Heat setting resin compsns. and its use

A resin composition, thermosetting technology, applied in the direction of synthetic resin layered products, electrical components, layered products, etc., can solve insufficient performance such as high moisture resistance and high adhesion, low dielectric loss, insufficient performance, etc. question

Inactive Publication Date: 2002-09-18
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, none of them have sufficient performance required for finer patterns and higher frequency signals, that is, low dielectric loss, high heat resistance, high moisture resistance, and high adhesion to copper foil. Insufficient performance

Method used

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  • Heat setting resin compsns. and its use

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0046] Below, the present invention is further described in detail through the following examples, but these examples do not limit the present invention in any sense. Parts in the following examples represent parts by weight unless otherwise specified. Synthesis Example 1: Component (1): Preparation of Copolymer Resin Solution (1-1)

Synthetic example 2

[0047] In a heatable and coolable 2-liter reaction vessel equipped with a thermometer, a stirring device and a reflux condenser, a copolymer resin obtained by styrene and maleic anhydride (manufactured by Elf Atochem: trade name SMA1000: in formula (X) , m / n=1.3, weight average molecular weight: 8,000) 410g and cyclohexanone 273g, heated to 150-160°C, and refluxed for 24 hours. Then, it cooled to about 100 degreeC, and 398 g of toluene was added, and the copolymer resin solution (solid content: 38 weight%) (1-1) was obtained. Synthesis Example 2: Component (1): Preparation of Copolymer Resin Solution (1-2)

Synthetic example 3

[0048] In a heatable and coolable 2-liter reaction vessel equipped with a thermometer, a stirring device and a reflux condenser, a copolymer resin obtained by styrene and maleic anhydride (manufactured by Elf Atochem: trade name SMA2000: in formula (X) , m / n=2.0, weight average molecular weight: 9,000) 410g and cyclohexanone 273g, heated to 150-160°C, and refluxed for 24 hours. Then, it cooled to about 100 degreeC, and 398 g of toluene was added, and the copolymer resin solution (solid content: 39 weight%) (1-2) was obtained. Synthesis Example 3: Component (1): Preparation of Copolymer Resin Solution (1-3)

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Abstract

A thermosetting resin composition comprising (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): <CHEM> wherein R<1> represents hydrogen, a halogen, or a C1-C5 hydrocarbon group; R<2> represents a halogen or a C1-C5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number, and (2) a cyanate resin having at least two cyanate groups per molecule. To provide a printed wiring board material and a printed wiring board for electronic appliance, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.

Description

technical field [0001] The present invention relates to a thermosetting resin composition and a prepreg and laminate for electrical insulating materials using the composition. Background technique [0002] As printed wiring boards for electronic devices, laminated boards mainly using epoxy resins are widely used. However, with the increase in the mounting density of electronic equipment, the miniaturization of the pattern, the fixation of the surface mounting method, the increase of the signal propagation speed and the high frequency of the operation signal, there is a strong demand for the low dielectric loss of the printed circuit board material. and improved heat resistance. [0003] An epoxy resin is made into a curing agent, and an example of a resin composition or a laminate using a copolymer resin composed of styrene and maleic anhydride is described in JP-A-49-109476, for example, in order to impart flexibility by reacting Flexible epoxy diluent and acrylonitrile-b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L25/08C08L35/06C08L63/00C08L79/04H05K1/03
CPCC08L35/06C08L63/00C08L79/04H05K1/0353Y10T428/31855Y10T428/31938C08L2666/02C08L2666/20C08L35/00C08L25/08
Inventor 土川信次小林和仁水野康之藤本大辅高野希
Owner RESONAC CORPORATION
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