Halogen-free thermosetting resin composition, prepreg and metal clad foil laminated plate manufactured by using same

A technology of resin composition and prepreg, which is applied in the direction of metal layered products, synthetic resin layered products, layered products, etc., and can solve the problems that cannot meet the requirements of halogen-free environmental protection.

Inactive Publication Date: 2010-12-29
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Belgian Patent No. 627887, U.S. Patent No. 6509414, German Patent No. 3839105, Chinese Patent No. 101602881, No. 101481490, No. 1955219, etc. have reported styrene-maleic anhydride oligomers to cure epoxy resins, although they can be obtained Good dielectric properties, but these examples all use halogen-containing resins or additives, which cannot meet the requirements of halogen-free environmental protection

Method used

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  • Halogen-free thermosetting resin composition, prepreg and metal clad foil laminated plate manufactured by using same
  • Halogen-free thermosetting resin composition, prepreg and metal clad foil laminated plate manufactured by using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Using 35 parts by weight of SMA3000 styrene-maleic anhydride copolymer, 5 parts by weight of DOPO-HQ, 60 parts by weight of XZ92530, 25 parts by weight of PX200 and supplemented with catalyst 2-PI, using 120 parts by weight of MEK to convert the above The compound is dissolved and formulated into a glue of suitable viscosity. Use 2116-type electronic grade glass cloth to soak the above glue solution, and bake in an oven at 155°C for 5 minutes to remove the solvent, and obtain a B-stage prepreg sample.

[0042] Eight prepregs prepared above and two one-ounce electrolytic copper foils were stacked together, and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: 1. When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0°C / min; 2. The pressure is set at 20kg / cm 2 ; 3. The curing temperature is 190°C, and keep this temperature for 90 minutes. The corresponding properties are shown i...

Embodiment 2

[0044] Use 25 parts by weight of SMA3000 styrene-maleic anhydride copolymer, 10 parts by weight of SMA4000 styrene-maleic anhydride copolymer, 15 parts by weight of DOPO-NQ, 35 parts by weight of XZ92530, 20 parts by weight of N695, 25 parts by weight Parts by weight of PX200 supplemented with catalyst 2-PI, using 120 parts by weight of MEK to dissolve the above compounds, and prepare a glue solution with a suitable viscosity. Use 2116-type electronic grade glass cloth to soak the above glue solution, and bake in an oven at 155°C for 5 minutes to remove the solvent, and obtain a B-stage prepreg sample.

[0045]Eight prepregs prepared above and two one-ounce electrolytic copper foils were stacked together, and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are as follows: 1. When the material temperature is 80-120°C, the heating rate is controlled at 1.0-3.0°C / min; 2. The pressure is set at 20kg / cm 2 ; 3. The curing temperatur...

Embodiment 3

[0047] Use 30 parts by weight of SMA4000 styrene-maleic anhydride copolymer, 5 parts by weight of DOPO-HQ, 50 parts by weight of XZ92530, 10 parts by weight of DOPO-NQ, 5 parts by weight of HF-1, and 25 parts by weight of PX200 Add catalyst 2-PI and zinc naphthenate, use 100 parts by weight of MEK to dissolve the above compounds, and prepare a glue solution with a suitable viscosity. Use 2116-type electronic grade glass cloth to soak the above glue solution, and bake in an oven at 155°C for 5 minutes to remove the solvent, and obtain a B-stage prepreg sample.

[0048] Eight prepregs prepared above and two one-ounce electrolytic copper foils were stacked together, and laminated by a hot press to obtain a double-sided copper-clad laminate. The lamination conditions are the same as in Example 1, and the corresponding properties are shown in Table 1.

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Abstract

The invention relates to a halogen-free thermosetting resin composition, and a prepreg and a metal clad foil laminated plate manufactured by using the same. The halogen-free thermosetting resin composition comprises the following components in part by weight: 10 to 70 parts of bifunctional or multi-functional epoxy resin with a halogen-free molecular structure, 10 to 60 parts of styrene-maleic anhydride copolymer and 3 to 20 parts of co-curing agent, wherein the co-curing agent is halogen-free phenolic compound or phenolic resin. The prepreg manufactured by using the halogen-free thermosetting resin composition comprises a base material and the halogen-free thermosetting resin composition attached to the base material after impregnation drying. The metal clad foil laminated plate manufactured by using the halogen-free thermosetting resin composition comprises a plurality of layers of mutually overlapped prepregs and a metal foil pressed on one side or two sides of the overlapped prepregs, wherein each prepreg comprises the base material and the halogen-free thermosetting resin composition attached to the base material after impregnation drying.

Description

technical field [0001] The invention relates to a thermosetting resin composition, in particular to a halogen-free thermosetting resin composition, a prepreg and a metal foil-clad laminate made by using the composition. Background technique [0002] With the rapid development of electronic and electrical products in the world, the environmental hazards of electronic and electrical product waste and toxic substances in electronic and electrical products are becoming more and more serious. In order to achieve excellent flame retardancy, existing electronic materials usually use bromine-containing epoxy resin or bromine-containing flame retardants. They will produce a lot of suffocating smoke during combustion. Some brominated flame retardants are used in Carcinogens such as dioxins and dibenzofurans are also produced during combustion. On July 1, 2006, the EU's two directives "Directive on Waste Electrical and Electronic Equipment" and "Directive on the Restriction of the Use...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L63/04C08G59/62C08G59/42B32B15/092B32B15/14B32B27/12
Inventor 苏民社陈勇
Owner GUANGDONG SHENGYI SCI TECH
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