47 results about "Embedded electronics" patented technology

A dedicated interactive device designed for children comprises an embedded electronic module uniquely paired to a single child via a secure identifier. The device enables conversational and educational interactions, applying a multi-layer artificial intelligence filtering system to block sensitive content. Interaction data are encrypted and stored locally when offline, with secure synchronization to the cloud upon reconnection. A cloud-based parental dashboard allows management of one or multiple child profiles, language and voice preferences, review of time-stamped interaction logs, and configuration of usage controls. The system features privacy-by-design principles, including data minimization, strong encryption, authentication, and regulatory compliance. Optional components, such as cameras or displays, are integrated under the same safety and privacy framework. The platform unifies secure device-child pairing, robust AI filtering, comprehensive parental control, and enhanced protection of children's data in a single system.

A semiconductor device has a first RDL substrate with first conductive pillars formed over a first surface of the first RDL substrate. A first electrical component is disposed over the first surface of the first RDL substrate. A hybrid substrate is bonded to the first RDL substrate. An encapsulant is deposited around the hybrid substrate and first RDL substrate with the first conductive pillars and first electrical component embedded within the encapsulant. A second RDL substrate with second conductive pillars formed over the second RDL substrate and second electrical component disposed over the second RDL substrate can be bonded to the hybrid substrate. A second RDL can be formed over a second surface of the first RDL substrate. A third electrical component is disposed over a second surface of the first RDL substrate. A shielding frame is disposed over the third electrical component.

A system includes a read amplifier having a first input, a second input, a first output, and a second output. The read amplifier includes a first inverter having an input and an output, wherein the output of the first inverter is coupled to the first output of the read amplifier, and a second inverter having an input and an output, wherein the output of the second inverter is coupled to the second output of the read amplifier and the input of the first inverter, and the input of the second inverter is coupled to the output of the first inverter. The system also includes one or more first fuses coupled to the first input of the read amplifier, and one or more second fuses coupled to the second input of the read amplifier.

The health management system of the embedded data processing unit based on the MCU comprises an MCU health management microcontroller and health management monitoring circuits, and the health management monitoring circuits provide health monitoring information for the MCU. The health management monitoring circuit comprises a power supply monitoring circuit, a reset monitoring circuit, a temperature monitoring circuit and a main controller hardware management circuit of each functional module, the MCU receives the health management information and then records the result, and if abnormal information is monitored, whether the abnormal information is reported or not is judged according to different information. The health management monitoring, recording and reporting capabilities of the embedded data processing unit are provided at lower cost, so that the reliability of the embedded electronic equipment is improved.

An intelligent sports equipment system and method for processing data as a result of different types of events associated with a puck or ball and generally another piece of sports equipment. The information associated with each type of event can include associating player information with the processed data. In one example a smart hockey puck has embedded electronics for sensing motion across a plurality of axes, a hockey stick has an associated RFID tag that can be read by the smart hockey puck, which can transmit information to a computing device for displaying processed data.

The present invention provides an electronic component-embedded substrate in which through-holes for embedding electronic components are formed in a glass layer, and which prevents cracks or breaks from occurring in the glass during the processing of the through-holes and / or during the process of placing electronic components in the through-holes, thereby improving yield. [Solution] This disclosure relates to an electronic component embedded substrate, comprising: a glass layer; a through-hole penetrating between the upper and lower surfaces of the glass layer; a metal layer, at least a portion of which is embedded within the glass layer and at least a portion of which is exposed from the glass layer through the wall surface of the through-hole; an electronic component, at least a portion of which is disposed within the through-hole; and a sealing material, at least a portion of which is embedded within the electronic component and which fills at least a portion of the through-hole.

To enhance the degree of design freedom of an outermost conductor layer in an electronic component embedded substrate. An electronic component embedded substrate includes conductor layers, insulating layers each of which is positioned between adjacent two of the conductor layers, and an electronic component embedded in the insulating layer. The conductor layer is positioned in the uppermost layer and includes a plurality of terminal electrodes exposed to one surface side. The insulating layers are each made of a core material obtained by impregnating a core with a resin material, while the insulating layers are made of a resin material not containing a core. Since the insulating layer is made of a resin material not containing a core, the diameter of a via conductor formed in the insulating layer can be reduced. Thus, even when the plurality of terminal electrodes are formed in the conductor layer with a small pitch, the routing distance of wires can be reduced.

An electronic component embedded substrate may include at least an electronic component including a first terminal surface and a first terminal electrode, the first terminal electrode being on the first terminal surface, a first conductive layer facing the first terminal surface, an insulating layer between the first conductive layer and the first terminal surface, the insulating layer including a via hole penetrating therethrough, the first conductive layer filling the via hole and being connected to the first terminal electrode, and a seed layer in the via hole, the seed layer including a conductive film and an adhesive film, the adhesive film being between the conductive film and a boundary of the via hole.

