Environmentally-friendly chemical gilding liquid
An environmentally friendly, chemical gold plating technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problem of easy erosion of printed circuit board solder mask substrate, subsequent component welding failure, and poor coating quality. Good and other problems, to achieve the effect of inhibiting the black disk phenomenon, improving the bonding force of nickel and gold, and long storage period
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Example Embodiment
[0026] Example 1
[0027] (1) Composition of chemical gold plating solution:
[0028] Gold sodium sulfite 2g / L, sodium sulfite 5g / L, sodium thiosulfate 15g / L, ethylenediamine 6g / L, disodium EDTA 5g / L, triethanolamine 2g / L, borax 15g / L.
[0029] Plating conditions: pH value is 6.0, temperature is 80 ℃.
[0030] (2) Test sample preparation:
[0031] The experimental substrate is glass fiber copper clad laminate, using such as figure 1 Test samples were prepared according to the process flow shown;
[0032] (3) Test items and requirements
[0033] The test items, test conditions and performance requirements for the samples prepared in Example 1 are shown in Table 1.
[0034] Table 1 Performance evaluation items, test conditions and requirements of electroless gold plating layer
[0035]
[0036]
[0037] Example 1 test results:
[0038] The appearance of gold-plated samples is bright and golden, and there is no overflow plating or leakage plating. The surface is den...
Example Embodiment
[0039] Embodiment 2
[0040] Chemical gold plating solution composition:
[0041] Gold sodium sulfite 2g / L, sodium sulfite 5g / L, sodium thiosulfate 10g / L, organic phosphonic acid (HEDP) 10g / L, malic acid 5g / L, 2-mercaptobenzothiazole 1g / L, dihydrogen phosphate Sodium 15g / L. Plating condition: pH value is 7.0, temperature is 80 ℃.
[0042] The preparation process of the test sample is the same as that of Example 1, and the test appearance and stability are all qualified. The plating thickness is 0.09μm in 10min, and the plating speed is faster. The coating adhesion and solderability tests of the bleaching tin test are qualified.
Example Embodiment
[0043] Embodiment 3
[0044] Chemical gold plating solution composition and process conditions:
[0045] Gold sodium sulfite 2g / L, sodium sulfite 20g / L, sodium thiosulfate 5g / L, sodium citrate 5g / L, disodium EDTA 10g / L, triethanolamine 1g / L, sodium dihydrogen phosphate 15g / L. Among them, the pH value is 6.5 and the temperature is 80°C.
[0046] The preparation process of the test sample is the same as that of Example 1. The properties of the sample and the plating solution are all qualified, and the plating thickness is 0.07 μm in 10 minutes.
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