189 results about "Batch fabrication" patented technology

The present invention relates to a Microelectro mechanical system structure. More specifically the invention relates to utilize a sacrificial layer to fabricate an air bearing structure, followed by forming an aperture, and reducing the aperture to nano-scale by electroplating. And then, by using of two thick film photoresist films for twice electroplating fabrication, for fabricate metal microcoils having high aspect ratio structure and interconnection metal line, to achieve efficiencies of utilizing area and reducing resistance. Moreover, proceed lithography depends on different portions and exposure dose. Then form a single photoresist film to have a specific dimension and thickness structure, finally, by using reflow process, forming a magneto-optic (MO) pickup head comprises of Supersphere Solid Immersion Lens (SSIL), nano-aperture, microcoils and air bearing by using an integrated fabrication, with advantages such as no high cost device and precise apparatus are required in the process of fabrication, mass production in batch fabrication, without step of assembly, for high-density data storage and rewritable record.

The invention relates to a cantilever beam acceleration transducer manufactured by micro-machining on a single side of a single silicon chip and a manufacturing method. The acceleration transducer is characterized in that: an accelerometer is manufactured by micro-mechanical single side machining through the single silicon chip, so that stress caused by the bonding process of a plurality of chips and different materials is avoided. In order to realize a single side-machined cantilever beam sensitive structure, the cantilever beam structure is released by transversely etching the bottom of the cantilever beam by an anisotropic corrosion method after deep structural etching. The structure provides air squeeze-film damping and mechanical overload protection in a sensitive direction, solves the problem of the absence of air squeeze-film damping in the vertical sensitive direction of the conventional structure and prevents parasitic signal interference caused by structural resonance in the vertical direction. The acceleration transducer has the characteristics of particular suitability for measuring a high g value, simple structure, small size of the chip and the like. Simultaneously, a single side process can use low-cost single throwing silicon chips, is suitable for low-cost mass manufacturing and has higher performance and wide application prospects.