46results about How to "Achieve metallization" patented technology

The invention discloses a preparation method for a copper/aluminium nitride ceramic composite heat-conductive substrate. The method comprises the following steps: 1) providing through holes in the surface of an aluminium nitride substrate; 2) coating copper electronic paste layers on the double surfaces of the aluminium nitride substrate; 3) filling the through holes with pre-oxidation copper cylinders; 4) carrying out overall sintering for 30 min; 5) carrying out brazing after the double surfaces of the aluminium nitride substrate being coated with tin silver copper solder materials; 6) carrying out surface polishing; and 7) carrying out copper plating processing directly and forming uniform copper layers, and thus, the copper/aluminium nitride ceramic composite heat-conductive substrate is obtained. The through holes in the copper/aluminium nitride ceramic composite heat-conductive substrate produced with the preparation method are communicated up and down; the combination between the metalized layers in the holes and the ceramic substrate is strong; the middle copper cylinders can realize the communication of the copper layers on the upper and lower surfaces; and the copper/aluminium nitride ceramic composite heat-conductive substrate helps the transmission of electrical signals and has the advantages of ideal heat-conductive effect, low thermal expansion coefficients and good conductivity and the like.

The invention relates to a ceramic/metal high-temperature packaging material of a gradient structure. A ceramic material comprises one or a plurality of nitrides (A1N, Si3N4, BN and the like), carbides (SiC, ZrC, TiC and the like) and oxides (Al2O3, SiO2, ZrO2 and the like). A metal material comprises one of high-melting-point metals, such as W, Mo, Ta, Cr and Nb. The preparing method of the material comprises the following steps: fully mixing required metal and ceramic powder according to designed gradient components, gradient layer number and the content of each component in each layer so asto obtain required raw materials for each gradient layer; stacking all layers and carrying out pressing forming; enabling the mass percent of ceramic powder to symmetrically and continuously vary ina gradient manner between 100 % and 0 % from the inner side to the outer side in the axial direction; utilizing a powder metallurgy and hot pressing co-firing technology, and finally obtaining the ceramic/metal high-temperature packaging material of the gradient structure. The helium leakage rate is smaller than 1x10<-11> Pa.m<3>/s, the bending strength is larger than 200Mpa, and the electric resistivity is larger than 6x10<9> omega.cm.

The invention relates to a surrounding-emitting electrode solar cell and a preparation method thereof. The cell contains arrays which are arranged in a hexagonal lattice way and penetrate through holes 2 of an irradiation surface and a backlight surface of a silicon chip 1 in the silicon chip 1, therefore, the quantity of the through holes is minimized, and the breakage ratio of the silicon chip in the process of the hole drilling technology is reduced; a heavily doped emitting electrode 6 included on the back surface of the silicon chip 1 partially enters into the through holes, and a first conductive metal electrode 5 is arranged on the heavily doped emitting electrode 6, and plays the role of collecting minority carriers. A groove is arranged at the circumference of the first conductive metal electrode 5 by etching, a second conductive metal electrode 7 is arranged in the groove and plays the role of collecting majority carriers, and the first conductive metal electrode 5 and the second conductive metal electrode 7 deposited in the groove are insulated and isolated through the step of the groove.

The invention discloses a liquid flow non-immersive measuring device and a sensing probe. The liquid flow non-immersive measuring device comprises the sensing probe and is characterized in that the sensing probe is connected with a circulator through an optical path, light emitted by a pump light source of 980nm is received by the circulator through a separator, optical signals output by the circulator is sent to a coupler through the separator, two optical signals are output by the coupler, one signal is sent to a first Faraday rotary mirror through a phase modulator, and the other signal is directly sent to a second Faraday rotary mirror; the optical signals output by the coupler are sent to a photoelectric detector, electric signals output by the photoelectric detector enter a phase carrier wave demodulating device, weak dynamic variation of the wave length of a DFB optical fiber laser is demodulated, and flow is calculated according to the variation of the wave length; the sensing probe relates to a section of asymmetric phase shifting optical fiber grating fixed on the outer wall of an oil pipe in the circumferential direction.

The invention discloses a printed wiring board chemical copper plating solution which is prepared from the following raw materials in parts by mass: 10-15 parts of chalcanthite, 30-35 parts of sodium hypophosphite, 10-15 parts of boric acid, 12-18 parts of complexing agent, 0.05-0.1 part of stabilizer, 0.5-1.5 parts of catalyst, 0.05-0.1 part of surfactant, 15-18 parts of sodium hydroxide and 300-320 parts of deionized water. By using the sodium hypophosphite as the main reducer, the chalcanthite, boric acid, complexing agent, stabilizer, catalyst, surfactant and sodium hydroxide are added to prepare the chemical copper plating solution; and the chemical copper plating solution is diluted to be used for chemical copper plating on the printed wiring board, thereby achieving the effects of the metallization of the non-conductor surface of the activated printed wiring board and the metallization in the printed wiring board holes. The printed wiring board chemical copper plating solution has the advantages of wide technological parameter range, long service life and no harmful formaldehyde vapor.

