44results about How to "Excellent plating property" patented technology

The invention discloses a method for manufacturing a nickel-chromium plating steel band for a battery steel shell. According to the method, ingredients of low-carbon steel are adjusted, proper amount of alloy elements of Ti, Ni, Nb and the like is added, and the content of N and O is controlled to improve surface states; parameters of a cold milling process and an annealing process are adjusted aiming at the adjusted ingredients of the steel; a chromium coating is used as a diffusion impervious layer, so that the diffusion of iron can be blocked effectively; and an anticorrosive coating which contains 20 to 30 percent of chromium and has a quasi-stainless steel structure is formed in the diffusion layer, so that the anticorrosive performance is enhanced doubly. Aiming at double-layer plating design concept of nickel-chromium plating, the ingredients of a nickel plating solution and a chromium plating solution and a plating process are adjusted, so that the coating has the characteristics of bright surfaces, low porosity and high mechanical performance.

The invention discloses a polyester molding composition, a preparation method and applications thereof, wherein the polyester molding composition comprises 30-99.7 parts of a polyester resin, 2-20 parts of an anti-impact modifier, 2-15 parts of a laser sensitive additive, and 0.1-50 parts of a reinforcing material and/or a filler. According to the present invention, the research results show thatthe prepared polyester molding composition and the surface treated metal can form the metal-plastic complex with excellent adhesion through injection molding, wherein the mechanical properties are excellent, the heat resistance is good, the bonding force between the metal and the plastic is greater than 120 kgf, and the requirements of the NMT process on the bonding force between the metal and theplastic can be met; and the prepared polyester molding composition can be used for preparing members for metal deposition, wherein the plating index MI value is more than 0.85, the LDS metal platingperformance is excellent, and the metal can be selectively deposited in the laser etched area so as to form the beautiful chemical plating layer.

The invention discloses a high-silicon aluminum alloy adapter plate and a preparation method thereof. The adapter plate comprises a substrate, a connecting column array and an insulating dielectric layer filled in a gap between the connecting column array and the substrate, the connecting column array is formed by processing the substrate through a laser vertical through hole technology; the substrate and the connecting column array are made of high-silicon aluminum alloy, the insulating dielectric layer is made of a glass dielectric, connecting columns of the connecting column array are coaxial with the insulating dielectric layer, and the connecting columns, the glass dielectric and the substrate have the same height. The adapter plate prepared by adopting the method provided by the invention is firm and reliable in bonding interface and high in air tightness, and the blind hole center connecting column has electrical conductivity and can be directly used for electrical interconnection, so that a through hole metallization process can be omitted, the adapter plate preparation process flow is simplified, and the adapter plate preparation time and cost are reduced.

Provided are: a thin steel sheet and a plated steel sheet having a TS of 1180 MPa or higher and excellent bendability and plating properties; and methods for producing a hot-rolled steel sheet, a cold-rolled full-hard steel sheet, and a thin steel sheet. This thin steel sheet has a predetermined component composition and comprises at least one element selected from 0.003-0.100% of Ti, 0.003-0.100%of Nb, and 0.005-0.500% of Mo. In a range up to 20 [mu]m from the surface in the sheet thickness direction, polygonal ferrite accounts for 0-60%, and the total of martensite, bainite, and retained austenite is 40-100%. The amount of Mn in martensite present in a range up to 20 [mu]m from the steel sheet surface in the sheet thickness direction ([Mn]SM) and the amount of Mn in the bulk ([Mn]B) satisfies an equation that is [Mn]SM/[Mn]B <= 1.5. At a position 300 [mu]m from the surface in the sheet thickness direction, the area percentage of martensite is 40-80%, and the average crystal grain size of polygonal ferrite and that of bainite are less than 15 [mu]m.

The invention discloses a pre-galvanizing process for electroplating copper on the surface of a magnesium alloy shell. The process comprises the following steps: (1) washing: washing with alkali, water and acid; (2) activating: activating for 5-15 minutes in an activate fluid; (3) zinc-immersing alloying: immersing a magnesium alloy cast in zinc alloy immersion liquid for 10-15 minutes at 75-85 DEG C; (4) pregalvanizing, wherein the pregalvanizing fluid comprises 32-36g/L of ZnSO4.7H2O, 164-168g/L of K4P2O7.3H2O, 18-20g/L of KF, 32-36g/L of C6H17O7N3, 0.4-0.6g/L of phytic acid, 4-6g/L of H2CSNH2 and the balance of water, the pregalvanizing temperature is 35-45 DEG C, the electroplating time is 30-40 minutes, and the current density is 2-3A/dm<2>.

The invention discloses a nickel-chromium-plated steel band for a battery steel shell. The steel band comprises the following chemical components in percentage by weight: 0.15 to 0.20 percent of C, 0.2 to 0.4 percent of Si, 0.5 to 0.7 percent of Mn, 0.01 to 0.02 percent of Als, 0.05 to 0.08 percent of Ti, less than or equal to 0.03 percent of P, less than or equal to 0.01 percent of S, 0.3 to 0.5 percent of Ni, 0.7 to 0.9 percent of Nb, less than or equal to 0.015 percent of N, less than or equal to 0.006 percent of O and the rest of Fe and unavoidable impurities, wherein the thickness of a chromium layer is 1.5 to 2.5 mu m; a solution for preparing the chromium layer comprises 600 to 620 g/L anhydrous chromic anhydride, 20 to 25 ml/L hydrochloric acid and the rest of water; the thickness of a nickel layer is 6 to 8 mu m; and a solution for preparing the nickel layer comprises 560 to 600 g/L nickel aminosulfonate, 12 to 14 g/L nickel chloride, 35 to 45 g/L boric acid and the rest of water.

