71 results about "Embedded electronics" patented technology

The invention discloses slivering equipment based on cotton-type wool fibers, and relates to the technical field of slivering of cotton-type wool fibers, and the slivering equipment comprises a positive sliver guide device, a stretch-breaking device, a slivering device, a transmission device for driving each device, and an embedded electronic control system which are arranged in sequence. Stable and uniform conveying is ensured through closed-loop control of the active unwinding rotating disc and the tension sensor, static electricity is effectively restrained through the automatic spraying system, the full-anti-static rubber roller and the coiling disc, the spinnability is improved, soft and accurate fiber straightening and length control are achieved through double-set five-up-ten-down full-delta-shaped curve stretch-breaking combined with pneumatic pressurization, and the production efficiency is improved. Compacting slivering and antistatic large-diameter straight pipe coiling guarantee that fiber slivers are compact in structure and excellent in forming, an embedded electronic control system conducts digital precise regulation and control on key parameters such as tension, gauge, drafting and pressure, automatic stopping and automatic creeling are achieved when the slivers are broken, and finally the effects of high-quality wool top production, high production efficiency and high production flexibility are achieved.

A heated skate blade system is disclosed for optimizing ice skating performance through app-controlled temperature adjustment. The system includes a nichrome heating coil embedded in or adjacent to the blade, powered by a thin-film lithium-ion battery integrated into the blade holder. A microcontroller governs power delivery to the coil and wirelessly communicates with a mobile application via Bluetooth. The application enables users to input variables such as ice temperature, skater weight, skate size, blade hollow (ROH), and desired blade temperature. Based on these inputs, the system adjusts heating output to reduce the coefficient of kinetic friction between the blade and ice, enhancing glide and top speed. A USB-C port enables battery charging. The invention provides real-time, user-specific thermal tuning for hockey and speed skating applications, delivering improved speed and energy efficiency through compact, embedded electronics and an intuitive mobile interface.

A dedicated interactive device designed for children comprises an embedded electronic module uniquely paired to a single child via a secure identifier. The device enables conversational and educational interactions, applying a multi-layer artificial intelligence filtering system to block sensitive content. Interaction data are encrypted and stored locally when offline, with secure synchronization to the cloud upon reconnection. A cloud-based parental dashboard allows management of one or multiple child profiles, language and voice preferences, review of time-stamped interaction logs, and configuration of usage controls. The system features privacy-by-design principles, including data minimization, strong encryption, authentication, and regulatory compliance. Optional components, such as cameras or displays, are integrated under the same safety and privacy framework. The platform unifies secure device-child pairing, robust AI filtering, comprehensive parental control, and enhanced protection of children's data in a single system.

A semiconductor device has a first RDL substrate with first conductive pillars formed over a first surface of the first RDL substrate. A first electrical component is disposed over the first surface of the first RDL substrate. A hybrid substrate is bonded to the first RDL substrate. An encapsulant is deposited around the hybrid substrate and first RDL substrate with the first conductive pillars and first electrical component embedded within the encapsulant. A second RDL substrate with second conductive pillars formed over the second RDL substrate and second electrical component disposed over the second RDL substrate can be bonded to the hybrid substrate. A second RDL can be formed over a second surface of the first RDL substrate. A third electrical component is disposed over a second surface of the first RDL substrate. A shielding frame is disposed over the third electrical component.

A system includes a read amplifier having a first input, a second input, a first output, and a second output. The read amplifier includes a first inverter having an input and an output, wherein the output of the first inverter is coupled to the first output of the read amplifier, and a second inverter having an input and an output, wherein the output of the second inverter is coupled to the second output of the read amplifier and the input of the first inverter, and the input of the second inverter is coupled to the output of the first inverter. The system also includes one or more first fuses coupled to the first input of the read amplifier, and one or more second fuses coupled to the second input of the read amplifier.

