Resin composition for plating substrate and resin moldings using the same, and metal plated parts

A technology of resin composition and substrate, applied in coating, transportation and packaging, thin material processing, etc., can solve the problems of small molecular weight, pollution of mold surface, and poor appearance of coating layer.
CN1513028AInactive Publication Date: 2004-07-14大科能宇菱通株式会社
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
大科能宇菱通株式会社
Publication Date
2004-07-14
Estimated Expiration
Not applicable · inactive patent

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Abstract

The resin composition for a platable substrate of the present invention comprises 100 parts by weight of a resin composition (C) comprising 10 to 60% by weight of a graft copolymer (A) prepared by graft polymerization of a rubbery polymer (A1) and a monomer component (A2) containing an aromatic alkenyl compound monomer unit (a) and a vinyl cyanide compound monomer unit (b) and 40 to 90% by weight of the other polymer (B) (provided that the total amount of the components (A) and (B) is 100% by weight), and 5 to 40 parts by weight of a phosphate ester flame retardant (D) having a molecular weight of more than 326 or 2 to 40 parts by weight of a red phosphorus flame retardant (D'). The resin composition for a platable substrate of the present invention is excellent in production stability such as moldability, dimensional stability, mechanical strength and plating properties, and is also environmentally friendly. Excellent plated parts having good thermal conductivity can be provided by forming a metal plating layer on a resin molded article obtained by molding the resin composition for a platable substrate using a plating treatment. The resulting plated parts are suitable for use as housings for laptop PC and portable devices.
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Description

technical field

[0001] The present invention relates to a flame-retardant resin composition for plating substrates, and resin molded articles and plated parts using the composition. Background technique

[0002] At present, the housings of notebook computers and portable instruments mainly use non-reinforced and fiber-reinforced flame-retardant ABS resins (acrylonitrile-butadiene-styrene resins), flame-retardant PC-ABS resins (polyethylene Carbonate-ABS resin) and other materials.

[0003] However, in recent years, in addition to strict requirements for lighter and thinner instruments, it is also required to be able to withstand impacts or loads when they are packed in boxes, etc. strong impact. Therefore, it is necessary to require the resin material used for the housing to have high rigidity and impact resistance.

[0004] In addition, the housing of such a machine must also have electromagnetic wave interference shielding (hereinafter referred to as EMI shielding). In...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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