Manufacturing method of glass fiber cloth reinforced copper-clad plate

Abstract

The invention belongs to the technical field of copper-clad plates, and particularly relates to a manufacturing method of a glass fiber cloth reinforced copper-clad plate. The manufacturing method comprises the following steps: preparing a reinforcing material, preparing modified resin, mixing the reinforcing material and the modified resin, impregnating, and semi-curing to obtain a prepreg, and finally, copper foil laminating, combining and pressing the prepreg into the copper-clad plate according to the product specification. By controlling the total integral number of the glass fiber cloth accounting for the copper-clad plate, adopting two times of preimpregnation treatment, reasonably controlling the proportion of the prepreg, performing surface treatment on the glass fiber cloth by utilizing the silane coupling agent, and impregnating the glass fiber cloth with the modified epoxy resin, the rigidity, the dielectric property and the insulation reliability of the copper-clad plate can be effectively improved, the process is reliable and simple to operate.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a method for manufacturing copper-clad laminates reinforced with glass fiber cloth. Background technique [0002] Copper clad laminate is a plate-like material formed by impregnating the reinforcing material with adhesive, covering one or both sides with copper foil, and hot pressing. It is called copper clad laminate (CCL), referred to as clad laminate. copper plate. Its only use is to make printed circuit boards (Printed Circuit Board, PCB). Reinforcement materials include cellulose paper, electronic glass fiber woven fabric, electronic glass fiber paper (non-woven fabric), synthetic fiber woven fabric, synthetic fiber non-woven fabric, and the like. The role of the reinforcing material is to make the copper clad laminate have a certain mechanical strength. [0003] With the development of high-performance, high-functionality and networking of compu...

AI Technical Summary

Problems solved by technology

At present, most copper-clad laminates use glass fiber cloth as a reinforcing material. However, the dielectric constant of glass fiber cloth is higher than that of resin substrates, and it occupies a higher volume fraction of copper-clad laminates, which directly affects the dielectric properties of copper-clad laminates.

At the same time, the laminated substrate made of alkali-free glass cloth impregnated with polytetrafluoroethylene dispersion emulsion and then hot-pressed has high insulation and high temperature resistance, but its rigidity is relatively poor, which affects the rigidity of the copper clad laminate as a substrate.

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