The health management system of the embedded data processing unit based on the MCU comprises an MCU health management microcontroller and health management monitoring circuits, and the health management monitoring circuits provide health monitoring information for the MCU. The health management monitoring circuit comprises a power supply monitoring circuit, a reset monitoring circuit, a temperature monitoring circuit and a main controller hardware management circuit of each functional module, the MCU receives the health management information and then records the result, and if abnormal information is monitored, whether the abnormal information is reported or not is judged according to different information. The health management monitoring, recording and reporting capabilities of the embedded data processing unit are provided at lower cost, so that the reliability of the embedded electronic equipment is improved.

The utility model provides an embedded electronic card reading device, and relates to the technical field of card reading devices. An embedded electronic card reading device comprises an electronic card reader and an embedded installation box with one side provided with an opening, the embedded installation box is provided with bolts along the two sides of the opening, and the bolts penetrate through the embedded installation box from the inside of the embedded installation box; and the electronic card reader is embedded into the embedded mounting box from the opening of the embedded mounting box. By the adoption of the embedded electronic card reading device, the bolt can be installed in a hidden mode, the bolt head of the bolt is prevented from being exposed outside, collision cannot be caused, the bolt can be limited in an abutting mode after installation, bolt loosening caused by vibration and the like is prevented, and the installation stability of the embedded electronic card reading device is improved.

An intelligent sports equipment system and method for processing data as a result of different types of events associated with a puck or ball and generally another piece of sports equipment. The information associated with each type of event can include associating player information with the processed data. In one example a smart hockey puck has embedded electronics for sensing motion across a plurality of axes, a hockey stick has an associated RFID tag that can be read by the smart hockey puck, which can transmit information to a computing device for displaying processed data.

The present invention provides an electronic component-embedded substrate in which through-holes for embedding electronic components are formed in a glass layer, and which prevents cracks or breaks from occurring in the glass during the processing of the through-holes and / or during the process of placing electronic components in the through-holes, thereby improving yield. [Solution] This disclosure relates to an electronic component embedded substrate, comprising: a glass layer; a through-hole penetrating between the upper and lower surfaces of the glass layer; a metal layer, at least a portion of which is embedded within the glass layer and at least a portion of which is exposed from the glass layer through the wall surface of the through-hole; an electronic component, at least a portion of which is disposed within the through-hole; and a sealing material, at least a portion of which is embedded within the electronic component and which fills at least a portion of the through-hole.

To enhance the degree of design freedom of an outermost conductor layer in an electronic component embedded substrate. An electronic component embedded substrate includes conductor layers, insulating layers each of which is positioned between adjacent two of the conductor layers, and an electronic component embedded in the insulating layer. The conductor layer is positioned in the uppermost layer and includes a plurality of terminal electrodes exposed to one surface side. The insulating layers are each made of a core material obtained by impregnating a core with a resin material, while the insulating layers are made of a resin material not containing a core. Since the insulating layer is made of a resin material not containing a core, the diameter of a via conductor formed in the insulating layer can be reduced. Thus, even when the plurality of terminal electrodes are formed in the conductor layer with a small pitch, the routing distance of wires can be reduced.

An electronic component embedded substrate may include at least an electronic component including a first terminal surface and a first terminal electrode, the first terminal electrode being on the first terminal surface, a first conductive layer facing the first terminal surface, an insulating layer between the first conductive layer and the first terminal surface, the insulating layer including a via hole penetrating therethrough, the first conductive layer filling the via hole and being connected to the first terminal electrode, and a seed layer in the via hole, the seed layer including a conductive film and an adhesive film, the adhesive film being between the conductive film and a boundary of the via hole.

An eyewear frame (10) comprises: a central portion (12) configured to receive at least one optical lens (14a, 14b), a first temple (16a) having a first embedded electronic device (18a) and a first battery (20a), a second temple (16b) having a second embedded electronic device (18b) and a second battery (20b), the first temple (16a) being pivotally secured to a first end (22a) of the central portion (12), and the second temple (16b) being pivotally secured to a second end (22b) of the central portion (12), wherein the first electronic device and the second electronic device (18a, 18b) are configured to communicate wirelessly, and the first electronic device and the second electronic device (18a, 18b) each include a short-range communication system (24a, 24b) configured to synchronize the first electronic device and the second electronic device (18a, 18b).

