3results about How to "Good throwing ability" patented technology

The utility model relates to the technical field of throwing barrels, and discloses a material throwing barrel for a silage maize harvester, which comprises a throwing barrel body, one side of the throwing barrel body is provided with a discharge port, one side of the throwing barrel body close to the discharge port is symmetrically and rotatably connected with rotating shafts in a penetrating manner, and the outer surfaces of the rotating shafts are fixedly connected with guide plates. In the process that the throwing cylinder body throws forage, the guiding plate can be driven to swing left and right in a reciprocating mode, the forage is evenly thrown to all positions above the forage storage vehicle, and therefore the throwing range of the throwing cylinder body is enlarged, the requirement for manually adjusting the throwing direction and position by workers is reduced, the labor intensity of operators is reduced, and the throwing efficiency is improved. According to the hay storage vehicle, the working comfort and safety are improved, the hay can be more evenly distributed at all positions above the hay storage vehicle, the hay is prevented from being accumulated in a certain area in a concentrated mode, and therefore the throwing efficiency is improved.

This invention provides a metal electroplating composition comprising: a sulfur-containing compound, a tin salt, a silver salt, an acidic electrolyte, a surfactant, a brightener, an antioxidant, a pH adjuster, and water. The sulfur-containing compound is a compound of formula (I): wherein R1 is selected from primary, secondary, and tertiary amino groups; R2 is selected from straight-chain alkyl and branched-chain alkyl groups; R3 is selected from straight-chain alkyl and branched-chain alkyl groups; and R4 is selected from hydrogen and alkyl groups. Using the above technical solution, electroplating under high current density conditions can achieve the following technical effects: no pores or defects, low impurities in the plating layer, excellent plating uniformity, dense structure, and low surface roughness. The metal electroplating composition has good plating solution stability and plating uniformity, and can obtain consistently good appearance and film thickness uniformity of the plating film. It has good industrial application value.

The invention discloses a HDI board hole-filling copper plating liquid composition, which belongs to the technical field of electroplating. The composition comprises a hole-filling copper plating liquid base liquid, a leveling agent, a brightener and a wetting agent. When VCP (vertical continuous plating) is used to copper-plate a blind hole substrate of an HDI board, the plated board has a high hole-filling rate, a low depression value, a low hole-filling defect rate, a high hole-filling efficiency, and excellent all-plating ability and through-hole deep plating ability. The copper-plated surface has excellent ductility, forms a smooth and bright surface, and the plating layer is stress-free.