13results about How to "Low dielectric" patented technology

The invention discloses a triazine biphenyl compound, a composition, a cured product as well as a preparation method and application of the triazine biphenyl compound, the composition and the cured product. The compound is phenolic resin with a triazine biphenyl structure obtained through condensation polymerization of p-cyanobiphenol; the phenolic resin respectively reacts with an epichlorohydrin compound and an acyl chloride compound to obtain epoxy resin and active ester with a triazine biphenyl structure, and the epoxy resin and the active ester can be self-cured or cured under the action of an imidazole accelerator; in the preparation process, triazine ring (containing nitrogen) is introduced as a node, trifunctional epoxy resin with a rigid aromatic structure as an arm and an active ester curing agent (the same skeleton) are prepared into a thermosetting cross-linked network by adopting a non-polar cross-linking scheme, and a three-dimensional network intrinsic microporous structure is formed through in-situ cross-linking regulation and control of a rigid long-arm branched unit. Further, the bottlenecks of low dielectric property, high temperature resistance, flame retardance and the like are broken through, and the cured material has the characteristics of excellent flame retardance, high temperature resistance and low dielectric property.

The invention relates to the technical field of composite materials, in particular to a low-dielectric-property light high-frequency wave-transparent composite material and a preparation method thereof.The key point of the technical scheme is that the preparation method comprises the following steps that S1, epoxy resin, a curing agent and an accelerant are added into a solvent and stirred to be evenly dissolved, then hollow glass microspheres are added and stirred to be evenly dispersed, and a mixture A is obtained; obtaining a resin glue solution; s2, immersing glass fiber cloth into the resin glue solution, taking out the glass fiber cloth after the glass fiber cloth is completely immersed, and baking the glass fiber cloth to obtain a prepreg; s3, stacking the prepregs to obtain a composite layer, and performing hot pressing and cooling on the composite layer to obtain a target product, wherein the curing agent comprises one or more of active ester, styrene maleic anhydride resin, benzoxazine resin and bismaleimide resin. The composite material provided by the invention has the characteristics of low density, low dielectric, high strength and low dielectric loss, and fully meets the requirements of 5G communication era on consumer electronic product shells and peripheral products thereof.

The invention discloses a low-dielectric low-loss high-strength borosilicate glass ceramic composite material and a preparation method thereof, and belongs to the technical field of borosilicate glass ceramic composites.The low-dielectric low-loss high-strength borosilicate glass ceramic composite material is prepared from, by weight, 70% of low-alkali borosilicate glass ceramics with the low borosilicate ratio, 29% of Al2O3 and 1% of Bi2O3. The preparation method comprises the following steps: preparing low-alkali borosilicate glass ceramics with a high borosilicate ratio, melting the low-alkali borosilicate glass ceramics with the high borosilicate ratio and amorphous SiO2 at a set temperature to obtain the required low-alkali borosilicate glass ceramics with the low borosilicate ratio, and finally mixing and ball-milling the crushed and ground low-alkali borosilicate glass ceramics with Al2O3 and Bi2O3 to obtain the low-alkali borosilicate glass ceramics with the low borosilicate ratio. And finally, the borosilicate glass ceramic composite material is sintered at the temperature of 880-900 DEG C. The borosilicate microcrystalline glass ceramic composite material is low in dielectric, low in loss and high in strength.

The invention discloses a carrier-like plate for an HDI (high density interconnector) process and a preparation method and application thereof, and belongs to the technical field of high polymer materials, BT (bismaleimide) resin and o-methyl novolac epoxy resin are compounded and modified to serve as matrix resin of a base material, and hexagonal boron nitride and aluminum oxide gel which are obtained through modification treatment are added into a resin system to prepare glue; the preparation method comprises the following steps: preparing a carrier-like copper foil substrate, dipping glue and glass fiber cloth, baking to obtain a prepreg, and finally carrying out hot-pressing treatment on the prepreg to obtain the carrier-like copper foil substrate for the HDI process. The copper-clad substrate for the carrier plate for the HDI process can simultaneously meet the requirements of electronic products for excellent heat resistance, low thermal expansion coefficient, high thermal conductivity, low dielectric and the like, and is high in strength and small in plate warping.

