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A metal electroplating composition and methods of use thereof

PendingCN122303981ANo holesNo defectsHigh current densityActive agent
This invention provides a metal electroplating composition comprising: a sulfur-containing compound, a tin salt, a silver salt, an acidic electrolyte, a surfactant, a brightener, an antioxidant, a pH adjuster, and water. The sulfur-containing compound is a compound of formula (I): wherein R1 is selected from primary, secondary, and tertiary amino groups; R2 is selected from straight-chain alkyl and branched-chain alkyl groups; R3 is selected from straight-chain alkyl and branched-chain alkyl groups; and R4 is selected from hydrogen and alkyl groups. Using the above technical solution, electroplating under high current density conditions can achieve the following technical effects: no pores or defects, low impurities in the plating layer, excellent plating uniformity, dense structure, and low surface roughness. The metal electroplating composition has good plating solution stability and plating uniformity, and can obtain consistently good appearance and film thickness uniformity of the plating film. It has good industrial application value.
Owner:ANJI MICROELECTRONICS TECH (SHANGHAI) CO LTD