199results about How to "Good semiconductor performance" patented technology

A flip-chip light emitting diode includes a substrate, an LED chip and a plurality of conductive bumps. The substrate has at least one recess defined in the surface of the substrate, and at least a part of the conductive bumps is embedded the at least one recess. The LED chip is mounted on a surface of the substrate by a flip-chip mounting process. The conductive bumps are sandwiched between the substrate and the LED chip to bond and electrically connect the LED chip to the substrate.

Coatings applicable to a variety of substrate articles, structures, materials, and equipment are described. In various applications, the substrate includes metal surface susceptible to formation of oxide, nitride, fluoride, or chloride of such metal thereon, wherein the metal surface is configured to be contacted in use with gas, solid, or liquid that is reactive therewith to form a reaction product that is deleterious to the substrate article, structure, material, or equipment. The metal surface is coated with a protective coating preventing reaction of the coated surface with the reactive gas, and / or otherwise improving the electrical, chemical, thermal, or structural properties of the substrate article or equipment. Various methods of coating the metal surface are described, and for selecting the coating material that is utilized.

A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is molded with high-thermal-conductivity resin having an electrical insulating property. The radiator base has a cooling-medium channel therein or radiating fins on the outside. Alternatively, the radiator base is housed in a second radiator base.

A semiconductor chip is mounted on a heat sink disposed inside a through-hole of a wiring board, electrodes of the semiconductor chip and connecting terminals of the wiring board are connected by bonding wires, a sealing resin is formed to cover the semiconductor chip and the bonding wires, and solder balls are formed on the lower surface of the wiring board, thereby constituting the semiconductor device. The heat sink is thicker than the wiring board. The heat sink has a protruded portion protruding to outside from the side surface of the heat sink, the protruded portion is located on the upper surface of the wiring board outside the through-hole, and the lower surface of the protruded portion contacts to the upper surface of the wiring board. When the semiconductor device is manufactured, the heat sink is inserted from the upper surface side of the wiring board.

A coating composition comprising a silicon compound represented by the following formula (1):wherein X1 is a hydrogen atom or a halogen atom, and n is an integer of 4 or more, on the proviso that n occurrences of X1 may be the same as or different from one another, or a modified silane compound represented by the following formula (2):wherein X2 is a hydrogen atom or a halogen atom, Y is a boron atom or a phosphorus atom, n is an integer of 3 or more, l is an integer of 1 or more, and m is an integer of n to 2n+3, on the proviso that m occurrences of X2 may be the same as or different from one another, and solvent thereof. This coating composition is suitably used in the production of a device for forming a silicon film or a boron- or phosphorous-doped silicon film on a substrate having a large area.

A non-volatile memory device including a cell array, which includes a plurality of memory cells, and a sense amplification circuit. The sense amplification circuit is configured to receive a data voltage of a memory cell, a first reference voltage and a second reference voltage during a data read operation of the memory cell, generate differential output signals based on a voltage level difference between the data voltage and the first and second reference voltages, and output the differential output signals as data read from the memory cell.

A Schottky diode includes at least a trenched opened in a semiconductor substrate doped with a dopant of a first conductivity type wherein the trench is filled with a Schottky junction barrier metal. The Schottky diode further includes one or more dopant region of a second conductivity type surrounding sidewalls of the trench distributed along the depth of the trench for shielding a reverse leakage current through the sidewalls of the trench. The Schottky diode further includes a bottom-doped region of the second conductivity type surrounding a bottom surface of the trench and a top-doped region of the second conductivity type surrounding a top portion of the sidewalls of the trench. In a preferred embodiment, the first conductivity type is a N-type conductivity type and the middle-depth dopant region comprising a P-dopant region.

A semiconductor process includes the following steps. A substrate is provided. At least a fin-shaped structure is formed on the substrate. An oxide layer is formed on the substrate without the fin-shaped structure being formed thereon. A gate is formed to cover a part of the oxide layer and a part of the fin-shaped structure. An etching process is performed to etch a part of the fin-shaped structure beside the gate, therefore at least a recess is formed in the fin-shaped structure. An epitaxial process is performed to form an epitaxial layer in the recess, wherein the epitaxial layer has a hexagon-shaped profile structure.

A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is molded with high-thermal-conductivity resin having an electrical insulating property. The radiator base has a cooling-medium channel therein or radiating fins on the outside. Alternatively, the radiator base is housed in a second radiator base.

