92results about How to "Good throwing ability" patented technology

The invention discloses a copper plating method of zinc alloy casting piece, which comprises the following steps: a. electrolyzing cathode to remove oil; b. activating through washing by organic acid; c. immersing in the organic acid; d. plating copper directly with bivalent copper ion density at 10-25g/L and complexing agent density at 120-350 g/L, potassium carbonate density at 10-50g/L and hydroperoxide density at 1-15mL/L; maintaining pH value between 9 and 12; adjusting pH value through 50% potassium hydroxide solution; setting the current density of cathode 0.5-2.5A/dm2 at 20-50 deg.c.

The present invention is a new non-cyanide alkaline copper plating bath, preparation and use method thereof. In the copper plating bath, using copper sulfate or basic copper carbonate as main salt, using hydroxy-ethylidene diphosphonic acid as main complexant, using trisodium citrate, potassium citrate or potassium sodium tartrate as auxiliary complexant, using sodium nitrate or potassium nitrate as conductive salt, using sodium hydroxide or potassium hydrate as pH value regulator; the operation conditions are: cathode current density is 0.5-3.0 A/dm [2], pH of plating bath controlled between 12 and 13, plating bath temperature is 50-70 DEG. Comparing with the prior known technology, the invention has following advantages or positive effects: simple plating bath formula, easy control and operation, wide temperature range of plating bath using, high current efficiency, fine crystallization coating, good appearance color, stable plating bath, strong uniform plating and covering ability, low cost, easy wastewater treatment. The invention can be used for pre copper plating or direct electro-coppering instead of virulent cyaniding electro-coppering process.

The invention relate to a leveling agent solution and a preparation method and application thereof. The leveling agent solution is obtained in the mode that a nitrogenous heterocyclic compound and a diepoxide compound are polymerized and then 1,3-propane sultone is used for an alkylation reaction. The leveling agent solution, a brightener and an inhibitor are used together, and a good electroplating effect can be obtained in electroplating of circuit board through holes.

The invention discloses a leveling agent, a metal electroplating composition containing the leveling agent, and a preparation method and application of the leveling agent. The raw materials of the metal electroplating composition comprise a metal electroplating solution and the leveling agent, the metal electroplating solution comprises copper salt, acidic electrolyte, a halide ion source and water, and the leveling agent is a compound of formula I. The metal electroplating composition can be used in the process of printed circuit board electroplating and the copper interconnection electroplating process of integrated circuits, can realize the effects of no cavity and defect, low plating layer impurities, good homogeneity of plating, compact structure and small surface roughness, and has a good industrial application value.

The invention discloses an electroplating method for electrically depositing Ni-Co-B alloy coatings on continuous casting crystallizer copper plates and belongs to the technical field of electroplating. An electroplating solution used by the method comprises the following components according to mass concentration: 170-350g/L of nickel salt, 5-50g/L of cobalt salt, 0.5-4g/L of sodium borohydride,20-60g/L of ethylenediamine and 30-50g/L of buffering agents. The Ni-Co-B alloy coatings prepared from the electroplating solution have high throwing power and excellent corrosion resistance performance; the micro hardness of the Ni-Co-B alloy coatings can reach 1000HV.

The invention provides a plating solution for the non-cyanide imitation gold plating of a Cu-Zn binary alloy on low carbon steel, and its use method in order to improve the problems of severe toxicity, bad anode dissolvability and high treatment cost of three wastes of cyanide-containing plating solutions and the problems of complex composition, narrow range of technological parameters and unrealistic imitation gold color of non-cyanide plating solutions in present imitation gold plating technologies. The method is characterized in that the method comprises the following steps: an activated matrix can be directly plated without cleaning, so the operation is simple; the imitation gold plating solution is composed of potassium pyrophosphate, copper sulfate, zinc sulfate and glycerin, so the imitation gold plating solution has the advantages of green property, environmental protection, good dispersity, strong homogeneous plating ability, simple composition and easy maintenance; and the prepared gold imitation plating solution can meet the requirements of the cross cut test requirements of national standard GB9286-1998 paint and varnish film; and the obtained coating is passivated and seal-protected, and the protected coating meets the 5% brine neutral salt spray test indexes of the national standard GB5938-86 Corrosion Resistance Test Method of Metal Coating and Chemical Treatment Layer of Light Industrial Product, and can be used as a decorative coating.

The invention concretely discloses a nickel-coated graphite electric conduction powder used for electric conduction rubber and a manufacturing method of the nickel-coated graphite electric conduction powder. The nickel-coated graphite electric conduction powder used for the electric conduction rubber comprises 50-80% of nickel and 20-50% of graphite. The manufacturing method of the nickel-coated graphite electric conduction powder used for the electric conduction rubber mainly includes the four steps of oil removing treatment on graphite powder, acid etching and roughening treatment on the graphite powder, surface activating treatment on the graphite powder and chemical nickel plating. The nickel-coated graphite electric conduction powder has the advantages of pure nickel and pure graphite, is low in cost and not prone to rusting and further can improve the mechanical strength of the electric conduction rubber material. The chemical nickel plating method is easy to operate and simple in technology, plated layers are even and compact, the throwing power is high, plating can be performed on particles in any shape, the covering power is high, and the even, fine and dispersed composite powder can be manufactured.

