133results about How to "Low dielectric" patented technology

The invention pertains to the technical field of the copper clad laminate, which more particularly relates to a prepreg applied to a printing circuit multilayer board. The prepreg comprises reinforced materials and resin composite, wherein, the reinforced materials is glass fiber paper, and according to part by weight, the formulation of the resin composite is as follows: 20 to 84 portions of resin, 0 to 35 portions of filling materials, 0.01 to 0.3 portions of curing accelerator and 10 to 45 portions of solvent; the resin composite solvent is soaked in the glass fiber paper for 1 to 5 minutes, and is put in a 140 to 200 DEG C oven for baking for 2 to 10 minutes; after the solvent is removed, the prepreg applied to multilayer PCB processing materials is obtained; white flake and spot problems of base materials during the manufacturing procedures of the multilayer PCB are prevented, problems of de-lamination, shrink resin, holes and crack of the resin and white flake, etc. that come up after the multilayer PCB goes through cold and hot impact are improved, and the prepreg has good reliability and low cost.

The present invention discloses a thermosetting resin composition including: a bi-functional or multi-functional epoxy resin, a SMA uses as a curing agent, an allyl phenol such as diallyl bisphenol A used as a co-curing agent and a toughening agent a low-bromine or high-bromine BPA epoxy resin or tetrabromobispheno A (TBBPA or TBBA) uses as a flame retardant agent, and an appropriate solvent. After the resin composition of the invention is cured, the resin composition has lower dielectric property and better thermal reliability and tenacity. A copper clad laminate made of an enhanced material such as glass fiber has lower dielectric constant (Dk) and loss tangent (Df), high Tg, high thermal decomposition temperature (Td), better tenacity and PCB manufacturability, and thus very suitable to be used as a copper clad laminate and a prepreg for manufacturing PCBs or applied as a molding resin material for contraction, automobile and air navigation.

Disclosed is an elastomer-conductive filler composite with improved dielectric properties. The composite includes conductive fillers and an ionic liquid dispersing the conductive fillers. The ionic liquid is used as a dispersant to effectively enhance the dispersion of the conductive fillers, achieving a high dielectric constant and a low dielectric loss of the composite without deteriorating the physical properties of the conductive fillers. The use of the ionic liquid can reduce the number of processing steps and the presence of the conductive fillers at a low concentration in the composite can minimize deterioration of the physical properties of the elastomer. Further disclosed is a method for producing the composite.

A method for producing a molded article is provided, the method comprising the step of press-molding a resin composition comprising a filler and a powder of a liquid crystal polymer having a flow starting temperature of 280° C. or higher and an average particle size of 0.5 to 50 μm. In the molded article obtained by the method of the present invention, the functions provided by the filler, such as thermal conductivity and dielectric property, can be effectively and uniformly expressed.

The invention discloses a high-dielectric elastomer composite material with low content of carbon nanometer tubes and a preparation method of the composite material and belongs to an elastomer composite material. The high-dielectric elastomer composite material contains the following components in parts by weight: 100 parts of elastomers, 0.5-10 parts of array carbon tubes, 0 or 0.5-12 parts of a vulcanizing agent, and 0 or 1-7 parts of a vulcanizing-assisting agent, wherein when the elastomers are rubber matrixes, the vulcanizing agent and the vulcanizing-assisting agent are needed; and when the elastomers are thermoplastic elastomer matrixes, the vulcanizing agent and the vulcanizing-assisting agent are not needed. The composite material is prepared by a mechanical blending method. The composite material with good dispersing performance is obtained by means of adding the array carbon tubes with a one-dimensional orientation arrangement structure, the dielectric constant of the elastomer can be enhanced greatly under the condition of a low stuffing content, simultaneously the modulus of the elastomer is not increased remarkably and a high ratio value of dielectric constant/modulus is obtained.

The invention discloses a packaging material, specifically to a packaging material for an LED filament. The packaging material for the LED filament comprises red fluorescent powder and a cross-linking agent mixed with the red fluorescent powder. The cross-linking agent is prepared from the following raw materials by weight: 72 parts of epoxy resin, 18 to 22 parts of polyphenylene ether powder, 4 parts of methyl phenyl silicone oil, 0.2 to 0.4 part of nanometer zinc sulfide, 6 to 8 parts of transparent nanometer ceramic powder liquid with a mass concentration of 30 to 40%, 4 to 5 parts of nanometer titanium dioxide, 0.1 to 0.2 part of benzoyl peroxide, 0.4 to 0.5 part of maleic anhydride, 0.1 to 0.2 part of a silane coupling agent, 0.01 to 0.02 part of a chloroform antioxidant and 20 to 25 parts of a curing agent. The packaging material provided by the invention overcomes the technical defects of a small emergence angle and low light out-coupling efficiency and has improved transmittance and luminous intensity.

