Leveling agent, metal electroplating composition containing leveling agent, and preparation method and application of leveling agent

Abstract

The invention discloses a leveling agent, a metal electroplating composition containing the leveling agent, and a preparation method and application of the leveling agent. The raw materials of the metal electroplating composition comprise a metal electroplating solution and the leveling agent, the metal electroplating solution comprises copper salt, acidic electrolyte, a halide ion source and water, and the leveling agent is a compound of formula I. The metal electroplating composition can be used in the process of printed circuit board electroplating and the copper interconnection electroplating process of integrated circuits, can realize the effects of no cavity and defect, low plating layer impurities, good homogeneity of plating, compact structure and small surface roughness, and has a good industrial application value.

Description

technical field [0001] The invention belongs to the field of semiconductor materials, and in particular relates to a leveler, a metal electroplating composition containing it, a preparation method and an application. Background technique [0002] With the development of Very Large Scale Integration (VLSI) and Ultra Large Scale Integration (ULSI), the level of integration continues to increase, and circuit components become more and more dense. Chip interconnection has become a key factor affecting chip performance. The reliability of these interconnect structures plays a very important role in the success of VLSI and ULSI and the improvement of circuit density. However, the scaling down of interconnect lines in VLSI and ULSI technologies has placed additional demands on processing capabilities due to size constraints of the circuitry. Such requirements include precise machining of multi-layered, high-aspect-ratio structural features. [0003] As the circuit density increas...

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Problems solved by technology

[0009] The purpose of the present invention is to solve the problem in the art that lacks a metal electroplating composition that can achieve no voids and defects, low coating impurities,

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