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Electroless plating solution, preparation method and nonmetal electroless plating method

An electroless plating solution and electroless plating technology, applied in liquid electroless plating, metal material coating process, coating and other directions, can solve the problems of leakage plating and overflow plating, less activation center material, poor plating ability, etc. The effect of complete coating, short initiation cycle and fast plating speed

Active Publication Date: 2017-05-10
BYD CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The accuracy of the circuit formed in this way has been improved, and the adsorption capacity of the circuit pattern to the active substance has also increased to a certain extent, but the active center substance is still less, and the conventional chemical plating solution has poor plating ability on it, and the problem of missing plating and overflow plating is prone to occur.

Method used

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  • Electroless plating solution, preparation method and nonmetal electroless plating method
  • Electroless plating solution, preparation method and nonmetal electroless plating method

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preparation example Construction

[0019] The present invention also provides the preparation method of the electroless plating solution, first dissolving nickel salt and copper salt in water, then adding complexing agent, pH buffer agent, surfactant and dimethylformamide, and finally adding reducing agent, Stir until dissolved. Electroless plating works best when the pH is controlled between 8-9.

[0020] The present invention also provides a method for electroless plating on a non-metallic surface, comprising activating the pretreated non-metallic substrate with an ionic palladium activation solution, then placing it in an ionic palladium reducing solution for reduction treatment, and finally immersing it in The electroless plating is performed in an electroless plating solution; wherein, the electroless plating solution is the electroless plating solution provided by the present invention.

[0021] The electroless plating solution provided by the present invention has an excellent electroless plating effect...

Embodiment 1~6

[0029] 1. Preparation of electroless plating solution: dissolve nickel sulfate and copper sulfate in water, add complexing agent, stabilizer, pH buffering agent, reducing agent, and finally add dimethylformamide, and control the pH value at 8-9. According to the composition ratio in Table 1, the electroless plating solutions A1~A5 were obtained. The specific dosage of each component is shown in Table 1.

[0030] 2. Ultrasonically degrease a 2×2cm polycrystalline silicon wafer, and use a pretreatment slurry (the pretreatment slurry is composed of tetraisopropyl titanate, nickel acetylacetonate, ethyl maltol, and solvent ethyl acetate according to weight) ratio of 0.20:0.05:0.31:1 to form a slurry) to coat the surface of the silicon wafer, and then cover the surface of the silicon wafer with a mask. The mask includes a light-transmitting area and an opaque area. Form a circuit pattern inside, soak and wash off excess pretreatment slurry with a developing solution (the developin...

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Abstract

The invention relates to an electroless plating solution. The electroless plating solution is an aqueous solution containing nickel salt, copper salt, a complexing agent, a pH buffer, a surfactant, a reducing agent and dimethylformamide. The invention further provides a preparation method of the electroless plating solution and a nonmetal surface electroless plating method implemented with the electroless plating solution. The electroless plating solution has good reducing effect, better stability and long service life.

Description

technical field [0001] The invention relates to the technical field of electroless plating on non-metal surfaces, in particular to an electroless plating solution and a preparation method thereof, and a non-metallization plating method. Background technique [0002] Silicon wafer is the core component of solar cells. The two low-cost processes used in the production of silicon wafer positive grid lines are screen printing and electroplating, and the other is the PVD process that requires expensive vacuum equipment. The screen printing process is to print the paste containing metal on the silicon wafer through a mask, and then sinter to remove the binder in the paste, alloy the metal to the silicon contact surface, reduce the metal resistivity and increase the contact resistance. At present, a large number of The application is silver paste, and there is a technology monopoly in the industry, and the cost remains high. Although nickel, aluminum, and copper paste are possible...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/50
CPCC23C18/50
Inventor 韦家亮
Owner BYD CO LTD
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