4results about How to "Low loss factor" patented technology

This invention discloses a method for preparing a low-loss ultrathin PTFE microwave dielectric substrate. The method includes the following steps: 1. Preparation of PTFE composite adhesive; 2. Impregnation with glass fiber cloth; 3. Lamination of sheet substrates. The PTFE microwave dielectric substrate prepared by this method has fine filler particles and a high filling rate, improving the uniformity of the ultrathin substrate thickness and dielectric constant. The substrate thickness is 0.065mm ± 0.008mm, and the dielectric constant at 10GHz is 2.95 ± 0.03. It also reduces the loss factor at high frequencies, with a loss factor ≤ 0.0011 at 10GHz. The preparation process is simple, easy to scale up for continuous production, and the microwave substrate exhibits excellent performance, meeting the stringent performance requirements of multilayer circuit boards in high-frequency communication applications.

The application provides a printed circuit board and a preparation method thereof, and the complete printed circuit board structure is formed by adopting glass as a PCB medium layer material and combining the step-by-step construction of a multi-layer build-up structure and a pressing process, high-density interconnection of a complex circuit is realized, and problems such as signal attenuation and poor reliability caused by insufficient dielectric properties, thermal stability or mechanical strength of a traditional PCB medium layer material in a high-frequency high-speed transmission scene are solved.

This application discloses a hybrid interposer and a method for forming the same. The method includes: providing a glass interposer, the glass interposer including a plurality of discrete functional regions and a cut-out region located between adjacent functional regions, the glass interposer including opposing first and second surfaces; forming a first bonding layer on the first surface of the glass interposer; providing a plurality of silicon interposers, each silicon interposer including opposing third and fourth surfaces, the third surface having a second bonding layer; bonding at least one silicon interposer to each functional region of the glass interposer, such that the second bonding layer and the first bonding layer are mixed-bonded; and forming a molding compound covering the silicon interposers on the first surface of the glass interposer, the molding compound exposing the fourth surface of the silicon interposers. This method improves the size and interconnect density of the interposer and reduces the warpage of the interposer.

The application discloses a water-absorbing and swelling rubber plugging agent, a plugging slurry and a plugging construction method thereof. The water-absorbing and swelling rubber plugging agent comprises the following components: water-absorbing and swelling rubber particles, multi-grade rigid plugging particles and fiber reinforced materials. The plugging slurry comprises base slurry and the water-absorbing and swelling rubber plugging agent. The plugging slurry adopts modified rubber particles with controllable swelling characteristics as a core plugging component, cooperates with multi-grade rigid particles, can form a stable self-adaptive plugging layer in a crack, effectively solves the problem of instability of the plugging layer under the respiration of the crack, and significantly improves the plugging pressure-bearing capacity and long-term plugging effect.