58results about How to "Minimizes impedance" patented technology

There is disclosed a system and method for transferring power without requiring direct electrical conductive contacts. There is provided a primary unit having a power supply and a substantially laminar charging surface having at least one conductor that generates an electromagnetic field when a current flows therethrough and having an charging area defined within a perimeter of the surface, the at least one conductor being arranged such that electromagnetic field lines generated by the at least one conductor are substantially parallel to the plane of the surface or at least subtend an angle of 45° or less to the surface within the charging area; and at least one secondary device including at least one conductor that may be wound about a core. Because the electromagnetic field is spread over the charging area and is generally parallel or near-parallel thereto, coupling with flat secondary devices such as mobile telephones and the like is significantly improved in various orientations thereof.

A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.

An apparatus for use with data processing systems. The apparatus provides a split metallic conducting plane having a split formed by a substantially-dielectric-filled moat spanning a width of a side of a first metallic conducting part running substantially parallel to a side of a second metallic conducting part, with the moat structured such that the side of the first metallic part has at least two indentations and such that the side of the second metallic part has at least two indentations, and where a metallic trace is located proximate to the split metallic conducting plane.

A method of forming an embedded electronic component package includes coupling a substrate to a first dielectric layer, strip, or panel, and forming first electrically conductive vias and traces in the first dielectric layer. A cavity is then formed in the first dielectric layer and an electronic component is attached in the cavity. A second dielectric layer, strip, or panel, is then applied to the first dielectric layer, thereby encasing the electronic component in dielectric. Second via apertures are then formed through the second dielectric layer to expose selected electronic component bond pads and / or selected first electrically conductive vias and traces. The second via apertures are then filled with an electrically conductive material to form second electrically conductive vias electrically coupled to selected bond pads and selected first electrically conductive vias and traces.

A cable bus system for the mounting and positioning of high amperature, from low to high voltage electrical power cables transmitting polyphase electrical current. The cable bus system included a ventilated enclosure used to protect electrical cables mounted therein. The enclosure is provided with multiple modular cable trays which are bolted together in a stacked arrangement to form a single multi-level cable raceway. The enclosure is further provide with ventilated top and bottom covers which are secured respectively to the top and bottom of the uppermost and bottommost calve trays to define the enclosed metal circuit. The cable bus system is capable of transmitting the same highest allowable “free air” cable amperature in both above and underground installations, effectively improving the transmission of electrical power from one end to the other end in installations where a transition of electrical power from on the ground is either necessary or economically preferable. For the underground portion, the cable bus is installed in the encasement that is uniquely offset vented or power cooled to meet the cable high amperage requirements. This cable bus system is also suitable for high vertical rise installations when utilizing anti cable slip mechanism or technique.

Electrical connectors having improved impedance characteristics are disclosed. Such an electrical connector may include a first electrically conductive contact, and a second electrically conductive contact disposed adjacent to the first contact along a first direction. A mating end of the second contact may be staggered in a second direction relative to a mating end of the first contact. Alternatively or additionally, a respective mating end of each of the first and second contacts may be rotated relative to the first direction.

Electrical connectors having improved impedance characteristics are disclosed. Such an electrical connector may include a first electrically conductive contact, and a second electrically conductive contact disposed adjacent to the first contact along a first direction. A mating end of the second contact may be offset in a second direction relative to a mating end of the first contact. Offsetting of contacts within columns of contacts provides capability for adjusting impedance and capacitance characteristics of a connector assembly.

A magnetic field probe apparatus includes a loop-like conductor and feeder lines spaced at a distance from the loop-like conductor. The shape of the loop-like conductor and the arrangement of the feeder lines are adjusted in such a manner that the resonance frequency determined by the combination of the inductance of the loop-like conductor line and the capacitance formed between the looped-conductor and the feeder lines, is matched to the frequency of the magnetic field generated by and in the vicinity of a measurement object (e.g. electronic device) or the frequency of the electric signal which generates the magnetic field. With the magnetic field probe apparatus according to this invention, the magnetic field in the vicinity of the measurement object can be measured with high sensitivity.