Leveling agent

A technology of leveling agent and compound, applied in the field of electroplating, can solve the problem that the leveling agent cannot meet the leveling ability and deep plating ability, and achieve the effect of good leveling ability, deep plating ability and good plating ability

Inactive Publication Date: 2019-07-09
GUANGDONG TONESET SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The purpose of the present invention is to provide a new leveling agent, when utilizing the copper plating solution electroplating containing the leveling agent, it can obtain uniform and smooth surface on substrates with high aspect ratio through holes and high-density interconnection blind holes The copper layer has good plating ability, especially for through holes with a thickness-to-diameter ratio of 15 or more and blind holes for high-density interconnection, which solves the problem that the throwing ability and deep plating ability of existing leveling agents cannot meet the actual needs question

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] In a 100mL three-necked flask equipped with a condenser and a thermometer, add 4.60g (47.87mmol) of 2,4-dimethylimidazole, 0.70g (5.32mmol) of N,N,N',N'-tetramethyl- 1,3-propylenediamine, 14mL deionized water, 2.50g (8.16mmol) glycerol triglycidyl ether. The reaction was stirred at 60° C. for 1 hour using an oil bath. Add 7.06g (30.36mmol) of 1,4-butanediol diglycidyl ether, stir and react at 70°C for 1 hour, then rise to 90°C and stir for 15 hours. Stop the reaction, cool to room temperature, and adjust the pH to 1-3 with 50 wt% sulfuric acid to obtain leveler 1. Examples 2-16: Refer to Example 1, the difference lies in the synthetic monomers and ratios of the leveling agent and the solvents used to dissolve the monomers, see Table 1 for details.

Embodiment 2-16

Embodiment 17

[0065] Take 1.5L of basic solution A in a Harlem tank, add butyl polyoxyethylene polyoxypropylene ether (EO / PO copolymer) inhibitor solution, the concentration is 0.6g / L; add sulfonic acid disulfide accelerator ( SPS) solution with a concentration of 4 ppm; the leveling agent synthesized in Examples 1 to 7 and the leveling agent in Comparative Example 1 with a concentration in the range of 0.5 ppm to 500 ppm were added respectively, and stirred evenly. According to the above-mentioned through-hole substrate plating method, a test plate with a thickness-to-diameter ratio (h / Φ) of 15 was placed, and electroplated at a current density of 10ASF for 2 hours. The obtained plated parts were tested according to the above-mentioned through-hole plating effect test method, and the results Listed in Table 2.

[0066] Table 2

[0067]

[0068] Show from above-mentioned result, after the copper electroplating solution that contains leveling agent of the present invention carries out th...

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Abstract

The invention discloses a leveling agent. The leveling agent is a polymer with the number-average molecular weight distribution being 500-20000, and the polymer is formed by reacting one or more kindsof nitrogenous heterocyclic compounds, two or more kinds of polyepoxy compounds and one or more kinds of poly-amino compounds. When the leveling agent is used for electrocoppering, copper layers withthe thicknesses being uniform and surfaces being smooth and flat can be obtained at the opening positions and the insides of high-aspect-ratio through holes as well as the surface of a base materialor the surface of the base material and the insides of high-density interconnected blind holes, copper electroplating liquid has good plating homogenization power and throwing power, good plating capacity is achieved especially for the through holes with the aspect ratio reaching 15 or above and the high-density interconnected blind holes, and the problem that the plating homogenization power andthrowing power of an existing leveling agent cannot meet the practical needs is solved.

Description

[0001] Technical field: [0002] The invention relates to the field of electroplating, in particular to a leveling agent. [0003] Background technique: [0004] Currently, as the functions of electronic equipment increase and the convenience of portability continues to improve, circuit substrates used in electronic equipment tend to be miniaturized. Generally speaking, circuit substrates generally include printed wiring boards and semiconductor wafers. In order to realize the interconnection and intercommunication of the circuit inside the substrate, the multi-layer board is an optional solution. This type of substrate achieves the above purpose through through holes, but usually this kind of multilayer board has a high aspect ratio That is, the ratio of the thickness of the plate to the diameter of the through hole, for example, the ratio of thickness to diameter reaches 10:1, or even 20:1. This type of structure increases the difficulty of copper plating on the substrate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C08G59/38C08G59/50C08G59/68
CPCC08G59/38C08G59/5006C08G59/686C25D3/38
Inventor 郑臣谋高健邹浩斌王植材肖定军刘彬云宋兴文
Owner GUANGDONG TONESET SCI & TECH
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