A system includes a read amplifier having a first input, a second input, a first output, and a second output. The read amplifier includes a first inverter having an input and an output, wherein the output of the first inverter is coupled to the first output of the read amplifier, and a second inverter having an input and an output, wherein the output of the second inverter is coupled to the second output of the read amplifier and the input of the first inverter, and the input of the second inverter is coupled to the output of the first inverter. The system also includes one or more first fuses coupled to the first input of the read amplifier, and one or more second fuses coupled to the second input of the read amplifier.

A fault-tolerant embedded electronic actuation system, implemented as a device integrated into a machine or structural assembly, wherein the system comprises: an electronic actuation unit that is mechanically connected to a load-bearing or motion-transmitting element of the machine or structure and is configured to produce a controlled mechanical output in response to an electrical control signal; an embedded control unit arranged in the device with one or more processors that are operationally connected to a non-volatile memory; a multitude of feedback sensors that are operationally connected to the embedded control unit, each feedback sensor being physically arranged to detect a respective actuator parameter associated with the operation of the electronic actuation unit; wherein the embedded control unit is configured to execute multiple closed-loop feedback control paths simultaneously, each closed-loop feedback control path being assigned to a different feedback sensor unit and configured to generate an independent actuator state representation and corresponding correction control contribution; and A feedback coordination unit, executed by one or more processors and configured to compare the independent actuator state representations over successive control cycles to determine the relative consistency and reliability of the closed feedback control paths and to generate a composite actuation control signal by selectively combining the correction control contributions, so that controlled actuation is maintained despite a fault or deterioration affecting at least one feedback sensor unit or closed feedback control path.

When performing full firmware update procedure on an electronic device, a full firmware update file is divided into multiple pieces of update data and then arranged into a first and a second sub update files, a header file associated with the sizes of each sub update file is created, and the header file and the two sub update files are merged into a full FOTA file before being uploaded to the electronic device. The electronic device extracts each sub update file based on the header file and stores the extracted first and second sub update file respectively into a first and a second storage units. After performing the firmware update steps associated with the first sub update file, the second sub update file stored in the second storage unit is copied to the first storage unit before performing the firmware update steps associated with the second sub update file.

Devices and methods for manufacturing the same are provided, including those for electrical connection to embedded electronic components. These devices include flexible electronic components embedded within a substrate. The free end of the flexible electronic component can be withdrawn to extend beyond the main plane of the substrate as a protruding contact.

The invention relates to the technical field of armor sheets, in particular to an impact-resistant armor sheet and a preparation process and forming equipment thereof.The impact-resistant armor sheet comprises an embedded electronic layer used for sensing impact, a mechanical protection layer arranged outside the embedded electronic layer and used for improving the impact-resistant strength of the sheet, and a heat insulation layer arranged outside the embedded electronic layer and used for improving the impact-resistant strength of the sheet. The heat insulation property of the sheet is improved; the intelligent armor has the beneficial effects that the impact sensing function is achieved through the embedded electronic layer, the external mechanical protection layer and the thermal insulation layer are matched, and the intelligent sensing capacity is increased while the protection performance of a traditional armor is kept. The mechanical protection layer disperses impact energy through a high-strength fiber material, the heat insulation layer obstructs heat transfer through a low-heat-conduction material, and the embedded electronic layer monitors an impact event in real time.

This electronic system providing method comprises: acquiring specification information required by a user for an electronic system incorporated in a contact lens; by referring to a manufacturing library having stored therein a configuration example of the electronic system, selecting a component constituting the electronic system, on the basis of the specification information; and, by referring to the manufacturing library, outputting a flexible substrate shape that includes the component and is deformable into a curved surface shape. Accordingly, the present invention provides an electronic system providing method with which it is possible to reduce the development cost of a contact lens-type device having an electronic system incorporated therein.