The present invention provides a new non-cyanide electro cooper plating bath of EDTA system and use method thereof. In the electro copper plating bath, using disodium EDTA or dipotassium EDTA as main complexant, using copper sulfate or basic copper carbonate as main salt, using trisodium citrate, potassium citrate or potassium sodium tartrate as auxiliary complexant, using sodium nitrate or potassium nitrate as conductive salt, using sodium hydroxide or potassium hydrate as pH value regulator. The invention also provides a use method of the non-cyanide electro cooper plating bath. The invention has advantages: simple plating bath formula, easy control and operation, wide temperature range of plating bath using, high current efficiency, fine crystallization coating, good appearance color, stable plating bath, strong uniform plating and covering ability, low cost, easy wastewater treatment. The invention can be used for pre copper plating or direct electro-coppering instead of virulent cyaniding electro-coppering process.

The invention belongs to the electroplating field, in particular relates to a novel electroplating solution with excellent plating property used in the process of plating copper in the production and manufacturing of a circuit board. The electroplating copper solution of a printed circuit board comprises a copper sulphate solution and a dispersant; the dispersant is mainly sodium salt solution containing sulfosuccinate group and ethylene oxide group, and the dispersant comprises alkyl ester sodium sulfonate salt of succinic acid, succinate sodium salt containing amine and the succinate sodium salt containing ethoxy. An anion surfactant containing the sodium salt of the sulfosuccinate group and the ethylene oxide group is taken as the dispersant for a used additive, which significantly improves the comprehensive electroplating property of the electroplating copper solution, and ensures that the electroplating solution has high dispersing property, excellent ductibility and better plating homogeneity. The invention can provide the novel electroplating copper solution with the high dispersing property, the excellent ductibility and the better plating homogeneity. The copper solution can meet requirements for high density and high accuracy of plating copper on the printed circuit board.

The invention relates to a black chromium plating solution, a composite plating layer and a preparing method thereof. The black chromium plating solution comprises water solutions of the following components of 100-150 g/L of chromic chloride, 55-70 g/L of boric acid, 160-305 g/L of conducting salt, 70-160 g/L of complexing agents, 0.02-0.15 g/L of wetting agents, 0.5-1.5 g/L of ammonium ferrous sulfate and 10-50 g/L of blackening agents, wherein the blackening agents are mixtures of methionine, potassium thiocyanate and aspartic acid. The trivalent black chromium plating layer formed by plating through the black chromium plating solution is in deep black, is strong in uniform covering capacity and can be matched with a bright copper layer, a semi-bright nickel layer, a bright nickel layer, a micro-porous nickel layer and a passivation film layer to enable the obtained composite plating layer to have high abrasion resistance and be in uniformly deep black.

The invention discloses a process for plating copper on the surface of a magnesium alloy shell. The process comprises the following steps: (1) cleaning: cleaning by using alkali, water and acid in sequence; (2) activating: activating in an activation solution for 5-15 minutes; (3) performing zinc alloy soaking: soaking a magnesium alloy casting in zinc alloy immersion liquid at the temperature of 75-85 DEG C for 10-15 minutes; (4) plating copper: plating under the condition that the pH is 8-8.5, the current density is 3-3.5 A/dm<2>, and the temperature is 35-45 DEG C. By adjusting the zinc immersion liquid and plating solution components for plating copper, the defects in the prior art are overcome, and the bonding force between a plating and a substrate is enhanced.

The invention relates to a non-cyanide converting method for cyanide plated zinc. Non-cyanide conversion is as follows: a brightening agent (HT) and a complexing agent (HEDP) are added into plating liquid to carry out zinc plating by stopping adding NaCN and ZnO into the plating liquid. The plating liquid comprises the following components (g*L-1): 10-less than 5 of cyanide, 8-15 of zinc oxide, 60-120 of NaOH, 15-20 of HEDP and 2-3 of HT. The electroplating technical condition comprises the temperature of 10-45 DEG C, the cathode current density (A*dm<-2>) of 0.5-4 and the average current efficiency of 70-78 percent. The corrosion resistance, the bonding capability and the color change resistance of a plating layer completely meet the practical production requirement. The plating liquid has high impurity resistance and is still stable for continuously using for one month. The converted process does not use the cyanide, is easy to process electroplating wastewater and is a more clean production process, thereby replacing a cyanide zinc plating process in a peace way.

The invention discloses electroplating liquid with good stability. The electroplating liquid with good stability comprises a dispersant, a water reducing agent and a silane coupling agent, wherein the dispersant is sodium dodecyl sulfate, the water reducing agent is polycarboxylic acid, the silane coupling agent is butadiene triethoxy silane, the sodium dodecyl sulfate accounts for 35-45% of the total weight of the electroplating liquid with good stability, the polycarboxylic acid accounts for 22-33% of the total weight of the electroplating liquid with good stability, and the butadiene triethoxy silane accounts for 30-36% of the total weight of the electroplating liquid with good stability. The electroplating liquid with good stability, provided by the invention, has the advantages of good stability, excellent uniform coverage ability and high electroplating speed.