The invention discloses a low-
dielectric polyperfluorinated
ethylene propylene
copper-clad plate and a preparation method thereof. The preparation method comprises the following steps: performing pretreatment on chopped glass fibers, performing modification with a
silane coupling agent, adding a dispersing agent to perform fluffing by a fluffer, and enabling the glass fibers to be uniformly dispersed;
drying the dispersed glass fibers to remove water, adding polyperfluorinated
ethylene propylene
emulsion, uniformly mixing the polyperfluorinated
ethylene propylene
emulsion and the glass fibers,and performing
dehydration and concentration;
coating a high temperature resistant film with a concentrated solution uniformly by using an automatic coater; performing
vacuum drying, and taking out the materials after cooling so as to prepare a polyperfluorinated ethylene propylene prepreg; and attaching the prepreg onto a
copper foil, and performing pressing by a
hot press so as to obtain the
copper-clad plate. The copper-clad plate is prepared by selecting a polyperfluorinated ethylene propylene resin, and has a
dielectric constant value up to 2-2.5, a
dielectric loss value up to 0.0008-0.0015 and the water
absorption rate of 0.02-0.05%. The copper-clad plate disclosed by the invention is excellent in dielectric property, low in water
absorption rate, good in cohesive property and highin
machinability.