A fuse-less ignition system for fireworks. An ignitor module is provided that is insertable into a firework and includes: a first end exposing a pair of electrical conductors configured for receiving a plug and a second end having a perimeter wall that defines a recessed opening into which the pair of electrical conductors extend; a heating element positioned across the recessed opening in contact with the pair of electrical conductors; an insertable structure secured within the recessed opening, wherein the insertable structure includes a cavity with a hole at an inner end that exposes a portion of the heating element, and wherein the inner end secures the heating element in position; and a pyrotechnic material placed within the cavity of the insertable structure and being adapted to ignite in response to heat energy generated by the heating element.

This invention provides a method for optimizing FAT32 file system detection and repair while minimizing memory usage. The method is applied to embedded electronic devices running Linux systems and includes at least the following steps: allocating two memory blocks the size of a single FAT entry; sequentially reading FAT entries and performing preliminary checks and repairs; based on the number of used data clusters in the FSINFO sector of the file system information, allocating a cluster array pointer representing the number of used clusters; traversing the root directory and subdirectories; filling in data cluster information and forming a cluster chain; checking the used data cluster information; and repairing any anomalies. This method addresses the problem of excessive memory consumption and OutOfMemoryError (OOM) issues that occur when using the FSCK tool for file system consistency checking and repair in Linux-based embedded devices with limited memory resources. It ensures that embedded devices can operate stably even in resource-constrained environments, guaranteeing data integrity and security.

A fuse-less ignition system for fireworks. An ignitor module is provided that is insertable into a firework and includes: a first end having an interface adapted to reside on an exterior surface of the firework for receiving a plug; a set of electrical contacts adapted to receive electricity from the plug; a heat element coupled to the electrical contacts and adapted to heat in response to received electricity; and a cavity adjacent to the heat element containing a pyrotechnic material, the pyrotechnic material adapted to ignite in response to a heating of the heat element.

An embedded electronic device and a boot method are provided. A processor of the embedded electronic device is configured to execute following steps based on a first boot procedure: verifying whether a second memory device safely corresponds to a first memory controller; in response to that the second memory device safely corresponds to the first memory controller, deciphering and verifying stored data of the second memory device through the first memory controller; and in response to that the second memory device does not safely correspond to the first memory controller, verifying whether the second memory device safely corresponds to a second memory controller.

A system includes a read amplifier having a first input, a second input, a first output, and a second output. The read amplifier includes a first inverter having an input and an output, wherein the output of the first inverter is coupled to the first output of the read amplifier, and a second inverter having an input and an output, wherein the output of the second inverter is coupled to the second output of the read amplifier and the input of the first inverter, and the input of the second inverter is coupled to the output of the first inverter. The system also includes one or more first fuses coupled to the first input of the read amplifier, and one or more second fuses coupled to the second input of the read amplifier.

The present invention relates to packaging electronic modules and methods of manufacturing the same. The present invention assembles multiple electronic components on a flexible printed circuit along with an integrated circuit chip and a contact plate into a module. The module can then be embedded into a plastic card by a card manufacturer using conventional milling techniques. The method packages multiple electronic components into a module. The present invention provides the ability for businesses to avoid the additional capital expenditure required for specialized equipment and enables all existing card manufacturers to manufacture smart cards with embedded electronics.

A microelectronic device includes a substrate and at least one conductive structure in the substrate. The microelectronic device further includes an electronic component at least partially embedded in the substrate. The electronic component coupled to the at least one conductive structure at a first end of the electronic component and vertically extending between the at least one conductive structure and a surface of the substrate. The microelectronic device also includes a conductive cap coupling a second end of the electronic component to a second conductive structure on a first surface of the substrate.

