The present invention provides a novel dicyclopentadiene-phenol and 2,6-dimethylphenol copolymer epoxy resin (molecular structure represented by a formula 1) with characteristics of excellent heat resistance, low dielectric constant Dk and low loss factor Df. The preparation of the novel dicyclopentadiene-phenol and 2,6-dimethylphenol copolymer epoxy resin comprises two steps: (1) carrying out a reaction on a (a1) dicyclopentadiene-phenol resin (formula 2) and (a2) 2,6-dimethylphenol in the presence of an acidic catalyst through a (a3) aldehyde-based compound to form a dicyclopentadiene-phenoland 2,6-dimethylphenol copolymer phenol formaldehyde resin; and (2) preparing the dicyclopentadiene-phenol and 2,6-dimethylphenol copolymer epoxy resin from the dicyclopentadiene-phenol and 2,6-dimethylphenol copolymer phenol formaldehyde resin and excess epichlorohydrin under a NaOH condition. According to the present invention, with the substitution of the copolymer epoxy resin into the glass fiber laminating plate formula composition, the popcorn cannot be generated after the pressure pot PCT for 2 h (water absorption test) and 288 DEG C tin welding heat resistance test for 10 min; and inthe formula, x is an integer of 0-5, y is an integer of 0-5, and R represents hydrogen, C1-C10 alkyl, phenyl, hydroxyphenyl and the like. The formulas are defined in the specification.