MEMS vacuum gauge and preparation method thereof
A vacuum gauge and substrate technology, applied in vacuum gauges, welding equipment, precision positioning equipment, etc., can solve the lower limit of vacuum degree limit measurement, the upper limit value of vacuum degree limit measurement, and the increase in specific gravity of resistance heating body, etc. problems, to achieve the effect of improving reliability, good consistency, and small size
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[0042] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0043] Such as figure 1 As shown, one aspect of the present invention provides a preparation method S100 of a MEMS vacuum gauge, and the packaging method S100 includes:
[0044] S110. Provide a first substrate and a second substrate respectively.
[0045] Specifically, such as image 3 As shown, in this embodiment, a low-resistance silicon wafer with a thickness of 200 μm to 1000 μm is selected as the first substrate 110 , and more preferably, a low-resistance silicon wafer with a thickness of 300 μm is used as the first substrate 110 . Such as Figure 7 As shown, in this embodiment, single crystal silicon with a thickness of 200 μm to 1000 μm is selected as the second substrate 120 , and more preferably, an N-type sil...
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