A method for preparing a low-loss and high-uniform adhesive sheet and a multi-layer microwave board

A bonding sheet, uniformity technology, applied in chemical instruments and methods, film/sheet adhesives, non-polymer adhesive additives, etc., can solve waveform distortion, low uniformity, and large thermal expansion coefficient and other problems, to reduce the thermal expansion coefficient, expand the scope of application, and increase the effect of flame retardant

Active Publication Date: 2022-04-12
CHINA ELECTRONICS TECH GRP NO 46 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, its large thermal expansion coefficient, non-hydrophilic and non-oleophilic surface, and high melting point (327°C) limit its application in adhesive sheets.
[0003] The new bonding sheet involved in Chinese patent CN212451274U includes a fluorine-containing resin layer and has a first surface and a second surface oppositely arranged, and the dielectric loss of the thermosetting resin arranged on the first surface and the second surface is less than or equal to 0.005, higher than Material requirements for microwave circuits, and the patent does not mention the thermal expansion coefficient performance of the bonding sheet
In high-frequency applications, the weaving structure of glass fiber cloth will cause differences in dielectric constant in small areas, which will cause "glass fiber effect", affect the stability and reliability of signal transmission, and cannot achieve high uniformity of dielectric constant ; and the thickness of the substrate formed by impregnation of glass fibers also fluctuates due to the weaving of glass fibers, resulting in low uniformity of dielectric constant
Multi-layer microwave boards made of adhesive sheets with low uniformity will cause wave distortion and other problems in high-frequency signal transmission.

Method used

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  • A method for preparing a low-loss and high-uniform adhesive sheet and a multi-layer microwave board
  • A method for preparing a low-loss and high-uniform adhesive sheet and a multi-layer microwave board

Examples

Experimental program
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Effect test

Embodiment 1

[0049] Embodiment 1, the material components of Embodiment 1 are all parts by weight.

[0050] The components of the fluorine-based composite film of the bonding sheet are composed of 70 parts of polytetrafluoroethylene, 85 parts of filler I spherical SiO with an average particle size of 0.5 μm 2 composition, the coupling agent added at the same time is 3 parts of phenyltrimethoxysilane, and the surfactant is 5 parts of octylphenol polyoxyethylene ether. The thickness of the upper thermosetting resin film and the lower thermosetting resin film of the adhesive sheet are equal, both are 5 μm, and the components are 100 parts of thermosetting resin polybutadiene, 5 parts of initiator dicumyl peroxide, 65 parts of average particle size Filler II ellipsoidal SiO with a diameter of 10 μm 2 , 20 parts of thermoplastic elastomer styrene-butadiene-styrene copolymer, 1 part of flame retardant alkyl phosphate and 1 part of zinc dialkyldithiophosphate antioxidant, 1 part of plasticizer o...

Embodiment 2

[0062] Embodiment 2, the material components of embodiment 2 are all parts by weight.

[0063] The components of the fluorine-based composite film of the bonding sheet are composed of 80 parts of a copolymer of perfluoropropyl perfluorovinyl ether and polytetrafluoroethylene, and 87 parts of filler I ellipsoid Al with an average particle size of 8 μm. 2 o 3 composition, the coupling agent added at the same time is 3.5 parts of aminopropyltrimethoxysilane, and the surfactant is 7 parts of nonylphenol polyoxyethylene ether. The thickness of the upper thermosetting resin film and the lower thermosetting resin film of the bonding sheet are different, respectively 20 μm and 30 μm, and the components are 140 parts of thermosetting resin modified polybutadiene, 7 parts of initiator diisopropyl hydroperoxide Benzene, 100 parts of filler II irregular shape perovskite ceramic powder with an average particle size of 13 μm, 40 parts of thermoplastic elastomer styrene-butadiene rubber, 3 ...

Embodiment 3

[0075] Embodiment 3, the material components of embodiment 3 are all parts by weight.

[0076] The components of the fluorine-based composite film of the bonding sheet are composed of 85 parts of polyvinylidene fluoride, 88 parts of filler I with an average particle size of 30 μm, and irregularly shaped TiO 2composition, the coupling agent added at the same time is 4 parts of methyltrimethoxysilane, and the surfactant is 9 parts of octylphenol polyoxyethylene ether. The thickness of the upper layer thermosetting resin film and the lower layer thermosetting resin film of the bonding sheet are equal to 35 μm, and the components are 180 parts of thermosetting resin polyisoprene, 9 parts of initiator di-tert-butyl peroxide, 150 parts Filler II spherical mullite ceramic powder with an average particle size of 15 μm, 60 parts of thermoplastic elastomer ethylene propylene rubber, 6 parts of flame retardant triazine and its derivatives, 6 parts of antioxidant alkyl phenothiazine, 6 pa...

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Abstract

The invention relates to a low loss and high uniformity adhesive sheet and a method for preparing a multilayer microwave board. The adhesive sheet is composed of an upper thermosetting resin film and a lower thermosetting resin film of a fluorine-based composite film; the upper thermosetting resin film and The components of the lower thermosetting resin film are thermosetting resin, initiator and filler. In order to achieve specific functions, thermoplastic elastomers, flame retardants, antioxidants and plasticizers can be added to it; among them, thermosetting resin and thermoplastic elastic The body is the matrix, the cross-linking agent, flame retardant, antioxidant and plasticizer are the additives, and the filler is the reinforcing material; the additives and reinforcing materials are randomly distributed in the matrix; the thermosetting resin film is semi-cured or uncured. In the cured state, it has certain fluidity and is prepared on the upper and lower surfaces of the fluorine-based composite film through a coating process. The components of the invention exhibit high uniformity and do not contain fiberglass cloth, thus avoiding the impact of the "glass fiber effect" on high-frequency signal transmission.

Description

Technical field [0001] The invention relates to the technical field of microwave copper-clad laminates, in particular to a low-loss and high-uniformity adhesive sheet and a method for preparing a multi-layer microwave board. Background technique [0002] With the rapid development of electronic information technology, microwave circuit components are moving towards integration and miniaturization. Ordinary single-layer microwave composite dielectric substrates can no longer meet actual requirements. Multi-layer microwave composite substrates composed of single-layer substrates and adhesive sheets Composite dielectric substrates have gradually become a hot spot in research and application. At the same time, the increase in transmission signal frequency has also put forward higher requirements for the loss factor of dielectric materials. The traditional epoxy resin system has been gradually eliminated by high-end applications due to its high loss factor. Fluorine-based resin ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/24C09J7/30C09J11/04C09J147/00C09J125/06C09J109/06C09J123/16C09J153/02C08K7/00C08K7/18C08K3/013C08K3/22C08K9/06C08L27/16C08L27/18C08L27/14B32B27/30B32B27/20B32B27/06B32B33/00B32B7/12B29D7/00
CPCC09J7/245C09J7/30C09J147/00C09J11/04C08L27/18C08L27/16C08K9/06C08K7/00C09J125/06B32B27/304B32B27/20B32B27/06B32B33/00B32B7/12B29D7/00C09J2301/124C09J2427/006C09J2203/326C09J2301/408C09J2301/41C08K2003/2227C08K2003/2241B32B2307/3065B32B2307/714B32B2307/734C08L53/02C08K7/18C08L71/02C08L9/06C08K3/013C08K3/22C08L23/16C08L27/14
Inventor 贾倩倩冯春明王军山武聪李攀王丽音闫宏李强洪颖
Owner CHINA ELECTRONICS TECH GRP NO 46 RES INST
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