Flame-retardant low-dielectric-constant bonding sheet and preparation method thereof

A low dielectric constant, bonding sheet technology, used in film/sheet adhesives, adhesives, flat products, etc., can solve problems affecting the consistency and stability of high-frequency circuit signal transmission, bonding sheet Performance differences, unfavorable large-scale use, etc., to meet the needs of high-frequency signals and stability, simple preparation process, and high combination stability.

Active Publication Date: 2021-12-31
CHINA ELECTRONICS TECH GRP NO 46 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the PTFE substrate of the bonded sheet is obtained by impregnating glass fiber cloth with PTFE emulsion. Since the glass fiber cloth reinforcing material has a difference in warp and weft weaving density, the obtained bonded sheet must have the problem of differences in warp and weft performance, which has a high impact. Consistency and stability of frequency circuit signal transmission
At the same time, the adhesive sheet also has a flammable safety hazard, which is not conducive to large-scale use

Method used

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  • Flame-retardant low-dielectric-constant bonding sheet and preparation method thereof
  • Flame-retardant low-dielectric-constant bonding sheet and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0046] A flame-retardant low-dielectric constant adhesive sheet, the adhesive sheet includes a middle PTFE-based core layer and hydrocarbon resin surface layers on the upper and lower sides. Among them, the thickness of the PTFE-based core layer in the middle is 40 μm; the thickness of the hydrocarbon resin surface layers on the upper and lower sides are both 20 μm.

[0047] The mass fraction ratio of the raw materials of the PTFE-based core layer of the bonding sheet is 20wt% of silica ceramic powder with a D50 of 8 μm, 6wt% of silica ceramic powder with a D50 of 0.5 μm, and 70wt% of polytetrafluoroethylene , Ethylene-tetrafluoroethylene copolymer, 1.5wt% silane coupling agent, 2.5wt% ester surfactant.

[0048] The mass fraction ratio of the raw materials of the upper and lower hydrocarbon resin surface layers of the bonding sheet is: 15wt% silica inorganic filler, 10wt% magnesium oxide inorganic filler, 54wt% polybutadiene, butadiene-styrene copolymer , 20wt% decabromodiphe...

Embodiment approach 2

[0060] A flame-retardant low-dielectric-constant bonding sheet, the bonding sheet includes a PTFE-based core layer in the middle and hydrocarbon resin surface layers on both upper and lower surfaces. Among them, the thickness of the PTFE-based core layer in the middle is 70 μm; the thickness of the hydrocarbon resin surface layers on the upper and lower sides are both 50 μm.

[0061] The mass fraction ratio of the raw materials of the PTFE-based core layer of the bonding sheet is 28wt% of silica ceramic powder with D50 of 15 μm, 8wt% of silica ceramic powder with D50 of 5 μm, 60wt% of polytetrafluoroethylene, poly Chlorotrifluoroethylene, 1.5wt% silane coupling agent, 2.5wt% ester surfactant.

[0062] The mass fraction ratio of the raw materials of the upper and lower hydrocarbon resin surface layers of the bonding sheet is 30wt% silica inorganic filler, 14wt% alumina inorganic filler, 40wt% polybutadiene, polyisoprene, 14wt% Decabromodiphenylethane flame retardant, 2wt% azo ...

Embodiment approach 3

[0073] A flame-retardant low-dielectric-constant bonding sheet, the bonding sheet includes a PTFE-based core layer in the middle and hydrocarbon resin surface layers on both upper and lower surfaces. Among them, the thickness of the PTFE-based core layer in the middle is 120 μm; the thickness of the hydrocarbon resin surface layers on the upper and lower sides are both 80 μm.

[0074] The mass fraction ratio of the raw materials of the PTFE-based core layer of the bonding sheet is 32wt% of silica ceramic powder with a D50 of 12 μm, 15wt% of silica ceramic powder with a D50 of 2 μm, 48wt% of polytetrafluoroethylene, ethylene -Chlorotrifluoroethylene copolymer, 2wt% silane coupling agent, 3wt% ester surfactant.

[0075] The mass fraction ratio of the raw materials of the upper and lower hydrocarbon resin surface layers of the adhesive sheet is 35wt% silica inorganic filler, 20wt% zinc oxide inorganic filler, 32wt% polybutadiene, methacrylate-styrene copolymer , 12wt% tricresyl ...

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Abstract

The invention discloses a flame-retardant low-dielectric-constant bonding sheet and a preparation method thereof. The bonding sheet comprises a PTFE-based core layer in the middle and hydrocarbon resin surface layers on the upper surface and the lower surface; the PTFE-based core layer is reinforced by adopting two kinds of ceramic powder with different particle sizes, and the core layer film is obtained through an extrusion stretching forming process, so that the density and the elongation at break of the core layer can be obviously improved, and support is provided for the upper surface layer and the lower surface layer; the film is formed on the surface layer by adopting a multi-time blade coating process, so that defects are reduced, density is improved, and flame retardance is improved. The bonding sheet abandons the traditional glass fiber cloth reinforcing material, has the advantages of isotropy, high density, flame retardance, adjustable dielectric constant, lower loss, good bonding strength and mechanical property, can meet the interlayer bonding of a multi-layer circuit board, and is stable and reliable in signal transmission. The bonding sheet is wide in raw material source, simple in operation process, environment-friendly, easy for large-scale batch production, wide in application field and good in market prospect.

Description

technical field [0001] The invention relates to the technical field of microwave composite dielectric substrates, in particular to a flame-retardant low dielectric constant bonding sheet and a preparation method thereof. Background technique [0002] With the rapid development of 5G millimeter wave wireless communication technology, electronic components are developing in the direction of miniaturization, light weight, high frequency, multi-function and high reliability. The packaging density of components is greatly improved, and a large number of interconnection lines are concentrated , easily lead to a series of complex problems. Therefore, the design of the printed circuit board must minimize the length of the signal line and avoid parallel routes. The previous single-layer strip line has been difficult to meet the requirements. The multi-layer circuit board is an inevitable solution. The inevitable product of the development of capacity, portability and low consumption...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/24C09J7/30C09J11/04C09J133/00C09J147/00C08L27/18C08L23/08C08L27/12C08K3/36C08K3/22C08K9/00B29D7/01
CPCC09J7/245C09J7/30C09J147/00C09J133/00C09J11/04C08L27/18B29D7/01C09J2301/124C09J2427/006C09J2301/408C09J2301/41C09J2203/326C08K2003/2296C08K2201/014C08K2003/222C08K2201/005C08L23/0892C08K3/36C08K9/00C08K3/22C08L27/12C08L47/00C08L33/00
Inventor 王丽婧贾倩倩冯贝贝武聪金霞冯春明窦瑛李强洪颖
Owner CHINA ELECTRONICS TECH GRP NO 46 RES INST
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