343 results about "Embedded electronics" patented technology

Financial transaction and similar cards are fabricated with a split core adapted to received embedded electronic circuitry. The card core has two or more laminated layers. The cavity is milled into one or more of the layers to receive the electronic circuitry. The core layers are then laminated together, along with protective overlays. Alternative fabrication methods include co-extrusion and injection molding.

A multidrop network of multichannel, addressable sensing modules (ASM's), to be embedded within a composite structure, remotely powered, and interrogated by a personal computer through a non-contacting inductive link. Each ASM contains a microprocessor with non-volatile memory, multiplexer, programmable gain and filter instrumentation amplifier, and sigma delta analog to digital converter (all housed in two thin surface mount packages). An embedded mothernode includes circuitry for power and data reception (into the structure), and data transmission (back out of the structure). The external interrogation system communicates into the network of ASM's by modulating the AC waveform that delivers power to the embedded electronics. Once addressed, each ASM powers up its programmable (gain & filter) sensing channels (3 full differential or 5 pseudo differential) and data conversion elements. Sensed data are pulse code modulated, including error checking, which serially modulate an RF carrier for wireless transmission out of the composite to the interrogating computer. These advanced, micro-miniature sensing networks may be applied to a wide variety of military, medical, & civil structures.

Systems and methods for facilitating trading and trading analyses are presented herein. Aspects of the present invention include systems and methods for receiving real-time and historic data, caching and updating the data for access by an embedded spreadsheet engine with a spreadsheet user interface, processing the data using spreadsheet logic and functions, and generating electronic trading message orders. Embodiments of the present invention also support the publishing of and subscribing to data and trading messages. Embodiments of the present invention also support backtesting analyses.

A method of processing first and second record packets of real-time information includes computing for each packet a deadline interval and ordering processing of the packets according to the respective deadline intervals. A single-chip integrated circuit has a processor circuit and embedded electronic instructions forming an egress packet control establishing an egress scheduling list structure and operations in the processor circuit that extract a packet deadline intervals, place packets in the egress scheduling list according to deadline intervals; and embed a decoder that decodes the packets according to a priority depending to their deadline intervals.

An embedded electronics package and method of manufacture includes a support substrate, a power semiconductor component coupled to a first side of the support substrate, and a logic semiconductor component coupled to a second side of the support substrate, opposite the first side. A first insulating material surrounds the logic semiconductor component. A logic interconnect layer is electrically coupled to the logic semiconductor component by at least one conductive micro-via extending through a portion of the first insulating material. A power interconnect layer is electrically coupled to the power semiconductor component by at least one conductive macro-via extending through a thickness of the support substrate. The power interconnect layer is thicker than the logic interconnect layer.

A document delivery network server having a set of integrated functions including sending, receiving, routing and filing of FAXes and e-mails to other users which achieves numerous advantages over the prior art. The document delivery system is based on a client/server model having both analog and digital Fax line capabilities. The server side provides very highly integrated systems functionality based on industry standard, commercially available hardware and a mix of industry standard and proprietary software components including integrated FAX/modem modules, an embedded OS, embedded plug-and-play driver sets, embedded e-mail gateways, an embedded FAX archive, embedded back-up/restore, proprietary high efficiency line utilization and highly efficient load balancing.

A safe and recoverable firmware update method which for a remote embedded electronic device and the device thereof. The method includes reading an update status in a flash memory, and determining the update status. If the update status is “DEFAULT”, a default firmware is executed. If the update status is not “DEFAULT”, the update status is further determined if it is “UPDATED”. If the update status is “UPDATED”, a configuration area is set as “BOOTING” and a new firmware is executed. If the update status is not “UPDATED”, the update status is determined if it is “RUNNEW”. If the update status is “RUNNEW”, a new firmware and an update validation method are executed. If the update validation method gets an update completion validation message, the update status is set as “RUNNEW”. If the update status is not “RUNNEW”, a default firmware is executed.

A method of constructing an object includes depositing a first material in a predetermined arrangement to form a structure. The method further includes depositing a second material within the structure. The second material may have electrical properties and the method also includes providing electrical access to the second material to enable observation of the one or more electrical properties.

