2results about How to "Low dielectric" patented technology

The application belongs to the technical field of resin materials for copper-clad plates, and particularly relates to a carbon-hydrogen resin composition for prepreg and a preparation method thereof. The carbon-hydrogen resin composition is prepared from the following raw materials in parts by mass: hyperbranched modified prepolymer resin 90-100 parts, inorganic filler 15-25 parts, silane coupling agent 0.2-0.4 parts, crosslinking agent 10-20 parts, initiator 0.8-1.5 parts, dibutyltin dilaurate 0.1-0.3 parts, antioxidant 0.5-1 part, and toluene 50-80 parts. The carbon-hydrogen resin composition prepared by the application has low dielectricity, high thermal conductivity, high heat resistance, high toughness, and excellent processing forming property.

The present application relates to the technical field of insulation film, especially to the field of IPC G03F, more particularly to a preparation method of a photosensitive integrated circuit stacked insulation film. The present application is based on the actual market demand, and scientifically designs the formula of the stacked insulation film material by combining basic research with industrial development, so as to realize the manufacturing of the fine line laminated adhesive film with low thermal expansion coefficient, high frequency low dielectric, low loss, high bonding force. The material has good performance in insulation, mechanics, heat conduction and the like, and does not depend on the expensive precision drilling equipment imported, and these performances enable it to replace ABF in the electronic field such as microchip integrated insulation technology, and have wide application prospect.