground wire, and a signal wire, between the first ground wire and the second ground wire, coupled to each of the first ground wire and the second ground wire; a waveguide, between the first ground wire and the signal wire along the coplanar line on the substrate in plan view of the substrate, including an input portion and an output portion for an optical signal, the output portion configured to output an optical signal input from the input portion and modulated using a signal that propagates along the coplanar line; and an adjustment member, between the second ground wire and the signal wire along the coplanar line on the substrate in plan view of the substrate, not including an input portion or an output portion for an optical signal.

This signal line comprises: a microstrip line that has a second signal conductor and a third ground conductor facing the second signal conductor, and is connected to a coplanar line; a fourth ground conductor positioned at a side of the second signal conductor and on a side of a connection portion between the microstrip line and the coplanar line in a plan view; and a plurality of second via conductors positioned so as to bridge the fourth ground conductor and the third ground conductor. When a distance between the second signal conductor and the third ground conductor is referred to as a first distance, a longitudinal direction of the second signal conductor is referred to as a Y direction, and a direction orthogonal to the Y direction in the plan view is referred to as an X direction, there is a gap between the second signal conductor and the fourth ground conductor, the gap having a width in the X direction of 90% or more of the first distance.