The aim of the invention is to supply a lightproof combination with high lightproof performance and excellent insulating ability and dispersible stability and a colour filter adopting the combination. The benzimidazolone dioxazine pigment expressed by general formula (1) is taken as the tinting material of the necessary components. In the solid content containing over 40wt% lightproof combination, the optical density of the solidified film, when the film thickness is over 2.0, (in the formula, R1 and R2 respectively and independently express a hydrogen atom or an alkyl with substituent, and X expresses a hydrogen atom or a halogen atom).

A bismuth sodium titanate thin film series has a formula of (1-X)(Bi0.5Na0.5)TiO3+XMTiO3, where x=0-0.6 and M is chosen from Ba, Pb, Sr and Ca, and is prepared by metal-organic solution depositing method. Its advantages are proper electric conductivity in ferroelectric region, wide sinter temp range, and high storage and thermoelectric properties.

The invention provides a modified PBO fiber/cyanate ester resin wave-transparent composite material and a preparation method thereof. A PBO fiber, high in strength and modulus and low in dielectric constant, is taken as a reinforcement, and a cyanate ester resin modified by an epoxy resin is taken as a substrate. The prepared modified PBO fiber/cyanate ester resin wave-transparent composite material not only is high in bending strength and interlaminar shear strength, but also has multiple characteristics of low dielectric constant and high temperature resistance.

The invention relates to a low-dielectric high-toughness reinforced PBT/PPO (polybutylene terephthalate/polyphenylene oxide) composition and a preparation method thereof. The low-dielectric high-toughness reinforced PBT/PPO composition is made from, by weight, 45-85 parts of PBT and 15-55 parts of PPO, adding up to 100 parts, as well as 20-40 parts of glass fiber, 6-14 parts of a compatibilizer, 0.6-1 part of an antioxidant, 5-20 parts of polytetrafluoroethylene, 0.2-1 part of a plasticizer, 0.2-1 part of a silane coupling agent, wherein the weight ratio of the plasticizer to the silane coupling agent is 1:1 to 5:1. The PBT/PPO composition can meet the high requirements of the fields, such as electronic and electrical engineering, integrated circuit packaging and electromagnetic wave shielding, for dielectric properties, strength and toughness.

High quality dielectric layers may be achieved without introducing excessive impurities when a semiconductor device is manufactured by a method that includes forming a lower wire layer on a structure above a semiconductor substrate, forming a silicon rich oxide layer having a refractive index of 0.45-1.55 on the lower wire layer and the structure, implanting carbon and oxygen (e.g., CO₂) into the silicon rich oxide (SRO) layer, and forming an organosilicate glass layer by heat-treating the implanted SRO layer.

An electronic component including a magnetic member comprising an iron oxide magnetic composition, a nonmagnetic member in contact with the magnetic member and including a glass ceramic composite composition, and an internal conductor portion disposed in at least one of the magnetic member and the nonmagnetic member. The glass ceramic composite composition includes crystallized glass as a main component, and quartz as a sub-component filler. The crystallized glass contains 25 percent by weight to 55 percent by weight of SiO₂, 30 percent by weight to 55 percent by weight of MgO, 5 percent by weight to 30 percent by weight of Al₂O₃, and 0 percent by weight to 30 percent by weight of B₂O₃, and the content of the quartz is 5 percent by weight to 30 percent by weight relative to 100 percent by weight of the crystallized glass.

The invention discloses a preparation method of a high light transmission and low dielectric fluorinated graphene/polyimide composite film. The method is carried out according to the steps of: under an inert gas condition, adding an NMP suspension of fluorinated graphene into polyamide acid dropwise, and performing stirring continuously for 6-10h to obtain a mixed solution; subjecting the solutionto film coating and conducting thermal imidization, i.e. under an inert gas condition, conducting heat preservation at 80DEG C-300DEG C for 7-10h, thus obtaining the fluorinated graphene/polyimide composite film. The matrix raw material polyamide acid adopted by the invention is easily available, the preparation of fluorinated graphene is simple and controllable, and through thermal curing of fluorinated graphene and polyamide acid, compounding of polyimide and fluorinated graphene is realized. The fluorinated graphene/polyimide composite film obtained by the invention maintains the excellentproperties of polyimide, and also realizes low dielectric and high mechanical strength by compounding with fluorinated graphene.

An epoxy resin composition comprising (i) a compound having at least two epoxy groups in a molecule as a main component, (ii) a fluorene skeleton-bearing, silicone-modified phenolic resin as a curing agent, and (iii) an organophosphorus compound, amine compound or imidazole compound as a cure accelerator cures into an elastomeric product having a low elasticity, toughness and low dielectric properties.

