Chemical copper plating solution, preparation method of chemical copper plating solution and nonmetal chemical plating method

An electroless copper plating and electroless plating technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of environment and operator injury, formaldehyde is not environmentally friendly, etc., to reduce leakage and overplating, The effect of short initiation cycle and good electroless plating activity

Active Publication Date: 2017-06-27
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the reducing agent used in the mainstream electroless copper plating solution on the market is formaldehyde. The plating solution using formaldehyde as the reducing agent is stable and the coating is bright. However, formaldehyde is not environmentally friendly, and its large-scale use in industry will cause harm to the environment and operators.

Method used

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  • Chemical copper plating solution, preparation method of chemical copper plating solution and nonmetal chemical plating method
  • Chemical copper plating solution, preparation method of chemical copper plating solution and nonmetal chemical plating method

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Embodiment approach

[0016] According to a preferred embodiment of the present invention, the preparation method of described electroless copper plating solution comprises the following steps:

[0017] Dissolve complexing agent in water, then add hydroxide, stir until dissolved; then add copper salt, stir until dissolved; then add accelerator and stir until dissolved; then add stabilizer and buffer, finally add reducing agent and high Stir the iodate ions until dissolved.

[0018] Preferably, when the pH value is controlled at 10-13, the electroless plating effect is the best.

[0019] The present invention also provides a method for electroless plating on a non-metallic surface, comprising activating the pretreated non-metallic substrate with an ionic palladium activation solution, then placing it in an ionic palladium reducing solution for reduction treatment, and finally immersing it in Perform electroless plating in an electroless copper plating solution; wherein, the electroless copper plati...

Embodiment 1~5

[0026] 1. Prepare electroless copper plating solution: dissolve complexing agent in water, add hydroxide, stir until completely dissolved, then add copper salt, stir until completely dissolved, then add nickel salt and stir until completely dissolved, then add Stabilizer and buffering agent, finally add reducing agent and periodate ion and stir until dissolved. Electroless copper plating solutions A1-A5 were obtained according to the composition ratio in Table 1. The specific dosage of each component is shown in Table 1.

[0027] 2. Put the 2×2cm ABS sample into the ionic activation solution at 25°C for 3 minutes after ultrasonic degreasing and chromic anhydride roughening. Activation solution of AD-457; after the activation is completed, immerse the plastic parts in the reducing solution for 1 min. The reducing solution is 1% hydrazine hydrate solution, and the reduction treatment temperature is 25°C; Electroless plating is performed in electroless copper plating solutions ...

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PUM

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Abstract

The invention relates to a chemical copper plating solution. The chemical copper plating solution is an aqueous solution containing soluble copper salt, a soluble hydroxide, a complexing agent, a stabilizer, an accelerant, a buffering agent and a reducing agent. The reducing agent is a methylene glycol compound and/or an alpha-diol compound. The invention further provides a preparation method of the chemical copper plating solution and a nonmetal surface chemical plating method adopting the chemical copper plating solution. The chemical copper plating solution has a better reduction effect and is good in stability and long in service life.

Description

technical field [0001] The invention relates to the technical field of electroless plating on non-metal surfaces, in particular to an electroless copper plating solution and a preparation method thereof, and a method for non-metal electroless copper plating. Background technique [0002] Electroless plating is a self-catalyzed chemical reaction, also known as self-catalyzed plating. Due to the excellent electrical conductivity and ductility of copper, electroless copper plating occupies a very important position in the field of electroless plating. Electroless copper plating began in 1947, and was commercially recognized in the 1950s. Until the 1960s and 1970s, the electroless copper plating technology made a major breakthrough, and high-efficiency stabilizers appeared and were applied on a large scale. At present, the reducing agent used in the mainstream electroless copper plating solution on the market is formaldehyde. The plating solution using formaldehyde as the reduc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40
CPCC23C18/40
Inventor 连俊兰韦家亮
Owner BYD CO LTD
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