A fault-tolerant embedded electronic actuation system, implemented as a device integrated into a machine or structural assembly, wherein the system comprises: an electronic actuation unit that is mechanically connected to a load-bearing or motion-transmitting element of the machine or structure and is configured to produce a controlled mechanical output in response to an electrical control signal; an embedded control unit arranged in the device with one or more processors that are operationally connected to a non-volatile memory; a multitude of feedback sensors that are operationally connected to the embedded control unit, each feedback sensor being physically arranged to detect a respective actuator parameter associated with the operation of the electronic actuation unit; wherein the embedded control unit is configured to execute multiple closed-loop feedback control paths simultaneously, each closed-loop feedback control path being assigned to a different feedback sensor unit and configured to generate an independent actuator state representation and corresponding correction control contribution; and A feedback coordination unit, executed by one or more processors and configured to compare the independent actuator state representations over successive control cycles to determine the relative consistency and reliability of the closed feedback control paths and to generate a composite actuation control signal by selectively combining the correction control contributions, so that controlled actuation is maintained despite a fault or deterioration affecting at least one feedback sensor unit or closed feedback control path.

Devices and methods for manufacturing the same are provided, including those for electrical connection to embedded electronic components. These devices include flexible electronic components embedded within a substrate. The free end of the flexible electronic component can be withdrawn to extend beyond the main plane of the substrate as a protruding contact.

This electronic system providing method comprises: acquiring specification information required by a user for an electronic system incorporated in a contact lens; by referring to a manufacturing library having stored therein a configuration example of the electronic system, selecting a component constituting the electronic system, on the basis of the specification information; and, by referring to the manufacturing library, outputting a flexible substrate shape that includes the component and is deformable into a curved surface shape. Accordingly, the present invention provides an electronic system providing method with which it is possible to reduce the development cost of a contact lens-type device having an electronic system incorporated therein.

A fuse-less ignition system for fireworks. An ignitor module is provided that is insertable into a firework and includes: a first end exposing a pair of electrical conductors configured for receiving a plug and a second end having a perimeter wall that defines a recessed opening into which the pair of electrical conductors extend; a heating element positioned across the recessed opening in contact with the pair of electrical conductors; an insertable structure secured within the recessed opening, wherein the insertable structure includes a cavity with a hole at an inner end that exposes a portion of the heating element, and wherein the inner end secures the heating element in position; and a pyrotechnic material placed within the cavity of the insertable structure and being adapted to ignite in response to heat energy generated by the heating element.

This invention provides a method for optimizing FAT32 file system detection and repair while minimizing memory usage. The method is applied to embedded electronic devices running Linux systems and includes at least the following steps: allocating two memory blocks the size of a single FAT entry; sequentially reading FAT entries and performing preliminary checks and repairs; based on the number of used data clusters in the FSINFO sector of the file system information, allocating a cluster array pointer representing the number of used clusters; traversing the root directory and subdirectories; filling in data cluster information and forming a cluster chain; checking the used data cluster information; and repairing any anomalies. This method addresses the problem of excessive memory consumption and OutOfMemoryError (OOM) issues that occur when using the FSCK tool for file system consistency checking and repair in Linux-based embedded devices with limited memory resources. It ensures that embedded devices can operate stably even in resource-constrained environments, guaranteeing data integrity and security.

A fuse-less ignition system for fireworks. An ignitor module is provided that is insertable into a firework and includes: a first end having an interface adapted to reside on an exterior surface of the firework for receiving a plug; a set of electrical contacts adapted to receive electricity from the plug; a heat element coupled to the electrical contacts and adapted to heat in response to received electricity; and a cavity adjacent to the heat element containing a pyrotechnic material, the pyrotechnic material adapted to ignite in response to a heating of the heat element.

An embedded electronic device and a boot method are provided. A processor of the embedded electronic device is configured to execute following steps based on a first boot procedure: verifying whether a second memory device safely corresponds to a first memory controller; in response to that the second memory device safely corresponds to the first memory controller, deciphering and verifying stored data of the second memory device through the first memory controller; and in response to that the second memory device does not safely correspond to the first memory controller, verifying whether the second memory device safely corresponds to a second memory controller.

The present invention relates to packaging electronic modules and methods of manufacturing the same. The present invention assembles multiple electronic components on a flexible printed circuit along with an integrated circuit chip and a contact plate into a module. The module can then be embedded into a plastic card by a card manufacturer using conventional milling techniques. The method packages multiple electronic components into a module. The present invention provides the ability for businesses to avoid the additional capital expenditure required for specialized equipment and enables all existing card manufacturers to manufacture smart cards with embedded electronics.