There is to provide silica particles having a dielectric loss tangent of 0.01 or less at 1GHz and satisfying the requirements (i), (ii) and (iii): (i)an average primary particles diameter of 5 nm to 120 nm; (ii) a ratio of a specific surface area by water vapor adsorption (SH2O) to a specific surface area by nitrogen adsorption (SN2); i.e., (SH2O / SN2) of 0.6 or less; and (iii) a total silanol group content of 5% or less as determined by the following Formula (1): totalsilanolgroupcontent%=Q2×2 / 4+Q3×1 / 4+Q4×0 / 4 [in Formula (1), each of Q2, Q3 and Q4 is the proportion (%) of the peak areas derived from silicon atom structures], and a silica dispersion.

The invention relates to the technical field of composite materials, in particular to a lightweight high-toughness high-frequency wave-transparent composite material and a preparation method thereof.The preparation method is characterized by comprising the following steps that S1, modified epoxy resin, a low-polarity flexibilizer, a low-polarity curing agent and an accelerant are added into a solvent and stirred to be uniform and dissolved, and a mixture A is obtained; then adding borosilicate hollow glass microspheres, and uniformly stirring and dispersing to obtain a resin glue solution; s2, immersing glass fiber cloth into the resin glue solution, taking out the glass fiber cloth after the glass fiber cloth is completely immersed, and baking the glass fiber cloth to obtain a prepreg; s3, stacking a plurality of prepregs, placing the prepregs in a mold for mold pressing, then demolding, and placing the prepregs in a shaping jig for cooling to obtain a target product; wherein the low-polarity toughening agent comprises one or more of polybutadiene, epoxidized polybutadiene, a butadiene-styrene copolymer and hydroxyl-terminated polybutadiene. The material has the advantages of being low in dielectric loss, high in toughness and suitable for compression molding.

The invention provides a resin composition which can effectively increase the glass transition temperature under the condition of maintaining the low-dielectric electrical specification. The resin composition comprises a first resin, a second resin, a divinylbenzene cross-linking agent, a halogen-free flame retardant, spherical silicon dioxide and a siloxane coupling agent, wherein the first resin is formed by polymerizing a monomer mixture comprising styrene, divinylbenzene and ethylene; the second resin comprises polyphenyl ether resin modified by bismaleimide;

The application belongs to the technical field of resin materials for copper-clad plates, and particularly relates to a carbon-hydrogen resin composition for prepreg and a preparation method thereof. The carbon-hydrogen resin composition is prepared from the following raw materials in parts by mass: hyperbranched modified prepolymer resin 90-100 parts, inorganic filler 15-25 parts, silane coupling agent 0.2-0.4 parts, crosslinking agent 10-20 parts, initiator 0.8-1.5 parts, dibutyltin dilaurate 0.1-0.3 parts, antioxidant 0.5-1 part, and toluene 50-80 parts. The carbon-hydrogen resin composition prepared by the application has low dielectricity, high thermal conductivity, high heat resistance, high toughness, and excellent processing forming property.

The present application relates to the technical field of insulation film, especially to the field of IPC G03F, more particularly to a preparation method of a photosensitive integrated circuit stacked insulation film. The present application is based on the actual market demand, and scientifically designs the formula of the stacked insulation film material by combining basic research with industrial development, so as to realize the manufacturing of the fine line laminated adhesive film with low thermal expansion coefficient, high frequency low dielectric, low loss, high bonding force. The material has good performance in insulation, mechanics, heat conduction and the like, and does not depend on the expensive precision drilling equipment imported, and these performances enable it to replace ABF in the electronic field such as microchip integrated insulation technology, and have wide application prospect.