The utility model discloses an embedded electronic water pump for a thermal management integrated module of an electric automobile. The embedded electronic water pump comprises a pump body sub-component, a motor body sub-component and a controller, the pump body component is provided with a motor rotor assembly, an impeller, a pump base, a waterproof supporting sleeve, a second sealing ring, a pump shell, a third sealing ring, a fourth sealing ring, a flow guide sleeve, a fifth sealing ring, a first bearing and a clamping ring. The motor body component and the controller are provided with a motor shell, a motor shell sealing gasket, an insulating end piece, a coil winding, a stator core, a fastening screw ring, a convergence disc wiring terminal, the controller, a power connector, a rear end cover, a first sealing ring, a stator core fixing screw and a third screw. The embedded electronic water pump is highly integrated with a new energy automobile heat management integrated module, the use number of cooling liquid loop pipelines, water valves and actuators in a heat management system is reduced, the arrangement space is saved, and the embedded electronic water pump is particularly suitable for an electric automobile heat management integrated module with higher modularization and integration requirements.

The invention discloses a heat dissipation device utilizing the piezoelectric effect of a quartz crystal, which belongs to the technical field of the piezoelectric effect of the quartz crystal and comprises a quartz crystal oscillator, the quartz crystal oscillator is an element formed by plating electrodes on the front surface and the back surface of a quartz crystal wafer, and the vibration output end of the quartz crystal oscillator is connected with fan blades. Voltage is applied to the electrodes of the quartz crystal wafer, so that the quartz crystal oscillator drives the fan blades at the vibration output end of the quartz crystal oscillator to vibrate, a fan is formed, and heat dissipation media are driven to circulate to achieve the heat dissipation effect. The working power of the quartz crystal oscillator in the heat dissipation device is only milliwatt level and is far lower than that of a traditional electromagnetic fan or a semiconductor chilling plate, the energy consumption of a heat dissipation system is greatly reduced, and the heat dissipation device is particularly suitable for portable and embedded electronic equipment which is extremely sensitive to power consumption. The overall size of the quartz crystal oscillator and the fan blades can reach a millimeter level or below, the structure is compact, and the quartz crystal oscillator and the fan blades can be embedded into an extremely limited PCB space or packaged inside to directly dissipate heat of a heat source.

A smart toothbrush system, utilizing fluorescence and an intraoral camera, includes a toothbrush handle with embedded electronics, detachable brush and intraoral camera heads, and wireless connectivity capability for communication with external devices. The detachable brush head system is capable of directing particular wavelengths of light to the oral cavity, producing visible fluorescence when incident upon certain biomaterials that are indicative of the presence of various dental conditions. The intraoral camera head is capable of directing the same wavelengths of light to the oral cavity to produce the same fluorescing effect and can be used to closely inspect or record the presence of harmful biomaterials indicative of dental health.

Substrate with multiple core layers to provide varied thickness cavities supporting varied thickness embedded electrical devices, and related integrated circuit (IC) packages and fabrication methods. To provide for core layer of the substrate to support multiple embedded electrical devices, multiple core layers are provided in the substrate. Providing multiple core layers in the substrate allows multiple cavities to be formed in the core layers at multiple depths to compatibly support embedding of multiple electrical devices of varied thicknesses in the core layers. Thus, providing multiple core layers in the substrate can compatibly support forming cavities of multiple thicknesses that are compatible with multiple electrical devices of different thicknesses to be embedded therein. In this manner, design parameters of the overall thickness of the core layer of a substrate can be independent of the variation in thicknesses of multiple embedded electrical devices desired to be embedded therein.

Microelectronic devices including embedded electronic components and associated methods and systems include a substrate and at least one conductive structure in the substrate. The microelectronic device further includes an electronic component at least partially embedded in the substrate. The electronic component is coupled to the at least one conductive structure at a first end of the electronic component and extends vertically between the at least one conductive structure and a surface of the substrate. The microelectronic device also includes a conductive cap coupling a second end of the electronic component to a second conductive structure on the first surface of the substrate.