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Preparation and Application of Copolymer Epoxy Resin of Dicyclopentadiene-Phenol and 2,6-Dimethylphenol

A technology of dicyclopentadiene and dimethylphenol, applied in synthetic resin layered products, chemical instruments and methods, layered products, etc., can solve the problem of low bridging density, low molecular dipole moment, glass transition temperature Low problems such as low water absorption, excellent electrical properties, and excellent low dielectric constant Dk

Active Publication Date: 2020-09-22
NANYA PLASTICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the patent TW201038151, it is disclosed that 2,6-dimethylphenol and aldehydes are reacted under an acidic catalyst to synthesize a bifunctional 2,6-dimethylphenol-formaldehyde resin. This bifunctional 2,6-dimethylphenol-formaldehyde resin and cyclo Oxychloropropane (epichlorhydrion, ECH) synthesized bifunctional 2,6-dimethylphenol-formaldehyde epoxy resin in the presence of sodium hydroxide NaOH, 2,6-dimethylphenol-formaldehyde resin has a highly symmetrical chemical structure, low The characteristics of molecular dipole moment can effectively reduce the dielectric constant (Dk) and loss factor (Df). 2,6-Dimethylphenol is also a material with low dielectric constant (Dk) and low loss factor (Df). - The raw material of polyphenylene ether resin (PPE), polyphenylene ether PPE material has the characteristics of extremely low dissipation factor (Df), the smaller the dissipation factor, the smaller the signal transmission loss, and the bifunctional 2,6 synthesized in the aforementioned patent TW201038151 -Although dimethylphenol novolac epoxy resin can effectively reduce the dielectric constant (Dk) and damage factor (Df), the structure hardened product of bifunctional 2,6-dimethylphenol novolac epoxy resin has a bridging density Lower, lower glass transition temperature Tg and poor heat resistance

Method used

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  • Preparation and Application of Copolymer Epoxy Resin of Dicyclopentadiene-Phenol and 2,6-Dimethylphenol
  • Preparation and Application of Copolymer Epoxy Resin of Dicyclopentadiene-Phenol and 2,6-Dimethylphenol
  • Preparation and Application of Copolymer Epoxy Resin of Dicyclopentadiene-Phenol and 2,6-Dimethylphenol

Examples

Experimental program
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Synthetic example A

[0032] Synthesis Example A: (Synthesis of Copolymer Epoxy Resin A of Dicyclopentadiene-phenol and 2,6-Dimethylphenol)

[0033] Dicyclopentadiene-phenol resin (NPEH-772L, product name of Nanya Plastics Co., Ltd., softening point 85°C) 170g (1 mole of phenolic hydroxyl group), 170g of 2,6-dimethylphenol, solvent methyl isobutyl ketone (MIBK ) 30g, catalyst methanesulfonic acid MSA 1.7g mixed and heated up to 107°C, then 130g of 23% formaldehyde solution was added dropwise at 107°C for 3.5 hours, and then matured at 107°C for 1Hr. After the reaction, 49.5% NaOH aqueous solution was added 0.8g, neutralize until the pH value = 6-7, raise the temperature to 140°C for dehydration, raise the temperature to 185°C, and slowly reduce the vacuum to 5torr. The temperature and vacuum reached the set value of 185°C×5 torr and maintained for 1 hour. After cooling down and breaking the vacuum, add 550g of methyl isobutyl ketone as a solvent, stir at 80°C for 60 minutes to dissolve, add 50g of...

Synthetic example B

[0036] Synthesis Example B: (Synthesis of Copolymer Epoxy Resin B of Dicyclopentadiene-phenol and 2,6-Dimethylphenol)

[0037] Dicyclopentadiene-phenol resin (NPEH-772H, product name of Nanya Plastics Co., Ltd., softening point 110°C) 180g (1 mole of phenolic hydroxyl group), 170g of 2,6-dimethylphenol, solvent methyl isobutyl ketone (MIBK ) 30g, catalyst methanesulfonic acid MSA 1.7g mixed and heated up to 107°C, then 130g of 23% formaldehyde solution was added dropwise at 107°C for 3.5 hours, and then matured at 107°C for 1Hr. After the reaction, 49.5% NaOH aqueous solution was added 0.8g, neutralize until the pH value = 6-7, raise the temperature to 140°C for dehydration, raise the temperature to 185°C, and slowly reduce the vacuum to 5torr. The temperature and vacuum reached the set value of 185°C×5 torr and maintained for 1 hour. After cooling down and breaking the vacuum, add 550g of methyl isobutyl ketone as a solvent, stir at 80°C for 60 minutes to dissolve, add 50g o...

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Abstract

The present invention provides a novel dicyclopentadiene-phenol and 2,6-dimethylphenol copolymer epoxy resin (molecular structure represented by a formula 1) with characteristics of excellent heat resistance, low dielectric constant Dk and low loss factor Df. The preparation of the novel dicyclopentadiene-phenol and 2,6-dimethylphenol copolymer epoxy resin comprises two steps: (1) carrying out a reaction on a (a1) dicyclopentadiene-phenol resin (formula 2) and (a2) 2,6-dimethylphenol in the presence of an acidic catalyst through a (a3) aldehyde-based compound to form a dicyclopentadiene-phenoland 2,6-dimethylphenol copolymer phenol formaldehyde resin; and (2) preparing the dicyclopentadiene-phenol and 2,6-dimethylphenol copolymer epoxy resin from the dicyclopentadiene-phenol and 2,6-dimethylphenol copolymer phenol formaldehyde resin and excess epichlorohydrin under a NaOH condition. According to the present invention, with the substitution of the copolymer epoxy resin into the glass fiber laminating plate formula composition, the popcorn cannot be generated after the pressure pot PCT for 2 h (water absorption test) and 288 DEG C tin welding heat resistance test for 10 min; and inthe formula, x is an integer of 0-5, y is an integer of 0-5, and R represents hydrogen, C1-C10 alkyl, phenyl, hydroxyphenyl and the like. The formulas are defined in the specification.

Description

technical field [0001] The present invention relates to the copolymer epoxy resin of dicyclopentadiene-phenol and 2,6-xylenol and preparation method thereof, and this dicyclopentadiene-phenol and 2,6-xylenol Copolymer epoxy resin is substituted into the glass fiber laminate formula composition, and its hardened product exhibits good heat resistance, high glass transition temperature Tg, low dielectric constant Dk and low dissipation factor Df, and is suitable for high-performance printed circuit boards and semiconductor packaging High-reliability materials such as insulating materials for electronic components. Background technique [0002] In the patent TW216439, Dicyclopentadiene-phenol epoxy resin (Dicyclopentadiene-phenolpoxyresin) is an epoxy resin with a special skeleton structure. The structure contains alicyclic six-membered rings, five-membered rings and aromatic benzene rings. Dicyclopentadiene structure has excellent heat resistance, low polarity, low water absor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/08C08G8/24C08L63/00C08L61/06C08L35/06C08L71/12B32B27/04B32B17/04B32B17/06B32B15/14
Inventor 李政中吴振华余昭宪
Owner NANYA PLASTICS CORP
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