The invention relates to a preparation method for a three-dimensional metal micro-nanometer device. The method comprises the steps: forming a first structure of a polymer in a first photoresist by utilizing femtosecond laser beam; activating the surface of the first structure of the polymer; covering the activated first structure of the polymer by a second photoresist; forming a second structure partially contacted with the first structure in the second photoresist by utilizing femtosecond laser beam to obtain a complex of the partially exposed and activated surface of the first structure; and carrying out electrodeless plating to the complex in electroplate solution, and forming a metal thin membrane on the exposed surface of the first structure to obtain the three-dimensional metal micro-nanometer device. The first structure and the second structure are respectively machined so as to accurately align on three dimensions, selective electroplating of micro-nanometer structure can be realized by combining electrodeless electroplating technique, and the three-dimensional metal micro-nanometer device with any three-dimensional metal micro-nanometer structure can be obtained.

The invention discloses a lead-free copper-based bimetallic wear-resistant material and a preparation method thereof. According to the lead-free copper-based bimetallic wear-resistant material and thepreparation method thereof, copper-plated molybdenum disulfide, copper-plated graphite and copper-plated hexagonal boron nitride are added into lead-free bronze powder, alloy powder is laid on a steel plate, the copper-steel bimetallic lead-free wear-resistant composite material is prepared through a powder metallurgy re-sintering and re-rolling technology, and the effects of antifriction and wear resistance of the molybdenum disulfide, the graphite and the hexagonal boron nitride are exerted in a synergistic mode. The obtained composite material has the advantages of being good in antifriction and wear resistance performance, excellent in mechanical property, free of toxic element of lead, pollution-free to the environment and suitable for industries of medicine, food, machinery and thelike.

The invention discloses a manufacture method of a circuit board. The method comprises the following steps: milling a through groove in a daughter board; electroplating a metal layer on the wall of the groove; electroplating a protective layer on the metal layer; performing pattern electroplating on the internal-layer line patterns of a motherboard to obtain electroplating line patterns; laminating the daughter board and the motherboard to enable the electroplating line patterns to be right opposite to the through groove, and obtaining the circuit board; and performing pattern transferring and etching on the external layer of the circuit board, wherein the external layer of the circuit board comprises the external layer of the motherboard and the external layer of the daughter board. By using the method provided by the embodiment of the invention, metallization of the groove wall of the circuit board can be realized, and the qualified rate of the circuit board is improved.

The invention provides a manufacture method of metal nano circuit patterns based on DNA nano structures. The method includes taking DNA paper folding structures fixed to surfaces as templates, introducing artificial defects onto the templates, and performing selective metallization on the templates with the artificial defects so as to create the metal nano circuit patterns based on the DNA nano structures. The manufacture method is simple, rapid and effective, and a series of metal nano patterns with only few nanometers of zero-dimensional, one-dimensional and two-dimensional line width can be acquired through accurate positioning of DNA paper folding. DNA paper folding mainly applied to the manufacture method has high biocompatibility, and other needed chemical and biological materials do not have toxicity on human bodies; a novel thought and a novel technical support are provided for creating a nano circuit by 'bottom-to-up' self-assembly and breaking through the limit of conventional photolithography.

The invention discloses a manufacturing method for a high-speed PCB and the high-speed PCB, and the method comprises the steps: carrying out the stitching of at least two high-frequency base material core boards to form a first subboard; Carrying out the mixed pressing of the first subboard and at least one FR4 base material core board to form the high-speed PCB, wherein the outer core boards on two surfaces are respectively a high-frequency base material core board and an FR4 base material core board. The high-speed PCB is formed by the high-frequency base material core board and the FR4 base material core board in a mode of multiple mixed pressing, and the high-frequency base material core board serves as the outer core board. Because a high-frequency base material is low in dielectric constant and is low in loss factor, the transmission of high-frequency microwaves and other function signals can be achieved through manufacturing a radio frequency circuit on the first high-frequency base material core board, and the production cost is reduced at the same time. In addition, the second high-frequency base material core board is employed as the secondary outer core board, and a copper layer based on the second high-frequency base material core board is good in uniformity, thereby achieving the signal transmission through the combination of two sides, and greatly improving the signal transmission quality.