The invention discloses a preparation method for plating silver on the surface of a hollow glass bead. The preparation method comprises the following steps of mixing an ethanol solution and an alkaline solution to treat the surface of the hollow glass bead, then putting into a SnCl2 solution for surface sensitization treatment, and then putting into a prefabricated silver-ammonia solution activation solution for full reaction, the reducing solution being a mixed solution of glucose and tartaric acid, directly adding the reducing solution into the activation solution to enable Ag<+> in the activation solution to completely react, and then dropwise adding a silver ammonia solution oxidation solution for chemical silver plating. According to the preparation method, expensive and toxic PbCl2 is not selected as an activating agent, and the silver-ammonia solution is adopted as the activating agent, so that the cost is saved, the utilization rate of Ag is increased, and the purpose of protecting the environment is achieved; and the prepared silver-plated glass bead has a uniform and compact silver coating layer, is not easy to fall off, has excellent conductivity, and can be used in theindustry of electromagnetic shielding materials.

Provided is a high-strength steel sheet which has a tensile strength of 980 MPa or higher, and excellent mouldability. This high-strength steel sheet has a specific component composition, and a structure in which the average grain size of a ferrite phase is 1.5 microns or lower, the area ratio of the ferrite phase is at least 2% but not more than 15%, the area ratio of a tempered martensite phaseis at least 75% but not more than 96%, and the total value of the lengths of interfaces between an untempered martensite phase and the ferrite phase, and the lengths of interfaces between the untempered martensite phase and the tempered martensite phase, per unit area, is at least 6.3*108 microns/m2 but not more than 5.0*1011 microns/m2.

The invention relates to brazing filler metal, in particular to aluminum and silicon-based brazing filler metal. The aluminum and silicon-based brazing filler metal comprises Al, Si, Cu, Zn and Mn. The aluminum and silicon-based brazing filler metal has the advantages of low melting temperature, excellent wettability, flowability, plating property, machinability and performance, low manufacturing cost, high welded joint strength, corrosion resistance and cost performance and good toughness.

The invention discloses a manufacturing method of an electromagnetic shielding material, the electromagnetic shielding material prepared by the manufacturing method and an electronic product applyingthe electromagnetic shielding material. The manufacturing method of the electromagnetic shielding material comprises the following steps: a polymer film layer is provided, and the thickness of the polymer film layer is larger than or equal to 1.5 micrometers and smaller than or equal to 6 micrometers; the polymer film layer is punched, so that a plurality of through holes are formed in the polymerfilm layer, the hole diameter of the through holes ranges from 0.1 micrometer to 100 micrometers, and the hole distance ranges from 0.1 micrometer to 100 micrometers; roughening the polymer film layer to enable the dyne value of the polymer film layer to be greater than or equal to 44 and less than or equal to 70; vapor deposition is carried out on the two roughened surfaces respectively, and atleast one metal shielding layer is formed on each surface and the hole walls of the through holes respectively; according to the technical scheme, the electromagnetic shielding material with the two-sided conduction function is very thin and good in flexibility.

The invention discloses a manufacturing method of an electromagnetic shielding material, the electromagnetic shielding material manufactured by the manufacturing method and an electronic product applying the electromagnetic shielding material. The manufacturing method of the electromagnetic shielding material comprises the following steps that a polymer film layer is provided, and the thickness of the polymer film layer is larger than or equal to 1.5 microns and smaller than or equal to 6 microns; at least one surface of a polymer film is subjected to roughening treatment, so that the dyne value of the at least one surface is larger than or equal to 44 and smaller than or equal to 70; and at least one metal shielding layer is deposited on the roughened surfaces. According to the manufacturing method of the electromagnetic shielding material, the thickness of the polymer film layer can be reduced by 75% to the maximum extent, the flexibility of the electromagnetic shielding material is better, the using effect is better, and the product cost is lower.

The invention discloses a manufacturing method of an electromagnetic shielding material, the electromagnetic shielding material prepared by the manufacturing method and an electronic product applyingthe electromagnetic shielding material. The manufacturing method of the electromagnetic shielding material comprises the following steps: providing a polymer film layer of which two sides are conducted, wherein the thickness of the polymer film layer is greater than or equal to 0.8 micron and less than or equal to 12 microns; roughening the polymer film layer to enable the dyne value of the polymer film layer to be greater than or equal to 44 and less than or equal to 70; performing vapor deposition on the two roughened surfaces, forming at least one metal shielding layer on each surface, andperforming the metal shielding layers on the two surfaces through the polymer film layer; according to the technical scheme, the electromagnetic shielding material which is very thin and is conductedon two sides is provided.