680 results about "Q factor" patented technology

Described herein are improved capabilities for a source resonator having a Q-factor Q₁>100 and a characteristic size x₁ coupled to an energy source, and a second resonator having a Q-factor Q₂>100 and a characteristic size x₂ coupled to an energy drain located a distance D from the source resonator, where the source resonator and the second resonator are coupled to exchange energy wirelessly among the source resonator and the second resonator.

A sensor for wirelessly determining a physical property within a defined space comprises an electrical resonance and has a high quality factor Q. The quality factor Q is sufficiently high that a signal generated by the sensor can be received outside the defined space. The sensor may optimally have a dielectric coating.

Described herein are improved capabilities for a source resonator having a Q-factor Q₁>100 and a characteristic size x₁ coupled to an energy source, and a second resonator having a Q-factor Q₂>100 and a characteristic size x₂ coupled to an energy drain located a distance D from the source resonator, where the source resonator and the second resonator are coupled to exchange energy wirelessly among the source resonator and the second resonator.

Metallic workpieces of diverse shapes having work surfaces which are deformed at the surface and adjacent sub-surface layers by surface impact from ultrasonic transducers employing freely axially moving impacting elements propelled and energized by a transducer oscillating surface vibrating periodically at an ultrasonic frequency. The impacting elements are propelled in a random aperiodic and controlled impact mode at different phases of the periodic oscillation cycles. The transducer may be portable and provides a series of mechanically interconnected stages having mechanical resonances harmonically related as a multiple of the primary ultrasonic frequency and have matched stage resistances under instantaneous loading when the impact elements are driven by the transducer oscillating surface into the surface of the workpiece. This mode of operation produces Q-factor amplification of the input ultrasonic power oscillator energy at the impact needles and high propulsion velocities making it possible to machine metallic workpiece bodies to greater depths for compressing the metal to increase compressive strength of the workpiece work surfaces to substantially the ultimate material strength. The impact machining is done at ambient temperatures.

An optical receiver with an electronic filter is described, the parameters of the filter being set by means of high-speed eye monitors. Also described is a high-speed eye monitor with threshold-value decision elements which are set close to the vertices of the eye of an eye diagram, the eye monitor being optimized through connection of a pseudo-error generator and comparison with setpoint values and outputting the eye opening and the Q-factor.

An on-chip inductor device for Integrated Circuits utilizes coils on a plurality of metal layers of the IC with electrical connectors between the coils and a magnetic core for the inductor of stacked vias running between the coils. The magnetic core is made from a series of stacked vias which are deposited between each metal layer of the IC having a coil. The magnetic core desirably includes an array of magnetic bars comprising the magnetic core. The via material of the magnetic core may be both magnetic and electrically conductive. The magnetic and electrically conductive via material may also be used for the planar coil electrical connectors or other electrically conductive parts of the IC, or both, thereby lessening fabrication steps. Films of magnetic material may be formed at the ends of the inductor to provide a closed magnetic circuit for the inductor. A high Q factor inductor of small (e.g., transistor) size is thus obtained. The materials and processes which enable the on-chip inductor device are compatible with ordinary IC fabrication methods.

A noncontact communication apparatus is disclosed which includes: an antenna resonance circuit configured to have a coil for communicating with an opposite party through electromagnetic coupling; a changing block configured to change a Q-factor of the antenna resonance circuit; and a control block configured to control the antenna resonance circuit to transmit and receive data to and from the opposite party at one of a plurality of communication speeds prepared beforehand, the control block further controlling the changing block to reduce the Q-factor the higher the communication speed in use.

Disclosed are an apparatus and a method for charging power using a resonant coupling. The apparatus includes a transmission power converter for converting Direct Current (DC) power to Alternating Current (AC) power, a controller for adjusting a Q factor of a transmission resonator by using a frequency of the converted AC power and a resonant frequency of the transmission resonator and controlling adaptive impedance matching, and a transmission resonator for wirelessly transmitting the converted AC power to a receiver through the adjusted Q factor and the controlled adaptive impedance matching, the transmission resonator having a coil installed in the transmitter.

A notch filter with a high Q factor, which is integrated with a first and a second cascoded LNA, is totally contained on an integrated chip. The notch filter, comprising two Q-enhancement circuits, is coupled to the second differential LNA. The two Q-enhancement circuits are combined to generate sufficient negative impedance to compensate for the loss in the on-chip low Q inductors. To improve the image rejection of the notch filter in a wide frequency band, the notch filter uses an automatic current tuning circuit which consists of an analog multiplier and fixed and voltage controlled current sources. Furthermore, by modifying the connection and location of the tunable varactor, another wideband tunable notch filter is implemented. The notch filter can be applied in all current wireless receiver systems.

