The invention discloses a preparation process of a high-thermal-
conductivity low-expansion electronic-grade modified amine hardener, and belongs to the technical field of heat-conducting materials.According to the amine hardener, 1, 6-dibromo
pyrene and nitrophenylboronic acid are subjected to
Suzuki reaction and nitro ring closing to prepare a macrocyclic
aromatic amine product B, and then 1-bromo-4-
iodobenzene-mediated Buchwald-Harwig
coupling is performed to obtain the high-thermal-
conductivity low-expansion electronic-grade modified amine hardener. And connecting the product B with
melamine to obtain the product. The plane rigidity of the main body macrocyclic
aromatic amine inhibits the disordered conformation change of molecules at high temperature and reduces the
phonon transfer loss; pi-Pi accumulation exists in a large-plane
benzene ring to form high
crystallinity, gaps can be reduced, and an efficient heat
conduction channel can be constructed; the polyfunctionality-NH-bond and
epoxy resin can form a three-dimensional cross-linked network, and a heat-conducting network penetrating through the
whole body is formed so as to improve the heat-conducting property;
thermal expansion is inhibited through cooperation of the rigid large ring pi-pi effect and the high crosslinking degree; and the polar-NH-bond also enhances the
adhesive force of the packaging layer to the substrate through the
hydrogen bond and the coordination bond of the
metal substrate.