The invention discloses a nanometer zinc borate-containing maleic anhydride-grafted polyphenyl ether modified epoxy resin composite used for LED packaging. The composite employs grafted polyphenyl ether to modify epoxy resin; a polyphenyl ether material obtained after grafting by raw materials like maleic anhydride and nanometer titanium dioxide maintains excellent low dielectric performance, low loss and high heat resistance and has improved compatibility with the epoxy resin, so the defects of the epoxy resin as a packaging material are effectively improved; and blended nanometer zinc borate and graphene oxide enable the composite to have improved electrical performance, better insulating properties and heat stability, flame retardation, water resistance and the like. The composite prepared in the invention has excellent mechanical properties and dielectric properties, long service life, economic performance and safety when used as an LED packaging material.

The invention relates to a polyimide composite material and a preparation method and application thereof. The polyimide composite material comprises a polyimide matrix and a carbon fluoride material distributed in the polyimide matrix; the carbon fluoride material comprises any one or a combination of at least two of graphene fluoride with the plane size smaller than or equal to 10 [mu]m, fluorinated nano carbon black with the diameter smaller than or equal to 100 nm or fluorinated graphene quantum dots with the diameter smaller than or equal to 10 nm. The three carbon fluoride materials withspecific sizes are introduced into the polyimide matrix, so that the comprehensive performance of the polyimide can be effectively improved, and the polyimide has low dielectric constant, high light transmittance, low water absorption rate, high heat resistance and excellent mechanical properties.

A laminated substrate including a halogen-free epoxy resin composition. The halogen-free epoxy resin composition includes 100 parts by weight of a halogen-free naphthalene type epoxy resin, 10 to 25 parts by weight of a DOPO modified curing agent, 25 to 45 parts by weight of a cyanate resin, 35 to 60 parts by weight of bismaleimide, 45 to 65 parts by weight of a non-DOPO flame retardant, and 0.5 to 15 parts by weight of a curing accelerator. The laminated substrate of the present disclosure includes a halogen-free epoxy resin composition which has the characteristic of high transition temperature, so that the halogen-free epoxy resin composition has low dielectric constant, low dissipation factor, high heat resistance and high storage modulus.

The invention provides styryl siloxy phenolic resin, and a preparation method and application thereof. The styryl siloxy phenolic resin has a structure shown in a formula I. According to the method provided by the invention, a simpler synthetic method is utilized to introduce an unsaturated C=C double bond and a siloxy group into a side chain of phenolic resin, so that the resin simultaneously combines low dielectricity of double-bond curing and heat resistance, weather resistance, flame retardance, dielectric properties and a low water absorption rate of the siloxy group, greatly plays application advantages of the phenolic resin in a copper-clad laminate, and can provide excellent dielectric properties, heat and humidity resistance and heat resistance required for the high-frequency high-speed copper-clad laminate.

The invention discloses a high-temperature-resistant honeycomb node adhesive and a preparation method thereof and relates to an adhesive and a preparation method thereof. The high-temperature-resistant honeycomb node adhesive is used for solving the problem that the existing honeycomb node adhesive cannot meet the requirements on the manufacturing of polyimide paper honeycomb due to low temperature-resistant level and poor bonding compatibility. The adhesive is prepared from matrix resin, BMT type bismaleimide resin, phenolic cyanate ester, a co-polymerization modifier, a rubber elastomer toughening agent, inorganic nanometer filler and a solvent. The preparation method comprises the following steps: firstly, weighing; secondly, preparing toughening modified resin; thirdly, mechanically blending to obtain mixed rubber sheets; and fourthly, preparing uniform rubber liquid under stirring. The high-temperature-resistant honeycomb node adhesive is mainly applied in manufacturing aerospace polyimide paper honeycomb and has the characteristics of high temperature resistance and good process performance. The high-temperature-resistant honeycomb node adhesive prepared by the preparation method is used for the manufacturing of aerospace polyimide paper honeycomb and has the characteristics of high temperature resistance and good process performance.

A precursor composition for porous film comprising at least one member selected from the group consisting of compounds represented by the following general formulas: Si(OR¹)₄ and R_a(Si)(OR²)_4-a (in the formulas, R¹ represents a monovalent organic group; R represents a hydrogen atom, a fluorine atom or a monovalent organic group; R² represents a monovalent organic group; a is an integer ranging from 1 to 3, provided that R, R¹ and R² may be the same or different); a heat decomposable organic compound capable of being thermally decomposed at a temperature of not less than 250° C.; and at least one element selected from the group consisting of elements each having a catalytic action, and organic solvent. A hydrophobic compound is subjected to a gas-phase polymerization reaction in the presence of a solution of this precursor composition to thus form a hydrophobic porous film having a low dielectric constant, a low refractive index and high mechanical strength. A semiconductor device prepared using the porous film.