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Production process for preparing high-performance diamond wire saw

A diamond wire saw and production process technology, applied in metal material coating process, gaseous chemical plating, electrolytic coating and other directions, can solve the problems of slow electroplating speed, low mass percentage of diamond coating, agglomeration, etc., and achieve a long service life. Effect

Inactive Publication Date: 2009-12-02
CHANGSHA DIAT NEW MATERIAL SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since diamond is a non-conductor, during the electroplating process, the combination of diamond and nickel on the electroplating substrate is completed by the adsorption of diamond particles by steel wires, resulting in uneven distribution of diamond in the electroplating nickel substrate and serious agglomeration; diamond accounts for the mass of the coating. The percentage is low, and the electroplating speed is slow; especially, the combination of diamond and nickel matrix is ​​mechanical rather than metallurgical, and the matrix has a weak holding force on diamond particles, which makes the diamond easy to peel off during the cutting process, and the service life of the diamond wire saw is short.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The first step: diamond surface alloying

[0024] Get the average particle size of 15um, degrease through 10% Na(OH) aqueous solution, rinse with clear water, then pickle with 5% aqua regia to remove the diamond surface impurities and the average particle size of the diamond and the tungsten oxide of 3um by weight: diamond: Tungsten oxide 1:3.5 is evenly mixed and placed in a tube furnace and heated to 650°C~660°C, and hydrogen gas with a dew point of -25°C~-26°C is introduced into the tube furnace and kept for 0.5~0.6 hours; the diameter of the original steel wire 0.16mm, a layer of metal tungsten with a total thickness of 5um is formed on the surface of the diamond particles;

[0025] The second step: preparation of electroplating solution

[0026] Get the first step gained surface alloyed diamond and the Watt type nickel-plating solution by weight: diamond: nickel-plating solution=1.8: 100 mix to form diamond suspension;

[0027] Step 3: Plating

[0028] Place the...

Embodiment 2

[0030] The first step: diamond surface alloying

[0031] Take the average particle size of 70um, degrease through 10% Na(OH) aqueous solution, rinse with clear water, and then pickle with 5% aqua regia to remove the diamond surface impurities and the tungsten oxide with a particle size of 4.0 by weight: diamond: oxide Tungsten 1:3.0 is uniformly mixed and placed in a tube furnace and heated to 750°C~760°C, and hydrogen gas with a dew point of -29°C~-30°C is introduced into the tube furnace and kept for 0.9~1.0 hours; the diameter of the original steel wire is 0.18mm, a layer of metal tungsten with a total thickness of 3-5um is formed on the surface of diamond particles;

[0032] The second step: preparation of electroplating solution

[0033] Get the first step gained surface alloyed diamond and Watt type nickel plating solution by weight ratio: diamond: nickel plating solution=2.0: 100 mix to form diamond suspension;

[0034] Step 3: Plating

[0035]Place the electroplatin...

Embodiment 3

[0037] The first step: diamond surface alloying

[0038] Get average particle size and be 140um, degrease through 10%Na(OH) aqueous solution, rinse with clear water, then, pickle with 5% aqua regia, remove the diamond of diamond surface impurity and average particle size be the tungsten oxide diamond of 2.5um by weight: Tungsten oxide 1:3.2 is evenly mixed and placed in a tube furnace and heated to 890°C to 900°C, and hydrogen gas with a dew point of -34°C to -35°C is introduced into the tube furnace and kept for 1.9 to 2.0 hours; the diameter of the original steel wire 0.160mm, a layer of metal tungsten with a total thickness of 15um is formed on the surface of the diamond particles;

[0039] The second step: preparation of electroplating solution

[0040] Get the first step gained surface alloyed diamond and the Watt type nickel-plating solution by weight: diamond: nickel-plating solution=1.5: 100 mix and form diamond suspension;

[0041] Step 3: Plating

[0042] Place th...

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Abstract

The invention discloses a production process for preparing a high-performance diamond wire saw, which comprises the following steps: firstly, reacting diamond with tungsten oxide, water vapor and hydrogen at a temperature of between 65 and 900 DEG C to form a W-W2C layer on the surface of the diamond so as to realize surface alloyed tungsten of the diamond; secondly, preparing electroplating bath by the diamond of the surface alloyed tungsten and watt type nickel plating solution, and carrying out electroplating by using a nickel plate as an anode and a steel wire as a cathode; making the diamond of the surface alloyed tungsten do electrophoresis motion under the action of an electric field and electrodeposited on the surface of the steel wire, and simultaneously electrodepositing the metal nickel on the surface of the steel wire. The diamond wire saw prepared by the production process has the advantages of even distribution of diamond grain, high mass percentage of a diamond plating layer and high electroplating speed; and the diamond and a nickel matrix are in metallurgical bonding, so the bonding capacity of the matrix for cutting diamond grains is remarkably improved, and the cutting capacity and the service life of the diamond wire saw are greatly improved. The production process is suitable for industrialized production, and can replace the prior production process for the diamond wire saw.

Description

technical field [0001] The invention discloses a method for preparing a high-performance diamond wire saw, in particular to a production process for preparing a high-performance diamond wire saw, and relates to the technical fields of material surface alloying and electroplating. Background technique [0002] Hard and brittle materials include various stones, gemstones, glass, silicon crystals, quartz crystals, hard alloys, ceramics, rare earth magnetic materials, etc. Hard and brittle materials are mostly non-conductors or semiconductors, usually with high hardness, high brittleness, high wear resistance, high corrosion resistance, high oxidation resistance, high resistivity, high temperature resistance, non-magnetic conductivity and other properties. Because hard and brittle materials have excellent characteristics that are difficult to match with many metal materials, their application scope has gradually expanded from construction industry, handicraft manufacturing indus...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D15/02C25D7/06C23C16/06
Inventor 贺跃辉段志明匡怡新周永杨辉煌吝楠刘纯辉熊佳海陈豫章
Owner CHANGSHA DIAT NEW MATERIAL SCI & TECH
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