This invention discloses a method for monitoring the adsorption state of an electrostatic chuck
wafer, comprising the following steps: If the
wafer is not adsorbed, a reference frequency is found by frequency sweeping; based on the reference frequency, several sampling capacitors are obtained by frequency sweeping, and the initial
capacitance is obtained by fitting the sampling capacitors; if the
wafer is adsorbed, several sampling capacitors are obtained by frequency sweeping, and the adsorbed
capacitance is obtained by fitting the sampling capacitors; the adsorbed
capacitance is compared with the initial capacitance to determine the wafer adsorption state. By combining automatic reference frequency optimization with graded frequency sweeping calibration, it can adapt to LC
RF filters with different capacitance values from a few nanofarads to thousands of nanofarads without manual parameter preset, greatly enhancing the
system's versatility, stability, and long-term reliability, reducing equipment maintenance costs, effectively solving the problems of narrow measurement range and inability to resolve small changes under large base capacitance values in traditional capacitance detection, and avoiding detection failures or misjudgments caused by differences in filter capacitance values.