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Thermosetting polymer

A polymer and thermosetting technology, applied in lamination, layered products, lamination devices, etc., can solve the problem of large signal loss and achieve the effect of low loss factor

Inactive Publication Date: 2016-07-06
VENTEC ELECTRONICS SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Generally, as the frequency increases, the signal loss of epoxy polymers increases, especially when the frequency is above 5GHz, and as the temperature increases, the signal loss also increases, and the frequency of the antenna and base station increases When it gets higher, ordinary epoxy polymers can no longer meet the requirements, so new requirements are put forward for the polymers used in the substrate.

Method used

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  • Thermosetting polymer

Examples

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Effect test

Embodiment 1

[0018] The formula of the thermosetting polymer in this example is: polyphenylene ether (Resin630) 20g, triallyl isocyanurate (SR533R) 10g, styrene-butadiene-styrene block copolymer (Ricon181) 10g, silicon dioxide (Aerosil R972) 60g.

Embodiment 2

[0020] The formula of the thermosetting polymer in this example is: polyphenylene ether (Resin630) 20g, triallyl isocyanurate (SR533R) 10g, styrene-butadiene-styrene block copolymer (Ricon181) 10g, fused silica (Megasil525) 60g.

Embodiment 3

[0022] The formula of the thermosetting polymer in this example is: polyphenylene ether (Resin630) 10g, triallyl isocyanurate (SR533R) 20g, styrene-butadiene-styrene block copolymer (Ricon181) 20g, fumed silica (Aerosil R972) 60g.

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Abstract

The invention relates to a thermosetting polymer, which is used to make laminates, prepregs and pure films in high-frequency and high-speed applications. It is composed of polyarylether, olefin polymer, olefin block copolymer and filler. In parts by weight of solids, 5-40 parts of polyarylether, 5-30 parts of olefinic polymer, 5-30 parts of olefinic block copolymer, and 10-70 parts of inorganic filler are added to every 100 parts of thermosetting polymer. The filler is silica, fumed silica, titanium dioxide, strontium titanate, barium titanate, magnesium hydroxide, aluminum hydroxide, boron nitride, aluminum nitride, aluminum oxide, mica, kaolin, talc, One or more than one mixture of clay, Teflon and other substances. The laminate made of this thermosetting polymer has excellent comprehensive properties, including excellent thermal reliability, extremely superior electrical properties and extremely low water absorption. The glue solution of the present invention is suitable for substrates and prepregs used in high-frequency and high-speed applications and pure film.

Description

technical field [0001] The present invention relates to a thermosetting polymer, especially a thermosetting polymer that can be used in high frequency communication applications. Background technique [0002] In recent years, due to antennas, base stations and satellite communications requiring fast and undistorted signal transmission at high frequencies, especially in high frequency and high temperature and high humidity conditions, the signal transmission performance is consistent with normal conditions, so for high frequency applications Substrates pose new requirements. [0003] Generally, as the frequency increases, the signal loss of epoxy polymers increases, especially when the frequency is above 5GHz, and as the temperature increases, the signal loss also increases, and the frequency of the antenna and base station increases When the temperature rises higher, ordinary epoxy polymers can no longer meet the requirements, so new requirements are put forward for the pol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/12C08L53/02C08L47/00C08K5/3492C08K3/36C08K3/22B32B37/12B32B37/06B32B37/10B32B38/16
CPCC08L71/12B32B37/06B32B37/10B32B37/12B32B38/164C08K2201/003C08L2201/08C08L2205/03C08L53/02C08K5/34924C08K3/36C08K2003/2241C08L47/00
Inventor 王琢钟健人
Owner VENTEC ELECTRONICS SUZHOU
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