Method for electroplating metal on surface of insulating base material

Abstract

The invention belongs to the technical field of electroplating, and discloses a method for electroplating metal on the surface of an insulating base material. The method for electroplating the metal on the surface of the insulating base material comprises the following steps of S1, mixing resin, a solvent, a solid filler and a curing agent to prepare a coating; S2, coating the surface of the insulating base material with a resin coating, and forming a coating with fine gaps after the insulating base material is cured; S3, coating the resin coating in the S2 with a conductive substance, wherein the conductive substance can permeate into a gap structure of the resin coating, and a conductive film is formed after drying; and S4, placing the insulating base material containing the conductive film in the S3 in electroplating liquid for direct electroplating. According to the method for electroplating the metal on the surface of the insulating base material provided by the invention, the resin is used as an intermediate layer of an conductive layer formed by the insulating base material and the conductive substance, and the electroplated metal layer with excellent adhesive force on the base material can be obtained by growing and filling the metal in the fine gaps of the resin coating, so that the types of the used insulating base materials can be expanded, and wide application is realized.

Description

technical field [0001] The invention belongs to the technical field of electroplating, and in particular relates to a method for electroplating metal on the surface of an insulating substrate. Background technique [0002] With the rapid development of electronic information technology, especially the industrialization of integrated circuits has become an important reference to measure a country's industrial capabilities, and in the manufacturing process of electronic products, a large amount of insulating materials, such as silicon used as chips, need to be used Materials, epoxy resin reinforced glass fiber cloth and polyimide materials for printed circuit boards, these insulating substrates mostly play the role of carrying conductive patterns, so it is necessary to metallize these insulating substrates to make them have excellent electrical properties performance. At present, there are two main methods of metallizing insulating substrates. One is the method of pressing, t...

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Problems solved by technology

Both Chinese patents "A Method for Direct Electroplating Circuit Board Based on Graphene Film Formation" (publication number CN110351956A) and "A Direct Electroplating Conductive Liquid and Its Preparation Method" (publication number CN103103950A) all describe the need for ultrasonic treatment of the solution And need to add a certain amount of dispersant, these treatments not only increase the process but also have the defect of low plating efficiency

The general process of using an organic conductive polymer as a conductive film is to firstly treat the insulating substrate with an inorganic oxide to charge it, and then adsorb the conductive polymer through the charge to form a film. This process generally requires one end of the insulating substrate There is a metal layer (copper foil), and it is necessary to ensure that the copper foil is in contact with the plating solution during the electroplating process, so that the metal begins to grow from the copper foil. Otherwise, no matter how much voltage is applied, the metal cannot be deposited. In addition, due to the organic conductivity The resistance of polymers is high, which will slow down the metal plating rate and greatly limit the production efficiency

For example, the Chinese patent "Method for Electroplating Metal on the Surface of Insulating Substrate" (publication number CN108977862A) and "A Method for Direct Electroplating on Insulating Substrate" (publication number CN107723764A) have both adopted metal ion activation of organic conductive polymer film to realize The method of direct electroplating on an insulating substrate, its main disadvantage is that the process is relatively cumbersome, and steps such as adjustment, neutralization, and activation are required, the rate of copper deposition is low, and copper foil is required for induced deposition.

[0004] In addition, with the practical application of 5G technology, the signal integrity problem caused by the signal loss carried by high-frequency electromagnetic waves has become more and more serious, so it is required to use low dielectric constant insulating substrates, such as polytetrafluoroethylene (PTFE), ceramic substrates, etc., but these materials have extremely low surface energy, and it is still a challenging problem to form a conductive layer with stable, good adhesion and good conductivity on the surface

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