Thermosetting resin composition as well as prepreg and laminated board made from thermosetting resin composition

A technology of resin composition and prepreg, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problems of poor solubility of polyphenylene ether resin, low dielectric constant and dielectric loss factor, and stable size Poor properties and other problems, to achieve the effect of improving dielectric properties, low dielectric constant, excellent adhesion

Active Publication Date: 2014-02-05
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, polyphenylene ether resins with large molecular weight (>10000g / mol) have problems such as poor solubility, poor compatibility with epoxy resins, and high melt viscosity, resulting in insufficient heat resistance, low adhesion, and Poor dimensional stability and other phenomena seriously affect its reliability
Chinese invention patent application CN201110456600.5 discloses a thermosetting resin composition containing phosphorus-containing low-molecular-weight polyphenylene ether resin, epoxy resin, and cyanate resin. Laminates with low dissipation factor, but their peel strength is low (≤1.0N / mm), which cannot meet the manufacturing process requirements of high-performance electronic substrate materials

Method used

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  • Thermosetting resin composition as well as prepreg and laminated board made from thermosetting resin composition
  • Thermosetting resin composition as well as prepreg and laminated board made from thermosetting resin composition
  • Thermosetting resin composition as well as prepreg and laminated board made from thermosetting resin composition

Examples

Experimental program
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Effect test

Synthetic example 1

[0049] According to the mass ratio, take 100 parts of biphenyl type epoxy resin (NC-3000, Nippon Kayaku) and dissolve it in 100 parts of butanone (MEK), the molar ratio of maleic anhydride and styrene monomer is 0.3: 1. The total mass of maleic anhydride and styrene monomer is 50 parts.

[0050] First dissolve 0.5 parts of benzoyl peroxide (BPO) in styrene, then add maleic anhydride and styrene monomer dissolved in BPO to the MEK solution of biphenyl epoxy resin NC-3000, at 40 Stir at ℃ until the maleic anhydride is completely dissolved; finally, raise the temperature to 90 ℃ and react for 4 hours to obtain a modified epoxy resin containing styrene-maleic anhydride copolymer. Its molecular weight is 500-7000g / mol and its epoxy equivalent is 410g / eq as tested by GPC method.

Synthetic example 2

[0052] According to the mass ratio, take 100 parts of dicyclopentadiene epoxy resin (XD-1000, Nippon Kayaku) and dissolve it in 100 parts of butanone (MEK), glycidyl methacrylate and styrene monomer The molar ratio is 0.2:1, and the total mass of glycidyl methacrylate and styrene monomer is 100 parts.

[0053] First dissolve 2 parts of dicumyl peroxide (DCP) in styrene, then add glycidyl methacrylate and styrene monomer dissolved in DCP into dicyclopentadiene epoxy resin XD-1000 In the MEK solution, stir evenly at 60°C; finally, raise the temperature to 120°C and react for 6 hours to obtain a modified epoxy resin containing styrene-glycidyl methacrylate copolymer. The molecular weight is 800-6300g / mol and the epoxy equivalent is 550g / eq by GPC method.

Synthetic example 3

[0055] According to the mass ratio, take 100 parts of o-methyl novolac epoxy resin (N-695, Japan DIC) and dissolve it in 100 parts of butanone (MEK), the molar ratio of methacrylic acid and styrene monomer is 1: 1. The total mass of methacrylic acid and styrene monomer is 130 parts.

[0056] First dissolve 5 parts of azobisisobutyronitrile (AIBN) in styrene, then add methacrylic acid and styrene monomer dissolved in AIBN to the MEK solution of o-methyl novolac epoxy resin N-695, Stir evenly at 50° C.; finally, heat up to 80° C. and react for 8 hours to obtain a modified epoxy resin containing styrene-methacrylic acid copolymer. The molecular weight is 450-8200g / mol and the epoxy equivalent is 480g / eq by GPC method.

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Abstract

The invention discloses a thermosetting resin composition, comprising the following components by solid weight: (a) 5-80 parts of modified epoxy resin, (b), 5-80 parts of cyanate ester resin, (c) 5-70 parts of polyphenyl ether resin, (d) 0-50 parts of fire retardant, (e) 0-100 parts of inorganic filler, and (f) 0-5 parts of curing accelerator; the preparation method of the modified epoxy resin comprises the following steps: adding one or a plurality of double bond containing unsaturated monomers in which an initiator is dissolved in the epoxy resin, heating to 30-60 DEG C, uniformly stirring, and then warming to 60-150 DEG C, reacting for 2-8 hours. The modified epoxy resin is used as the main body, the cyanate ester resin and the polyphenyl ether resin are used as a composite curing agent, so that the humidity resistance of the cyanate ester resin and dielectric property of the system are effectively improved, the unexpected effect is obtained, and the prepreg and laminated board with excellent performance are obtained.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a thermosetting resin composition, a prepreg and a laminate made by using the composition. Background technique [0002] For a long time, epoxy resin has been widely used in FR-4 laminates due to its comprehensive advantages such as wide source of raw materials, good processability, and low cost. However, with the high-speed and high-frequency increase in information processing and information transmission in recent years, higher requirements have been placed on the dielectric properties of laminates for printed circuits. To put it simply, the laminate material needs to have low dielectric constant and dielectric loss to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. However, the dielectric constant and dielectric loss of ordinary epoxy resin substrate materials (FR-4 copper clad laminates) are relativ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L51/08C08L79/04C08L71/12C08F283/10B32B15/08B32B27/04
Inventor 马建何继亮黄荣辉崔春梅肖升高王钧段华军
Owner SHENGYI TECH SUZHOU
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