A microelectronic device includes a substrate and at least one conductive structure in the substrate. The microelectronic device further includes an electronic component at least partially embedded in the substrate. The electronic component coupled to the at least one conductive structure at a first end of the electronic component and vertically extending between the at least one conductive structure and a surface of the substrate. The microelectronic device also includes a conductive cap coupling a second end of the electronic component to a second conductive structure on a first surface of the substrate.

The utility model discloses an embedded electronic water pump for a thermal management integrated module of an electric automobile. The embedded electronic water pump comprises a pump body sub-component, a motor body sub-component and a controller, the pump body component is provided with a motor rotor assembly, an impeller, a pump base, a waterproof supporting sleeve, a second sealing ring, a pump shell, a third sealing ring, a fourth sealing ring, a flow guide sleeve, a fifth sealing ring, a first bearing and a clamping ring. The motor body component and the controller are provided with a motor shell, a motor shell sealing gasket, an insulating end piece, a coil winding, a stator core, a fastening screw ring, a convergence disc wiring terminal, the controller, a power connector, a rear end cover, a first sealing ring, a stator core fixing screw and a third screw. The embedded electronic water pump is highly integrated with a new energy automobile heat management integrated module, the use number of cooling liquid loop pipelines, water valves and actuators in a heat management system is reduced, the arrangement space is saved, and the embedded electronic water pump is particularly suitable for an electric automobile heat management integrated module with higher modularization and integration requirements.

The invention discloses a heat dissipation device utilizing the piezoelectric effect of a quartz crystal, which belongs to the technical field of the piezoelectric effect of the quartz crystal and comprises a quartz crystal oscillator, the quartz crystal oscillator is an element formed by plating electrodes on the front surface and the back surface of a quartz crystal wafer, and the vibration output end of the quartz crystal oscillator is connected with fan blades. Voltage is applied to the electrodes of the quartz crystal wafer, so that the quartz crystal oscillator drives the fan blades at the vibration output end of the quartz crystal oscillator to vibrate, a fan is formed, and heat dissipation media are driven to circulate to achieve the heat dissipation effect. The working power of the quartz crystal oscillator in the heat dissipation device is only milliwatt level and is far lower than that of a traditional electromagnetic fan or a semiconductor chilling plate, the energy consumption of a heat dissipation system is greatly reduced, and the heat dissipation device is particularly suitable for portable and embedded electronic equipment which is extremely sensitive to power consumption. The overall size of the quartz crystal oscillator and the fan blades can reach a millimeter level or below, the structure is compact, and the quartz crystal oscillator and the fan blades can be embedded into an extremely limited PCB space or packaged inside to directly dissipate heat of a heat source.

Substrate with multiple core layers to provide varied thickness cavities supporting varied thickness embedded electrical devices, and related integrated circuit (IC) packages and fabrication methods. To provide for core layer of the substrate to support multiple embedded electrical devices, multiple core layers are provided in the substrate. Providing multiple core layers in the substrate allows multiple cavities to be formed in the core layers at multiple depths to compatibly support embedding of multiple electrical devices of varied thicknesses in the core layers. Thus, providing multiple core layers in the substrate can compatibly support forming cavities of multiple thicknesses that are compatible with multiple electrical devices of different thicknesses to be embedded therein. In this manner, design parameters of the overall thickness of the core layer of a substrate can be independent of the variation in thicknesses of multiple embedded electrical devices desired to be embedded therein.

Microelectronic devices including embedded electronic components and associated methods and systems include a substrate and at least one conductive structure in the substrate. The microelectronic device further includes an electronic component at least partially embedded in the substrate. The electronic component is coupled to the at least one conductive structure at a first end of the electronic component and extends vertically between the at least one conductive structure and a surface of the substrate. The microelectronic device also includes a conductive cap coupling a second end of the electronic component to a second conductive structure on the first surface of the substrate.

The application discloses a kind of Ni / Co / Fe ternary MOF electrochemical aptamer sensor preparation method and sweat cortisol detection application, belong to electrochemical sensor technical field.The PB nanoparticle is deposited as embedded electron medium, and the three-metal MOF with high conductivity and porous structure is modified as catalytic substrate, and then the cortisol specific aptamer is covalently fixed, and the signal transmission, electrocatalysis and molecular recognition are realized on single working electrode.The application does not need additional electron medium or enzyme label, realizes the real "reagent-free" detection;At the same time, due to the synergistic catalytic effect of multi-metal MOF and PB and the high selectivity of aptamer, the sensor shows excellent sensitivity, stability and anti-interference ability in complex sweat matrix.The application provides a feasible technical path for developing low-cost, wearable sweat cortisol continuous monitoring equipment, and has significant industrialization application prospect.

