63results about How to "Fast plating speed" patented technology

The invention discloses a high-speed electroplating luminous tin-plating electroplating liquid as well as a preparation method and application thereof. The high-speed electroplating luminous tin-plating electroplating liquid comprises the following raw materials calculated according to each liter of high-speed electroplating luminous tin-plating electroplating liquid: 120-200mL of tin methyl sulfonate, 100-175mL of 70 percent by weight methylsulfonic acid, 0.03-5g of brightening agent, 30-45g of conducting salt, 1-10g of grain refiner, 5-20g of antioxidant, 0.5-2g of wetting agent, 0.0005-0.001g of antifoaming agent and the balance water. The preparation method comprises the following steps of: dissolving the tin methyl sulfonate into the 70 percent by weight methylsulfonic acid; diluting the mixed solution with a proper amount of water; then adding the brightening agent, the conducting salt, the grain refiner, the antioxidant, the wetting agent and the antifoaming agent into the solution; and uniformly stirring and filtering to obtain filtrate, namely the high-speed electroplating luminous tin-plating electroplating liquid. The high-speed electroplating luminous tin-plating electroplating liquid disclosed by the invention has high coating speed, excellent dispersion capability and antifoaming capability and is suitable for a high-speed electroplating process.

The present invention is concerned with a plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus (170) has a plating tank (186) for holding a plating solution (188), a holder (160) for holding a workpiece (W) and bringing a surface to be plated of the workpiece into contact with the plating solution (188) in the plating tank (186), and a ring-shaped nozzle pipe (220) disposed in the plating tank (186) and having a plurality of plating solution injection nozzles (222) for injecting the plating solution (188) to the surface to be plated of the workpiece held by the holder (160) to supply the plating solution (188) into the plating tank (186).

The invention relates to a chemical Ni-P alloy-plating liquid and its process. The liquid is stable, works fast, has long service life, and does not contain chromium. So, it was widely used in industry. The Ni-P alloy coating is of fine corrosion-proof, containing 10-30g nickel sulfate, 20-40g sodium hypophosphite, 5-20g sodium acetate, 12-60g complexing agent and 0.002-0.01g complex stabilizer, with pH value of 4.5-5.0.

The invention discloses a preparation method of a Ni-SiC compound coating on the surface of an aluminum alloy. The preparation method adopts an anode type surfactant which is hexadecyl trimethyl ammonium bromide for replacing a cathode type surfactant which is lauryl sodium sulfate adopted by the invention at present. The preparation method is characterized by increasing the concentration of an anode activator NiCl2 while reducing current density and the concentration of silicon carbide in a plating solution, obtaining a fine and dense compound coating at an electroplating rate of 1-2 micron per minute, stirring by using air with volume flow being 4-7L/min and fully dispersing the silicon carbide, simultaneously adding CTAB to improve the wettability of the silicon carbide and obtain a fine and dense compound coating with high content of uniformly-dispersed silicon carbide. Through the preparation method of the Ni-SiC compound coating on the surface of the aluminum alloy, the technical problem of low tensile performance and low abrasion resistance of the aluminum alloy can be solved; the Ni-SiC compound coating with high adhesion strength, high content of uniformly-distributed hard silicon carbide particles, high hardness and high abrasion resistance can be prepared on the surface of the aluminum alloy.

The invention discloses a plating method of diamond driller through ultrasound, which is characterized by the following: exerting ultrasound in the plating course; adopting putting vibrating exchanger with bottom vibration pattern, lateral vibrating pattern and top vibrating pattern; setting the frequency scale of ultrasound at 20-50KHz and unit power factor scale at 0.5-2W/cm2; adopting the following plating liquid with 220-300g/l nickel sulfate, 15-25g/l cobalt sulfate, 30-40g/l boracic acid and 15-20g/l sodium chloride, wherein the temperature of plating liquid is 30-45 Deg C with pH value at 3.8-4.8 and current density at 4-10A/dm2.

The invention discloses tin plating electrolyte. The tin plating electrolyte comprises the following components 60 to 90g/L of tin methane sulfonate, 10 to 30g/L of tin sulfate, 110 to 140mg/L of p-cresolsulphonic acid, 60 to 120mg/L of sulfosalicylic acid, 30 to 50g/L of phosphinic acid, 45 to 70mg/L of 2,2-PySSPy, 15 to 25mg/L of 8-hydroxyquinoline, 20 to 30mg/L of catechins, 10 to 15g/L of 2,2-dihydroxy diethyl sulfide, 5 to 10mg/L of hexadecylpyridinium bromide, 8 to 12 g/L of dodecyl-phenol polyoxyethylene ether, 5 to 10g/L of ethylene glycol, 4 to 8g/L of benzalacetophenone, 5 to 10g/L of sodium hexametaphosphate, 4 to 8g/L of sodium dodecyl sulfate, and the balance of deionized water. According to the tin plating electrolyte, Sn2<+> can be effectively restrained to convert into Sn4 <+> in an electrolytic process by improving an electrolyte formula, and the stability of plating solution is improved; and meanwhile, the throwing power of the electrolyte is increased, and the luminance, the corrosion resistance and the welding performance of tin coatings are improved.

