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Environmentally-friendly chemical gilding liquid

An environmentally friendly, chemical gold plating technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problem of easy erosion of printed circuit board solder mask substrate, subsequent component welding failure, and poor coating quality. Good and other problems, to achieve the effect of inhibiting the black disk phenomenon, improving the bonding force of nickel and gold, and long storage period

Inactive Publication Date: 2014-10-22
广东致卓环保科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these baths still generally have problems such as poor stability and poor coating quality.
In addition, some displacement gold plating processes are alkaline plating solutions, which are easy to erode the solder mask substrate of the printed circuit board during the plating process, which may cause soldering failure of subsequent components

Method used

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  • Environmentally-friendly chemical gilding liquid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] (1) Composition of electroless gold plating solution:

[0028] Gold sodium sulfite 2g / L, sodium sulfite 5g / L, sodium thiosulfate 15g / L, ethylenediamine 6g / L, disodium edetate 5g / L, triethanolamine 2g / L, borax 15g / L.

[0029] Plating conditions: pH value is 6.0, temperature is 80°C.

[0030] (2) Test sample preparation:

[0031] The experimental substrate is glass fiber copper clad laminate, such as figure 1 The process flow shown prepares the test sample;

[0032] (3) Test items and requirements

[0033] Table 1 shows the test items, test conditions and performance requirements for the samples prepared in Example 1.

[0034] Table 1 Performance Evaluation Items, Test Conditions and Requirements of Electroless Gold Plating Layer

[0035]

[0036]

[0037] Embodiment one test result:

[0038] The appearance of the gold-plated sample is bright and golden, and there is no phenomenon of overflow plating or missing plating. Visually and under a microscope, the su...

Embodiment 2

[0040] Composition of chemical gold plating solution:

[0041] Gold sodium sulfite 2g / L, sodium sulfite 5g / L, sodium thiosulfate 10g / L, organic phosphonic acid (HEDP) 10g / L, malic acid 5g / L, 2-mercaptobenzothiazole 1g / L, dihydrogen phosphate Sodium 15g / L. Plating conditions: pH value is 7.0, temperature is 80°C.

[0042] The preparation process of the test sample is the same as in Example 1, and the test appearance and stability are all qualified. The plating thickness is 0.09μm in 10 minutes, and the plating speed is fast. Coating strength and solderability test of tin-floating test are qualified.

Embodiment 3

[0044] Chemical gold plating solution composition and process conditions:

[0045] Gold sodium sulfite 2g / L, sodium sulfite 20g / L, sodium thiosulfate 5g / L, sodium citrate 5g / L, disodium edetate 10g / L, triethanolamine 1g / L, sodium dihydrogen phosphate 15g / L. Wherein, the pH value is 6.5, and the temperature is 80°C.

[0046] The preparation process of the test sample is the same as that in Example 1. The properties of the sample and the plating solution are all qualified, and the plating thickness is 0.07 μm in 10 minutes.

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Abstract

The invention discloses an environmentally-friendly chemical gilding liquid. The environmentally-friendly chemical gilding liquid comprises 0.5-5g / L of non-cyanide gold salt, 5-30g / L of gold ion complexing agents, 5-20g / L of an impurity screener, 0.1-10g / L of a stabilizing agent and 15-35g / L of a pH buffering agent. The non-cyanide gold salt is sodium gold sulfide or auric-sodium chloride, a sulfite is used as the main complexing agent, and through combined action of the auxiliary complexing agent, the impurity screener and the stabilizing agent, long-term stabilization of production and storage is realized. The environmentally-friendly chemical gilding liquid does not adopt cyanides and cyanogen-containing substances, does not contain limited heavy metals such as lead and cadmium, has the characteristics of long storage life, high continuous production stability, good weldability, bright color and good corrosion resistance and weatherability, can satisfy functional electron electroplating requirements and can be used as a decorative gilding liquid.

Description

technical field [0001] The invention relates to the technical field of chemical gold plating solution applied to surface treatment. Background technique [0002] Electroless gold plating is a commonly used high-end surface treatment method. Compared with electroplating gold plating process, electroless gold plating has two outstanding advantages. One is that it does not need to be energized, and there is no need to connect wires to each point to be plated, and the uneven thickness of the coating will not be caused by the uneven distribution of current density; the other is that multiple plates to be plated can be placed in production at the same time The parts are in the plating tank, and the number of plates in the tank will not be limited due to the matching of cathode and anode, so as to achieve the purpose of increasing production capacity. [0003] The final surface treatment methods commonly used in the preparation of printed circuit boards include electroless nickel...

Claims

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Application Information

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IPC IPC(8): C23C18/44
Inventor 谢金平李冰范小玲李宁
Owner 广东致卓环保科技有限公司
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