A heat sink structure with embedded electronic components is proposed, wherein a plurality of recessed cavities are formed on a heat sink for embedding the electronic components and receiving at least one semiconductor chip therein. This arrangement enhances electric performance of a semiconductor package with the above heat sink structure and improves heat dissipating efficiency of the semiconductor package.

An intelligent tire pressure management system capable of real-time tire pressure monitoring, vehicle load detection, and automatic tire inflation and deflation for maintaining optimal tire pressure in a commercial vehicle. Additional functions include counting tire rotations for calculating and recording distance travelled for each tire, and detecting wheel sliding due to locked-up tires. The system includes a chassis-mounted control box connecting to the vehicle air supply, a hubcap-mounted dual wheel valve apparatus integrated with a rotary union assembly that connects through the vehicle hollowed axles to the air tubes from the control box. The inflation/deflation supporting dual wheel valve apparatus has an embedded electronic unit that monitors individual tire pressure and temperature in real time, and communicates with the control box over the power line. Furthermore a load sensor integrated with the control box provides the system with the current vehicle load information. With readily available real time tire pressure data and current vehicle load information, this system can intelligently adjusts tire pressure to the desired level when necessary and, as a result, prolongs tire life, improves fuel economy, reduces the vehicle maintenance costs, and promptly alerts the driver of low, leaky or flat tire conditions for enabling the driver to take immediate corrective actions.

An embedded electronic device and a firmware updating method thereof are provided. The embedded electronic device includes a first storage unit and a second storage unit with a profile partition, a data partition and a system partition. In the method, a firmware package with a setup information file and a plurality of firmware code files is first downloaded into the first storage unit. The setup information file and the firmware code files are written in the profile partition and the data partition, respectively. The embedded electronic device is re-started, and a boot loader in the system partition is executed to sequentially read each firmware code file from the data partition for writing in the system partition. A write-in progress in the profile partition is updated upon completion of writing of each firmware code file.

A shielded embedded electronic component substrate includes a core dielectric layer having a die opening. An electrically conductive die shield lines the die opening. An electronic component is mounted within the die opening and to the die shield, where the die shield shields the electronic component. By mounting the electronic component within the die opening, the shielded embedded electronic component substrate is made relatively thin. Further, heat generated by the electronic component is dissipated to the die shield and to the ambient environment. Accordingly, the shielded embedded electronic component substrate is well suited for use when the electronic component generates a significant amount of heat, e.g., in high power applications.

An embedded electronic device connectivity system configured for extending functionality of a peripheral device, including at least two data connections incorporated in the peripheral device, configured to connect the peripheral device to at least two other devices simultaneously, allowing transfer of data between the said at least two devices when so connected; and, a DC power connection incorporated in the peripheral device enabling at least one of the two other devices to be powered from the peripheral device when connected.

The invention discloses a method for payment based on non-contact handheld payment terminal, which comprises the following steps of: respectively applying opening non-contact payment services for a third party payment platform by a non-contact handheld payment terminal and a commercial tenant terminal, getting an embedded electronic purse by the non-contact handheld payment terminal, getting a commercial tenant terminal account by the commercial tenant terminal; paying at the commercial tenant terminal by the non-contact handheld payment terminal through the electronic purse; and updating the balance of the electronic purse and the balance of the commercial tenant terminal account in real time by the third party payment platform according to the paying amount of the non-contact handheld payment terminal at the commercial tenant terminal. The invention also provides a system for payment based on the non-contact handheld payment terminal correspondingly. Therefore, the invention can enable a user to be more convenient for payment more safely and reliably during the small payment.

A safety paper with an embedded electronic circuit (1, 4, 7) is used to create more effective forgery-proof securities such as bank notes. In order to check authenticity, a carrier-frequency signal is transmitted to the circuit and an output signal representing an authenticating feature is emitted from raid circuit in response to said input signal and detected.