The invention discloses a preparation method of a nickel-plated fiber grating sensor. The method comprises the following steps: first of all, performing surface roughening treatment on a fiber grating, then performing impregnation processing by use of a colloid palladium solution, and then immersing the fiber grating into a dispergation solution to obtain a fiber containing palladium atoms; and immersing the fiber containing the palladium atoms into a plating liquid, plating a layer of metal on the fiber containing the palladium atoms by use of an oxidation reduction reaction to obtain an initially plated fiber, immersing the initially plated fiber into an electroplate solution for electroplating to obtain a metallic nickel galvanized coating, and finally, welding the electroplated fiber grating on a sensor substrate by use of laser to obtain a nickel-plated fiber grating sensor. Compared to the prior art, the method provided by the invention has the following advantages: the metallization of the fiber grating is realized, the fiber grating can be welded on the sensor substrate through a welding mode, relative movement between a fiber core layer and a fiber coating can be prevented, measuring data can truly reflect the stress and strain of an object to be measured, and the sensor accuracy is improved.

The invention relates to a coating for automotive upholstery, in particular to a high-wear-resistance coating for automotive upholstery and a preparation method thereof.The high-wear-resistance coating for automotive upholstery comprises a component A and a component B. The component A comprises, by weight, 2-20 parts of effect pigment; 10 to 60 parts of main resin; 3 to 30 parts of organic fluorine-silicon modified resin; 2-20 parts of a shaking auxiliary agent; 0.5 to 10 parts of an auxiliary agent; 10 to 40 parts of a solvent; a component B: 2 to 20 parts of diisocyanate; 0.2 to 2 parts of an auxiliary agent; and 2-20 parts of a solvent. Compared with the prior art, the modified aldehyde ketone resin is selected as a matrix, the adhesion performance between a paint film and a material can be effectively improved, and the prepared paint is good in water resistance and chemical resistance. The modified aldehyde ketone matrix resin has high molecular weight, can effectively improve the Flip-Flop value of the silver powder, enables the arrangement effect of the silver powder to be excellent, can improve the shielding power of the metallic pigment, and can effectively improve the water resistance, alcohol resistance and high weather resistance of a coating.

The invention discloses a preparation method for a molybdenum blank. The method comprises the following steps that (1), under the condition of 160-300 MPa, pressing is carried out on the molybdenum powder with the average particle size of 3-4 microns, moreover, the pressure is maintained for 3-20 minutes, and a green body is prepared; (2), low-temperature sintering is carried out; (3), medium-temperature sintering is carried out; and (4), high-temperature sintering is carried out, finally, cooling is carried out until the temperature reaches the room temperature, and the molybdenum blank is obtained. The molybdenum blank prepared by the preparation method is high in purity and uniform in tissue structure, and a prepared molybdenum foil is stable in performance.

The invention discloses a brazing method for silicon carbide ceramics. The brazing method comprises the following steps: carrying out surface treatment on the silicon carbide ceramics; depositing a first metal layer on the surface of the silicon carbide ceramics by adopting a vapor deposition method, and then depositing a second metal layer on the surface of the first metal layer to obtain the silicon carbide ceramics deposited with double metal layers, wherein the material of the first metal layer is selected from one of Ni, Ti, Fe or Zr, and material of the second metal layer is selected from Al; placing the silicon carbide ceramics needing to be connected in a vacuum sintering furnace, then placing a pure Al foil between the silicon carbide ceramics needing to be connected, starting heating when vacuum in the furnace reaches 10 <-1 > Pa, increasing the temperature to 600-800 DEG C, and conducting heat preservation for 10-60 min; and after heat preservation is finished, performing cooling to room temperature along with the furnace to obtain the silicon carbide ceramics subjected to brazing connection. According to the brazing method for the silicon carbide ceramics, the wettability of aluminum-based brazing filler metal to the silicon carbide material can be improved, the brazing temperature can be reduced, and the bonding strength of a brazed joint can be improved.

The invention belongs to the technical field of electroplating, and discloses a method for electroplating metal on the surface of an insulating base material. The method for electroplating the metal on the surface of the insulating base material comprises the following steps of S1, mixing resin, a solvent, a solid filler and a curing agent to prepare a coating; S2, coating the surface of the insulating base material with a resin coating, and forming a coating with fine gaps after the insulating base material is cured; S3, coating the resin coating in the S2 with a conductive substance, wherein the conductive substance can permeate into a gap structure of the resin coating, and a conductive film is formed after drying; and S4, placing the insulating base material containing the conductive film in the S3 in electroplating liquid for direct electroplating. According to the method for electroplating the metal on the surface of the insulating base material provided by the invention, the resin is used as an intermediate layer of an conductive layer formed by the insulating base material and the conductive substance, and the electroplated metal layer with excellent adhesive force on the base material can be obtained by growing and filling the metal in the fine gaps of the resin coating, so that the types of the used insulating base materials can be expanded, and wide application is realized.