Chemical copper plating solution and technique thereof

Abstract

A kind of chemical solution used to copperize, the following are the weight percent of the major components of it: blue vitriod0.8-3, Fe vitriol 0-0.5, complex agent 3-6, sodium hypophosphorous acid 4-6, ammonia sulfate 0.5-1, sulfourea 0-0.01. The following is the procedure of the copper coating method with the above copper coating solution: to widen and activate the plastic board->to clean->to make it electric->to clean->to coat nickel-copper alloy on it by chemical method. The following are the content of the chemical method: the plastic pretreated according the above description will be immersed in the above chemical solution used to copperize, the pH of which has been adjusted to 10-13 by vitriol and stranger ammonia water, the working temperature of it is 20-70deg.C, the time to copperize is 5-20 minutes. The chemical solution used to copperize in this patent does not contain formaldehyde, it improve the working circumstance, and is easy to control, the cost of it is lower, and it own high economical benefit and society benefit.

Description

technical field

[0001] The invention relates to a surface treatment process, in particular to a novel electroless copper plating solution and process. Background technique

[0002] The traditional electroless copper plating process uses formaldehyde as a reducing agent, and EDTA and potassium sodium tartrate as a single or mixed complexing agent. Among them, the formaldehyde used has serious environmental pollution, and its smell is unpleasant, teratogenic, and carcinogenic. Mutagenicity, carcinogenicity. Therefore, to address this problem, some formaldehyde-free electroless copper plating solutions have been developed, however, most of the conventional formaldehyde-free electroless copper plating solutions have poor stability due to their high reactivity, and decompose quickly when used. Therefore need to develop the formaldehyde-free electroless plating solution with high stability, and use it can finish electroless copper plating process rapidly. Contents of the invent...