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Thermosetting resin composition, as well as prepreg and laminated board manufactured by using same

A technology of resin composition and prepreg, which is applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., and can solve the problem of degradation of heat and humidity resistance of cyanate ester resin, poor heat and humidity resistance and toughness, and dielectric properties Poor problems, achieve low dielectric constant, excellent performance, and improve the effect of dielectric properties

Inactive Publication Date: 2013-09-11
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] On the other hand, cyanate ester resin has excellent dielectric properties, heat resistance and low water absorption, but poor heat and humidity resistance and toughness, which limits its application in high-performance printed circuit board substrates
For example, in the literature (Research Progress of Epoxy Resin Modified Cyanate Resin, Thermosetting Resins, September 2007, 22 (5), P38-44), it is disclosed that the epoxy resin is used to toughen the modified cyanate resin; however , while improving the toughness, ordinary epoxy resins have poor dielectric properties and high water absorption, which will further deteriorate the heat and humidity resistance of cyanate ester resins

Method used

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  • Thermosetting resin composition, as well as prepreg and laminated board manufactured by using same
  • Thermosetting resin composition, as well as prepreg and laminated board manufactured by using same
  • Thermosetting resin composition, as well as prepreg and laminated board manufactured by using same

Examples

Experimental program
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Effect test

Synthetic example 1

[0037] According to the mass ratio, take 100 parts of biphenyl type epoxy resin (NC-3000, Nippon Kayaku) and dissolve it in 100 parts of butanone (MEK), the molar ratio of maleic anhydride and styrene monomer is 0.3: 1. The total mass of maleic anhydride and styrene monomer is 50 parts. First dissolve 0.5 parts of benzoyl peroxide (BPO) in styrene, then add maleic anhydride and styrene monomer dissolved in BPO to the MEK solution of biphenyl epoxy resin NC-3000, at 40 Stir at ℃ until the maleic anhydride is completely dissolved; finally, raise the temperature to 90 ℃ and react for 4 hours to obtain a modified epoxy resin containing styrene-maleic anhydride copolymer.

Synthetic example 2

[0039] According to the mass ratio, take 100 parts of dicyclopentadiene epoxy resin (XD-1000, Nippon Kayaku) and dissolve it in 100 parts of butanone (MEK), glycidyl methacrylate and styrene monomer The molar ratio is 0.2:1, and the total mass of glycidyl methacrylate and styrene monomer is 100 parts. First dissolve 2 parts of dicumyl peroxide (DCP) in styrene, then add glycidyl methacrylate and styrene monomer dissolved in DCP into dicyclopentadiene epoxy resin XD-1000 In the MEK solution, stir evenly at 60°C; finally, raise the temperature to 120°C and react for 6 hours to obtain a modified epoxy resin containing styrene-glycidyl methacrylate copolymer.

Synthetic example 3

[0041]According to the mass ratio, take 100 parts of o-methyl novolac epoxy resin (N-695, Japan DIC) and dissolve it in 100 parts of butanone (MEK), the molar ratio of methacrylic acid and styrene monomer is 1: 1. The total mass of methacrylic acid and styrene monomer is 130 parts. First dissolve 5 parts of azobisisobutyronitrile (AIBN) in styrene, then add methacrylic acid and styrene monomer dissolved in AIBN to the MEK solution of o-methyl novolac epoxy resin N-695, Stir evenly at 50° C.; finally, heat up to 80° C. and react for 8 hours to obtain a modified epoxy resin containing styrene-methacrylic acid copolymer.

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Abstract

The invention discloses a thermosetting resin composition. The thermosetting resin composition comprises the following components in parts by solid weight: (a) 5-80 parts of modified epoxy resin; (b) 5-80 parts of cyanate ester resin; (c) 0-50 parts of fire retardant; (d) 0-100 parts of inorganic filler; and (e) 0-5 parts of curing accelerator. A preparation method of the modified epoxy resin comprises the following steps of: adding one or more of unsaturated monomers which have double bonds and in which an initiator is dissolved into the epoxy resin; heating to 30-60 DEG C and stirring uniformly; and then, heating to 60-150 DEG C, and performing a reaction for 2-8 hours. According to the thermosetting resin composition disclosed by the invention, the unsaturated monomers with double bonds are added into the epoxy resin for modification, therefore, compared with the traditional epoxy resin composition prepared by simple blending, the thermosetting resin composition disclosed by the invention has more excellent cohesiveness, thermal stability and wet and heat resistance; and a laminated board manufactured by using cyanate ester as a curing agent has low dielectric constant, low dielectric loss, high heat resistance and good wet and heat resistance.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a thermosetting resin composition, a prepreg and a laminate made by using the composition. Background technique [0002] For a long time, epoxy resin has been widely used in FR-4 laminates due to its comprehensive advantages such as wide source of raw materials, good processability, and low cost. However, with the high-speed and high-frequency increase in information processing and information transmission in recent years, higher requirements have been placed on the dielectric properties of laminates for printed circuits. To put it simply, the laminate material needs to have low dielectric constant and dielectric loss to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. However, the dielectric constant and dielectric loss of ordinary epoxy resin substrate materials (FR-4 copper clad laminates) are relativ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L51/08C08L79/04C08F283/10B32B27/06B32B15/08
Inventor 马建何继亮肖升高王钧段华军黄荣辉
Owner SHENGYI TECH SUZHOU
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