The invention discloses an underground pipeline positioning method based on a CORS (continuous operational reference system). The method comprises the following steps of: I, establishing a CORS; II, collecting paper drawings: collecting the pipeline as-built drawings of all underground pipelines paved in an area to be positioned and the topographical map around each underground pipeline respectively; III, making an electronic map, wherein the making process comprises the steps of paper map electronization treatment, drawing scanning and pretreatment, raster image transfer, raster image orientation, image sector conversion, pipeline attribution information marking, edge matching treatment, projection conversion, data check, conversion into an embedded electronic map and the like; IV, transferring and visually displaying the electronic map; V, superposing the coordinate data of the electronic map; and VI, positioning the underground pipelines. The method disclosed by the invention is easy and convenient to use and operate, has a good using effect and high practical value, and can really realize accurate positioning of the underground pipelines and effectively solve the problems of inconvenience in positioning operation, relatively bad positioning effect and the like of the existing underground pipeline positioning method.

Disclosed herein is a printed circuit board (PCB) including an embedded electronic component, including: a core having a cavity; an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces; insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity; and an external circuit pattern provided on the insulating layers.

An embedded-electronic-device package includes a core layer, an electronic device, a first dielectric layer, a second dielectric layer, a shielding-metal layer and conductive vias. The core layer includes a first surface, a second surface opposite to the second surface and a cavity penetrating the core layer. The electronic device is disposed in the cavity including an inner surface. The first dielectric layer disposed on the first surface is filled in part of the cavity and covers part of the electronic device. The second dielectric layer disposed on the second surface is filled in rest of the cavity, covers rest of the electronic device. The first and second dielectric layers cover the electronic device. The shielding-metal layer covers the inner surface. The conductive vias are respectively disposed in the first and second dielectric layers and extended respectively from outer surfaces of the first and second dielectric layers to the shielding-metal layer.

The invention relates to a multifunctional composite material bullet-proof helmet and a manufacturing method of the multifunctional composite material bullet-proof helmet. The manufacturing method of the multifunctional composite material bullet-proof helmet comprises the steps that a hybrid fabric is manufactured from two or more than two of high-performance carbon fiber, aramid fiber and ultra-high molecular weight polyethylene fiber, and then a prepreg is manufactured from a thermosetting/thermoplastic composite resin adhesive containing a special filler; the bullet-proof helmet is manufactured in a mold pressing process through a combined paving technology of multiple materials, and electronic information components are embedded in a prepreg layer in the mold pressing process. The bullet-proof helmet formed by the technology comprises a rigid strengthening layer, a bullet-proof layer, a back bulge prevention layer, a buffer layer and multiple structures of an embedded electronic information module and the like, has the advantages of light weight, high strength, high rigidity, corrosion resistance, low bullet-proof back bulge, good water resistance and the like, and is integrated with various electronic information functions of infrared stealth, GPS (Global Position System) positioning, night vision, video transmission and the like.

A printed circuit board having embedded electronic components and a manufacturing method thereof are disclosed. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

The present invention provides a diagnostics methodology and embedded electronic system that allows optimized low-frequency data sampling for EMA motoring subsystems in an operating vehicle. Each of the EMA motoring subsystems includes: an EMA; at least one motor for driving the EMA; and power controls for operating the motor, wherein the power controls includes a DSP controller for sampling and processing data at low-frequency sampling rates. The diagnostic methodology includes a method that has the steps of: determining an operational mode of the EMA motoring subsystem; selecting a sampling rate optimized for the determined operational mode; acquiring and processing data at the selected sampling rate; and analyzing the processed data to identify and classify a fault of the EMA motoring subsystem.

The invention describes a novel test structure and process to create the structure for performing automatic dynamic stress testing of PMOS devices for Negative Bias Temperature Instability (NBTI). The invention consists of an integrated inverter, two integrated electronic switches for switching from stress mode to device DC characterization measurement mode, and a PMOS FET device under test (DUT). The inverter assures the proper 180 degree phase relationship between the test device source and gate voltage while the imbedded electronic switches provide isolation of the test device during DC characterization testing. Another embodiment of the invention enables the testing of multiple devices under test (DUT's).