2results about How to "Increased strain sensitivity" patented technology

This invention discloses an FBG strain sensor based on misaligned fusion spliced ​​coreless optical fiber and its fabrication method. The sensor comprises an input single-mode fiber, multiple segments of coreless optical fiber, and an output single-mode fiber connected sequentially. The input single-mode fiber is fused together with the first segment of the coreless fiber in a misaligned manner, and the next segment of the coreless fiber is fused together with the previous segment in a misaligned manner, with the misalignment direction of the next segment opposite to that of the previous segment, but the misalignment distance being the same. The output single-mode fiber and the last segment of the coreless fiber are fused together axially. The central axes of the input and output single-mode fibers are collinear, and the cores of the input and output single-mode fibers are connected by a photolithographically written straight waveguide. A fiber Bragg grating is then optically etched along the straight waveguide. This invention uses femtosecond lasers to fabricate the FBG on the misaligned fiber structure, increasing the structure's strain response and making the strain sensitivity of the FBG on this structure higher than that of an FBG fabricated on ordinary silica optical fiber.

The invention discloses a thick-film resistor with high strain sensitivity and low temperature sensitivity and a preparation method thereof, and belongs to the technical field of functional materials, electronic elements and sensors. The preparation problem of the thick-film resistor with high strain sensitivity and low resistance temperature coefficient is solved. The preparation method comprises the following steps: weighing lead oxide, boron oxide and silicon dioxide, uniformly mixing, completely melting into molten glass, carrying out water quenching, and carrying out ball milling on the water-quenched glass slag to obtain lead borosilicate glass powder; weighing RuO powder and lead borosilicate glass powder, adding an organic carrier, mixing, adding into a three-roller grinder, and fully grinding to be fine and uniform, so as to obtain resistance paste; and coating a cleaned substrate with the resistance paste in a silk-screen printing manner, and in an air atmosphere, controlling the sintering peak temperature within the range of 750-950 DEG C and the heat preservation time of the sintering peak temperature within the range of 10-360 minutes to obtain the thick-film resistor with both high strain sensitivity and low temperature sensitivity.