A semiconductor chip and a semiconductor device mounting the semiconductor chip capable of increasing a capacitance of a capacitor without reducing the number of signal bumps or power bumps of a package and the number of C4 solder balls of the semiconductor chip, and achieving a stable power supply with suppressing fluctuations of power at a resonance frequency without a limitation in a position to mount a capacitor for lowering noise of a signal transceiving interface block. In the semiconductor device, a via hole is provided to the semiconductor chip, a power-supply electrode connected to the via hole is provided to a back surface of the semiconductor chip, and a capacitor is mounted to the electrode on the back surface. And, a high-resistance material is used for a material of a power-supply via hole inside the semiconductor chip, thereby increasing the resistance and lowering the Q factor.

Methods and systems for compression of digital images (still or motion sequences) are provided wherein predetermined criteria may be used to identify a plurality of areas of interest in the image, and each area of interest is encoded with a corresponding quality level (Q-factor). In particular, the predetermined criteria may be derived from measurements of where a viewing audience is focusing their gaze (area of interest). In addition, the predetermined criteria may be used to create areas of interest in an image in order to focus an observer's attention to that area. Portions of the image outside of the areas of interest are encoded at a lower quality factor and bit rate. The result is higher compression ratios without adversely affecting a viewer's perception of the overall quality of the image.

A dielectric filter includes resonator electrodes, an inter-stage coupling capacitor electrode, and an input/output coupling capacitor electrode on dielectric substrates, respectively. The resonator electrodes are electro-magnetically coupled to each other to form a tri-plate structure, are made of a metallic foil embedded in a resonator dielectric substrate. Another dielectric filter includes an upper shield electrode dielectric substrate, an inter-stage coupling capacitor dielectric substrate, a resonator dielectric substrate, and an input/output coupling capacitor dielectric substrate which are made of a composite dielectric material including a high-dielectric-constant material and a low-dielectric-constant material. The above described arrangement provides the dielectric filter with an improved Q factor of a resonator, a low loss, and a high attenuation.

A reduction is achieved in the primary-side input impedance of a transformer (voltage transformer) as an output matching circuit without involving a reduction in Q-factor. An RF power amplifier includes transistors, and a transformer as the output matching circuit. The transformer has a primary coil and a secondary coil which are magnetically coupled to each other. To the input terminals of the transistors, respective input signals are supplied. The primary coil is coupled to each of the output terminals of the transistors. From the secondary coil, an output signal is generated. The primary coil includes a first coil and a second coil which are coupled in parallel between the respective output terminals of the transistors, and each magnetically coupled to the secondary coil. By the parallel coupling of the first and second coils of the primary coil, the input impedance of the primary coil is reduced.

An inductor and a method of forming and the inductor, the method including: (a) providing a semiconductor substrate; (b) forming a dielectric layer on a top surface of the substrate; (c) forming a lower trench in the dielectric layer; (d) forming a resist layer on a top surface of the dielectric layer; (e) forming an upper trench in the resist layer, the upper trench aligned to the lower trench, a bottom of the upper trench open to the lower trench; and (f) completely filling the lower trench at least partially filling the upper trench with a conductor in order to form the inductor. The inductor including a top surface, a bottom surface and sidewalls, a lower portion of said inductor extending a fixed distance into a dielectric layer formed on a semiconductor substrate and an upper portion extending above said dielectric layer; and means to electrically contact said inductor.

The present invention provides a method and an apparatus for controlling a Q-factor for a filter. The method comprises stabilizing an active feedback to provide a variable feedback in a filter, varying the active feedback based on an input signal to the filter, and producing a desired Q-factor for the filter at a first frequency band, in response to the variable feedback. The method further comprises reconfiguring a center frequency and a bandwidth of the filter based on a channel bandwidth of the input signal to the filter to adjust the Q-factor for the filter in response to a second frequency band different than the first frequency band. By reconfiguring a center frequency and a bandwidth of a filter, the Q-factor for the filter, such as a flexible or reconfigurable filter, may be controlled across a multiplicity of frequency band signals. Using software, for example, a common signal path may be provided for the multiplicity of frequency band signals within a frequency agile radio of a base station by tuning the radio based on a variable feedback through realization of a negative parallel resistance. Thus, tuneability of the Q-factor may provide frequency agile radios that include flexible or reconfigurable filters in a base station to serve different frequency bands without changing hardware. In this way, significant savings associated with frequency agility may be obtained.