The objective is to provide an electronic component-embedded substrate that can reduce the risk of cracking even when blind cavities are fabricated in the glass layer and electronic components are placed therein, thereby improving yield and reducing costs. [Solution] The present invention relates to an electronic component-embedded substrate, comprising: a glass layer; a blind cavity penetrating at least a portion of the glass layer and having at least another portion of the glass layer as its bottom surface; an electronic component, at least a portion of which is disposed within the blind cavity; and an insulating material covering at least a portion of the glass layer and the electronic component, and filling at least a portion of the blind cavity, wherein the blind cavity includes a plurality of corner regions, each of which has a shape that protrudes further outward than the wall surface of the blind cavity on a plane.

Substrates that employ a core having a cavity that embeds a reduced height electronic device are also disclosed, along with related integrated circuit (IC) packages and methods of manufacture. The cavity of the core (having one or more core layers) of the substrate includes an embedded electronics structure, wherein electronics are built on further second component (s) such that the overall height of the electronics structure is compatible with the height of the cavity of the core. In this manner, design criteria used to select the thickness or height of the core to provide desired stability in the substrate may be incompatible with the thickness or height of the embedded electronic device.

Embodiments described herein can include multi-layer circuits within a liquid crystal polymer (LCP) material to define a 3-D interconnect structure that connects the microelectronics features, devices, components and electrical interfaces. In addition, mechanical functions can be embedded in a fashion and proximity such that the embedded electronics can interface and interact with each other as well as introduced conditions relevant to the function of the device and the outside world or environment it is exposed to.

The invention relates to an embedded electronic device and a nonvolatile data storage system thereof, and belongs to the field of data storage of embedded electronic devices. The system comprises a processor, an FPGA and a nonvolatile memory, and the processor is in communication connection with the FPGA and used for issuing a read-write instruction to the FPGA; the FPGA is connected with the nonvolatile memory through a data line and is used for reading and writing data into the nonvolatile memory; two, three or more than four storage areas are arranged in the nonvolatile memory, the FPGA is used for selecting the storage area to be written according to a set rule when data are written into the nonvolatile memory every time, and the set rule is that the storage area selected this time is different from the storage area written last time. The device comprises a power supply circuit and the nonvolatile data storage system, wherein the power supply circuit is used for supplying power to the nonvolatile data storage system. According to the invention, the device can obtain the non-volatile data with timeliness before power failure after the device is restarted due to abnormal power failure, and the integrity of system data is ensured.

The present invention refers to an improved pneumoperitoneum needle device comprising an external needle formed by a sharp needle and an external needle capsule, and an internal needle positioned inside the external needle. The internal needle has an open lower portion, and an upper portion on which a spring is positioned, configured to promote the retraction and expansion of the internal needle. The pneumoperitoneum needle device, according to the present invention, further comprises a capsule connected to the external needle and a valve configured to control the passage of fluid through the device. There is also a top housing connected to the capsule, wherein the top housing stores an embedded electronic control system. The embedded electronic control system is connected to a pressure sensing mechanism and a visual feedback mechanism of the detected pressure. In addition, the device comprises a rod positioned through the capsule inside the internal needle. Said rod being configured to transmit the pressure exerted on the human tissue to the pressure sensing mechanism.

A biometric blockchain system is provided with a card body dimensioned to approximate a standard credit card, a biometric sensor module embedded in the card body and configured to capture fingerprint or facial data, embedded electronics including at least one microcontroller unit, a cryptographic processor, and non-volatile memory, communication interfaces including at least one of near field communication or bluetooth low energy or ultra-wide band, and a power source. The biometric sensor module captures biometric data, the embedded electronics generate a cryptographic key from the biometric data using a biometric key derivation function, and the cryptographic key enables access to a private blockchain ledger for secure interactions among users with compatible cards. The card body comprises a core layer comprising a substrate film, a core sheet comprising a component section with an antenna structure and a system-in-package, and a crosslinked polymer composition disposed on both sides of the substrate film.

Method for personalizing a motor vehicle, associated computer program, electronic device for personalizing a motor vehicle, and assembly comprising such a device. The present invention relates to a method (100) for personalizing a vehicle. The vehicle includes a cockpit domain controller configured to identify a vehicle user, connect to user equipment, and collect social network data from the user.The method (100) comprises: - a step (102) of acquiring, by the cockpit domain controller, social network data associated with a respective user; - a step (104) of constructing a model of a user profile, called the user model, from the social network data associated with said user; and - a step (106) of transmitting the user model to at least one electronic device embedded in the vehicle, for the purpose of performing an action dependent on the user model by the embedded electronic device. Figure 2 for the abbreviation.