Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Printed wiring board chemical copper plating solution

A printed circuit board and electroless copper plating technology, which is applied in the fields of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of poor stability of the plating solution, harm to the human body and the environment, and low plating speed, and achieve long service life of the plating solution, The effect of a wide range of process parameters

Inactive Publication Date: 2014-11-19
YANTAI HENGDIKE ENERGY TECH
View PDF0 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Electroless copper plating is widely used in the electronics industry. After electroless copper plating is used to make the activated non-conductor surface conductive, double-sided or multi-sided printed circuit boards with through holes can be manufactured. Printed circuit boards are "the mother of electronic system products". Electroplating a thicker copper layer on the copper base can ensure its solderability, protection, conductivity, and wear resistance. Currently, the most widely used system in the electronics industry is the system with formaldehyde as the reducing agent. Due to the plating speed of this process low, poor stability of the plating solution, and volatile formaldehyde vapor is harmful to the human body and the environment, so it is urgent to find a new reducing agent as a substitute for formaldehyde

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] An electroless copper plating solution for printed circuit boards comprises the following raw materials in parts by mass: 1500 grams of copper sulfate pentahydrate, 3500 grams of sodium hypophosphite, 1000 grams of boric acid, 1600 grams of sodium citrate complexing agent, and 5 grams of stabilizer p-benzenesulfonamide , 150 grams of palladium chloride catalyst, 10 grams of polyethylene glycol surfactant, 1800 grams of sodium hydroxide, 32 kilograms of deionized water;

[0014] The preparation method is as follows: add 32 kilograms of deionized water in parts by mass to a container with a stirrer, start stirring, and add copper sulfate pentahydrate in parts by mass of 1500 grams, sodium hypophosphite in parts by mass of 3500 grams, Mass parts are 1000 grams of boric acid, mass parts are 1600 grams of sodium citrate complexing agent, mass parts are 5 grams of stabilizer p-benzenesulfonamide, mass parts are 150 grams of palladium chloride catalyst, mass parts are 10 grams ...

Embodiment 2

[0016] An electroless copper plating solution for printed circuit boards comprises the following raw materials in parts by mass: 1300 grams of copper sulfate pentahydrate, 3200 grams of sodium hypophosphite, 1200 grams of boric acid, 1200 grams of potassium sodium tartrate, 8 grams of stabilizer 2-mercaptobenzothiazole, 90 grams of nickel sulfate hexahydrate catalyst, 8 grams of polyethylene glycol surfactant, 1700 grams of sodium hydroxide, 31 kilograms of deionized water;

[0017] The preparation method is as follows: add 31 kilograms of deionized water in parts by mass to a container with a stirrer, start stirring, and add copper sulfate pentahydrate in parts by mass of 1300 grams, sodium hypophosphite in parts by mass of 3200 grams, Parts by mass are 1200 grams of boric acid, parts by mass of potassium sodium tartrate of 1200 grams, parts by mass of stabilizer 2-mercaptobenzothiazole, parts by mass of 90 grams of nickel sulfate hexahydrate catalyst, parts by mass of 8 grams...

Embodiment 3

[0019] An electroless copper plating solution for printed circuit boards comprises the following raw materials in parts by mass: 1000 grams of copper sulfate pentahydrate, 3000 grams of sodium hypophosphite, 1500 grams of boric acid, 1200 grams of N-hydroxyethylethylenediamine triacetate complexing agent, 600 grams of triisopropanolamine complexing agent, 10 grams of sodium diethyldithiocarbamate stabilizer, 50 grams of nickel sulfate hexahydrate catalyst, 5 grams of polyethylene glycol sulfide surfactant, 1500 grams of sodium hydroxide, 30 kg of deionized water;

[0020] The preparation method is as follows: add 30 kilograms of deionized water in parts by mass to a container with a stirrer, start stirring, and add copper sulfate pentahydrate in parts by mass of 1000 grams, sodium hypophosphite in parts by mass of 3000 grams, Parts by mass are 1500 grams of boric acid, parts by mass of N-hydroxyethylethylenediamine sodium triacetate complexing agent of 1200 grams, parts by mas...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a printed wiring board chemical copper plating solution which is prepared from the following raw materials in parts by mass: 10-15 parts of chalcanthite, 30-35 parts of sodium hypophosphite, 10-15 parts of boric acid, 12-18 parts of complexing agent, 0.05-0.1 part of stabilizer, 0.5-1.5 parts of catalyst, 0.05-0.1 part of surfactant, 15-18 parts of sodium hydroxide and 300-320 parts of deionized water. By using the sodium hypophosphite as the main reducer, the chalcanthite, boric acid, complexing agent, stabilizer, catalyst, surfactant and sodium hydroxide are added to prepare the chemical copper plating solution; and the chemical copper plating solution is diluted to be used for chemical copper plating on the printed wiring board, thereby achieving the effects of the metallization of the non-conductor surface of the activated printed wiring board and the metallization in the printed wiring board holes. The printed wiring board chemical copper plating solution has the advantages of wide technological parameter range, long service life and no harmful formaldehyde vapor.

Description

technical field [0001] The invention relates to the technical field of electroless copper plating, in particular to an electroless copper plating solution for printed circuit boards. Background technique [0002] Electroless copper plating is widely used in the electronics industry. After electroless copper plating is used to make the activated non-conductor surface conductive, double-sided or multi-sided printed circuit boards with through holes can be manufactured. Printed circuit boards are "the mother of electronic system products". Thickened copper layer is electroplated on the copper base to ensure its solderability, protection, conductivity, and wear resistance. Currently, the most widely used system in the electronics industry is the system with formaldehyde as the reducing agent. Due to the plating speed of this process Low, poor stability of plating solution and volatile formaldehyde vapor is harmful to human body and environment, so it is urgent to find a new redu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40H05K3/00
Inventor 修建东刘方旭
Owner YANTAI HENGDIKE ENERGY TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com