The invention provides ternary copolymerized polyimide, a polyimide film and a preparation method and application thereof, the ternary copolymerized polyimide is prepared from the following monomer raw materials through polymerization and imidization reaction: diamine monomer: 9, 9-bis (4-aminophenyl) fluorene; the dianhydride monomer comprises hexafluorodianhydride and 9, 9-bis (3, 4-dicarboxyphenyl) fluorene dianhydride; wherein the total molar weight ratio of the diamine monomer to the dianhydride monomer is 1: 1; in the dianhydride monomer, the molar ratio of the 6FDA to the BPAF is (0.8-1.2): 1. According to the present invention, the traditional thought that the transparency is improved by introducing the fluorenyl monomer at the low content is abandoned, and the high-proportion rigid double fluorenyl structure (BAFL and BPAF) and the flexible fluorine-containing structure (6FDA) are innovatively adopted to perform the ternary polymerization at the specific ratio so as to produce the significant synergistic effect; the obtained polyimide film has high heat resistance (Tg is greater than or equal to 420 DEG C), low thermal expansion coefficient (CTE is less than or equal to 20 ppm / K), low dielectric constant (Dk is less than or equal to 3.5 under 10 GHz) and high transparency (light transmittance at 450 nm is greater than or equal to 85%), and is especially suitable for high-performance flexible display substrates.

The invention relates to the field of preparation of high polymer materials, in particular to a copolymer, a resin composition and application of the resin composition. The copolymer includes a monofunctional phenol compound residue, an aromatic dicarboxylic acid or an acyl halide residue thereof, a bifunctional phenol compound residue, and a polyfunctional phenol resin residue. The resin composition composed of the copolymer and the epoxy resin has the characteristics of high heat resistance, low dielectric, low warpage and low moisture absorption, and can be used for sealing of electrical and electronic components or circuit substrates.

The invention discloses a low-viscosity low-dielectric photosensitive resin capable of being used for UV ink-jet printing. The low-viscosity low-dielectric photosensitive resin is prepared from 10 to 40 percent of vinyl polysiloxane, 26 to 43 percent of tri (2-hydroxyethyl) isocyanuric acid triacrylate, 28.5 to 44 percent of isobornyl methacrylate, 1 to 2 percent of a photoinitiator and 0.5 to 1 percent of a dispersing agent, the invention discloses a preparation method of low-viscosity low-dielectric photosensitive resin capable of being used for UV ink-jet printing. The preparation method comprises the following steps: step 1, uniformly mixing vinyl polysiloxane, tris (2-hydroxyethyl) isocyanurate triacrylate and isobornyl methacrylate in raw materials of the photosensitive resin to obtain a mixture; step 2, uniformly mixing the mixture with a photoinitiator and a dispersing agent in the raw materials of the photosensitive resin under a dark condition, keeping the temperature at 50 DEG C, standing for 0.5 hour, and eliminating bubbles to obtain the photosensitive resin; the low-viscosity and low-dielectric photosensitive resin capable of being used for UV ink-jet printing is low in viscosity and low in dielectric, has the performance of high temperature resistance and the like at the same time, and realizes high-precision ink-jet printing.

The invention discloses photosensitive polyesteramide, a preparation method thereof, a composition, a polyimide film and application, the photosensitive polyesteramide is obtained by reaction of diester diacyl chloride and a diamine monomer, and the molar ratio of the diester diacyl chloride to the diamine monomer is 1: (0.9-1.1); the diamine monomer comprises # imgabs0, and R is selected from any one of alkyl with 1-5 carbon atoms, one or more aromatic rings and one or more fused rings. The fluorine-free low-dielectric polyimide is obtained by utilizing the secondary relaxation behavior of a polymer chain, can be applied to the fields of printed circuit boards, conductor packaging, signal transmission and the like, and has a good application prospect.