A laser direct structuring material with good comprehensive properties and its preparation method

A technology of laser direct structuring and comprehensive performance, applied in the field of laser direct structuring materials and their preparation, can solve the problems of inability to meet the requirements of material performance, failure to pass the 100-grid test, slow electroless plating, etc., to achieve a performance balance, Wide design space and improved salt resistance

Active Publication Date: 2019-04-23
无锡赢同新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] For the specific application of the material, if the laser direct structuring additive is not properly selected, it may cause defects such as silver wires and pitting on the surface after injection molding, resulting in slow or even unplating of electroless plating in the later stage, and failure of the 100-grid test. ; or the mechanical properties drop significantly after electroless plating, which cannot meet the requirements of the material performance

Method used

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  • A laser direct structuring material with good comprehensive properties and its preparation method
  • A laser direct structuring material with good comprehensive properties and its preparation method
  • A laser direct structuring material with good comprehensive properties and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~6

[0033] The total amount of raw materials is 10kg, and by weight percentage, the components are as follows:

[0034] Polycarbonate 87.2wt%

[0035] LDS additive 3wt%

[0036] Toughener 4wt%

[0037] Inorganic nanoparticles 5wt%

[0038] Other additives 0.8wt%

[0039] In this embodiment, the polycarbonate adopts the polycarbonate containing bisphenol A structure, including two kinds: one kind of polycarbonate has an MFR of 8g / min at 300°C and 1.2Kg, and a weight average molecular weight of 24000. It is 42wt%; the MFR of a kind of polycarbonate at 300 ℃, 1.2Kg is 18g / min, the weight-average molecular weight is 19500, and the weight percentage used is 45.2wt%.

[0040] In this embodiment, there are two kinds of LDS additives: LDS-1 (basic copper phosphate) and LDS-2 (tin pyrophosphate), and the weight percentage of the two in the total raw material is 3wt%.

[0041] In this example, the toughening agent (IM) is a silicone core-shell polymer (using Mitsubishi Rayon Metablen S...

Embodiment 7~11

[0054] The total amount of raw materials is 10kg, by weight percentage, including the following components:

[0055] Polycarbonate 85wt%

[0056] LDS additive 6wt%

[0057] Toughener 5wt%

[0058] Inorganic nanoparticles 3wt%

[0059] Other additives 1wt%

[0060] The polycarbonate in this embodiment is the polycarbonate containing bisphenol A structure, including two kinds: a kind of polycarbonate is at 300 ℃, the MFR of 1.2Kg is 8g / min, and the weight average molecular weight is 24000, and the mass parts used It is 40wt%; a kind of polycarbonate is 18g / min at 300 ℃, MFR of 1.2Kg, weight average molecular weight is 19500, and the used mass fraction is 45wt%.

[0061] In this embodiment, there are two kinds of LDS additives: LDS-1 (basic copper phosphate) and LDS-3 (zinc stannate). In the total raw materials, the weight percentage of the two is 6wt%.

[0062] In this embodiment, the toughening agent (IM) is methyl methacrylate-butadiene-styrene terpolymer (model is DOWEXL...

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Abstract

The invention discloses a laser direct structuring material with good comprehensive performance. The laser direct structuring material has good heat stability and high toughness, and is particularly applicable to laser direct structuring. The laser direct structuring material is prepared from the following ingredients in percentage by weight: 65 to 95 percent of polycarbonate, 1 to 20 percent of laser direct structuring additives, 1 to 15 weight percent of tougheners, 1 to 10 percent of inorganic nanometer particles and 0 to 2 percent of other different additives, wherein the laser direct structuring additives comprise a copper-containing laser direct structuring additive and a tin-containing laser direct structuring additive; the ratio of the copper-containing laser direct structuring additive to the tin-containing laser direct structuring additive is (1 to 10) to (9 to 10). The invention also discloses a method for preparing the laser direct structuring material. The laser direct structuring material obtained by the method shows high heat stability and high notch impact strength (being greater than 500J / m) in the processing process.

Description

technical field [0001] The invention belongs to the technical field of laser direct structuring material preparation, and in particular relates to a laser direct structuring material with good thermal stability and high toughness and a preparation method thereof. Background technique [0002] LDS is the abbreviation of Laser Direct Structuring, that is, laser direct structuring, which is a 3D-MID production technology of professional laser processing, injection and electroplating process. The function of components and the support and protection of the plastic shell, as well as the shielding and antenna functions produced by the combination of mechanical entities and conductive patterns, form a so-called 3D-MID, which is suitable for the production of local thin lines. [0003] LDS can avoid environmental pollution and water consumption caused by traditional plastic electroplating process to a large extent, simplify the production process, and provide flexible and changeable...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L69/00C08L51/04C08K13/02C08K3/22C08K3/32C08K3/24B29B9/06
CPCB29B9/06C08K2201/003C08K2201/011C08L69/00C08L2201/08C08L2205/025C08L2205/03C08L2205/035C08L51/04C08K13/02C08K2003/2227C08K2003/328C08K3/32C08K2003/2241C08K3/24
Inventor 吴彤李莹
Owner 无锡赢同新材料科技有限公司
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