The invention discloses a method for plating double-layer zinc on the surface of a neodymium-iron-boron permanent magnet material, and belongs to the field of surface treatment of sintered neodymium-iron-boron permanent magnet materials. The method is characterized in that the method comprises the following steps: (1) deoiling the neodymium-iron-boron permanent magnet material; (2) cleaning the deoiled neodymium-iron-boron permanent magnet material, and then pickling the neodymium-iron-boron permanent magnet material; (3) activating the acid-washed neodymium-iron-boron permanent magnet material; (4) performing sulfate zinc electroplating on the neodymium-iron-boron permanent magnet material to form a bottom zinc layer; (5) performing potassium salt zinc plating on the neodymium-iron-boronpermanent magnet material to form a surface zinc layer; and (6) passivating the surface of the galvanized neodymium-iron-boron permanent magnet material. The neodymium, iron and boron treated by the method for plating the double-layer zinc on the surface of the neodymium-iron-boron permanent magnet material are excellent in corrosion resistance, the salt spray resistance experiment after passivation can reach more than 120 hours, the bonding strength of a galvanized layer and the neodymium-iron-boron permanent magnet material is improved, and the corrosion resistance of the galvanized layer isalso improved.

The invention discloses an electroplating solution circulation filtering device used in electroplating process, which comprises an electroplating tank, an electroplating solution filtering tank and a circulation system. tube; the electroplating solution filter tank is located below the electroplating solution discharge pipe, and a vertical partition and a horizontal filter plate are arranged on the electroplating solution filter tank; the circulation system includes a liquid inlet pipe, a suction pump and Liquid outlet pipe, the inlet of the liquid inlet pipe is located on the side wall of the post-filtration area in the electroplating solution filter tank, and the liquid outlet pipe extends into the electroplating tank. In the electroplating solution circulating filter device of the present invention, since the electroplating solution in the electroplating tank and the electroplating solution filter tank is filtered through the filter plate and then returns to the electroplating tank through the circulation system, a cyclic agitation is formed around the workpiece to be plated in the electroplating tank, thereby reducing the loss of the electroplating solution. Concentration polarization increases the upper limit of allowable cathode current density, effectively preventing solid particles from adhering to the workpiece to be plated and forming pinhole-like plating defects.

A packaging chip in which a circuit module is packaged and a method of packaging a circuit module are provided. The packaging chip includes a base wafer; a circuit module on the base wafer; a packaging wafer having a cavity and combined with the base wafer so that the circuit module fits inside the cavity; a connecting electrode connecting upper and lower surfaces of the cavity; and a seed layer between the connecting electrode and the packaging wafer. The method includes etching a lower surface of the packaging wafer to form a cavity, stacking a metal layer in an area of the lower surface, combining the base wafer with the packaging wafer, polishing the packaging wafer, forming a viahole through the packaging wafer, stacking a seed layer on the packaging wafer, plating the inside of the viahole, removing the seed layer and forming an electrode.

The invention discloses a preparation process of an acid-base compound Magni coating and relates to a metal surface antiseptic treatment process. The preparation process comprises the procedure of pretreatment conducted before coating, preparation of the coating and treatment conducted after coating, wherein the procedure of preparation of the coating comprises the steps of firstly, conducting potassium chloride galvanization on the surface of a workpiece, and then conducting zincate galvanization, wherein the steps of 21, potassium chloride galvanization, 22, washing III, 23, zincate galvanization, 24, washing IV, 25, film removal and 26, washing V are included; the procedure of treatment conducted after coating comprises the steps of 31, ultralow chromium passivation, 32, washing VI and 33, drying. According to the preparation process of the acid-base compound Magni coating, the potassium chloride galvanization process and the zincate galvanization process are combined together, product quality can be well stabilized, production efficiency is greatly improved, production line operation cost is lowered, the coating on the surface of a product prepared through the preparation process is uniform, surface quality is good, the preparation process has the advantages that the coating speed is high, drying can be conducted easily, product defects are few, the service life of the product is prolonged, the ultralow chromium passivation process is adopted, sewage treatment cost is lowered, and the preparation process is easy to use and popularize.

The invention provides novel chemical nickel plating equipment. The novel chemical nickel plating equipment comprises an acid and alkali corrosion resistant rack, an acid and alkali corrosion resistant polypropylene waste gas collecting cover, four hanger rotation control systems, an anode protection system and an acid and alkali corrosion resistant stainless steel arc bottom water bath type plating tank. The bottom of the plating tank is provided with a plurality of water outlets which are integrated on a pipe. An acid and alkali corrosion resistant polypropylene chemical nickel solution storage tank, an acid and alkali resistant nitric acid solution storage tank, an acid and alkali resistant high-temperature resistant stainless steel circulating pump, two acid and alkali resistant high-temperature resistant stainless steel filter cartridges, an acid and alkali resistant chemical nickel liquid medicine pumping pump, a nitric acid solution pumping pump, an acid and alkali resistant and high temperature-resistant stainless steel pipeline system and an artificial intelligence temperature control and variable frequency speed regulation electrical control system are arranged. According to the device, chemical plating operation can be carried out only by hanging a product on the rotary hook, so that the labor intensity of operators is reduced.

A circuit board comprising a resin molded article which includes a metal powder coated by an insulation film and a metal conductor which is formed by metal deposition over a circuit pattern drawn by laser beam irradiation on the surface of the resin molded article through electroless plating, and the method of producing the same.

The invention discloses a steel wire electrochemical copper plating process, and relates to the technical field of steel wire processing. The process is realized through the following steps: alkali washing, acid washing, water washing, electrochemical copper plating and post-plating treatment. By means of the process, a uniform, compact, flat, smooth and clean copper plating layer can be smoothlygenerated on the surface of a steel wire, and the process has the advantages of being high in electroplating efficiency, low in cost, simple in process and safe and non-toxic in plating solution.

The present invention relates to an electroplating method of terminal. Said method includes the following steps: 1. providing base material; 2. punching base material to obtain terminal and its material tape; and 3. electroplating terminal. It is characterized by that said terminal includes two portions of be electroplated, said two portions to be electroplated are respectively positioned in two sides of said material tape.