A semiconductor memory device includes a plurality of memory cell array blocks, a bit line sense amplifier, a local sense amplifier that can be controlled to be turned on or off, a data sense amplifier, and a controller. The controller activates a local sense control signal for a predetermined duration in response to first and second signals. The first signal is a bit line sense enable signal that activates the bit line sense amplifier, and the local sense amplifier is activated for a predetermined duration after the bit line sense enable signal is activated. The second signal is activated or deactivated in phase with a column selection line signal that connects a pair of bit lines and a pair of local input / output lines. Accordingly, it is possible to turn on or off the local sense amplifier according to operating conditions, thereby increasing a tRCD parameter and reducing the consumption of current. The operating speed of the semiconductor memory device can be improved by combining the local sense amplifier with a current type data sense amplifier that does not require precharging and equalization during a read operation.

A semiconductor chip is mounted on a heat sink disposed inside a through-hole of a wiring board, electrodes of the semiconductor chip and connecting terminals of the wiring board are connected by bonding wires, a sealing resin is formed to cover the semiconductor chip and the bonding wires, and solder balls are formed on the lower surface of the wiring board, thereby constituting the semiconductor device. The heat sink is thicker than the wiring board. The heat sink has a protruded portion protruding to outside from the side surface of the heat sink, the protruded portion is located on the upper surface of the wiring board outside the through-hole, and the lower surface of the protruded portion contacts to the upper surface of the wiring board. When the semiconductor device is manufactured, the heat sink is inserted from the upper surface side of the wiring board.

A circuit-constituting unit forming a distribution circuit or the like in a vehicle. The circuit-constituting unit includes a plurality of bus bars for constituting a power circuit; a semiconductor switching device provided in the power circuit; and a control circuit board. The bus bars are bonded to a surface of the control circuit board such that the bus bars are arranged to be generally coplanar with each other. The semiconductor switching device is mounted on both of the corresponding bus bars and the control circuit board. An opening may be formed through the control circuit board. In this case, one of terminals of the semiconductor switching device may be connected to a surface of the control circuit board facing away from the surface to which the bus bars are bonded. The other terminals may be connected respectively to the bus bar through the opening.

A method for manufacturing a Schottky diode comprising steps of 1) providing a region with a dopant of a second conductivity type opposite to a first conductivity type to form a top doped region in a semiconductor substrate of said first conductivity type; 2) providing a trench through the top doped region to a predetermined depth and providing a dopant of the second conductivity type to form a bottom dopant region of the second conductivity type; and 3) lining a Schottky barrier metal layer on a sidewall of the trench at least extending from a bottom of the top doped region to a top of the bottom doped region.

The present invention relates to devices, particularly photovoltaic devices, incorporating Group IIB / VA semiconductors such phosphides, arsenides, and / or antimonides of one or more of Zn and / or Cd. In particular, the present invention relates to methodologies, resultant products, and precursors thereof in which electronic performance of the semiconductor material is improved by causing the Group IIB / VA semiconductor material to react with at least one metal-containing species (hereinafter co-reactive species) that is sufficiently co-reactive with at least one Group VA species incorporated into the Group IIB / VA semiconductor as a lattice substituent (recognizing that the same and / or another Group VA species also optionally may be incorporated into the Group IIB / VA semiconductor in other ways, e.g., as a dopant or the like).

A Schottky diode includes at least a trenched opened in a semiconductor substrate doped with a dopant of a first conductivity type wherein the trench is filled with a Schottky junction barrier metal. The Schottky diode further includes one or more dopant region of a second conductivity type surrounding sidewalls of the trench distributed along the depth of the trench for shielding a reverse leakage current through the sidewalls of the trench. The Schottky diode further includes a bottom-doped region of the second conductivity type surrounding a bottom surface of the trench and a top-doped region of the second conductivity type surrounding a top portion of the sidewalls of the trench. In a preferred embodiment, the first conductivity type is a N-type conductivity type and the middle-depth dopant region comprising a P-dopant region.

The present invention is efficient oxidizing catalyst for organic waste water treating and its preparation process and application. The carrier prepared with composite powder of Ti, Si, Al and RE oxide and in the average granularity smaller than 100 nm is loaded with at least two kinds of transition metal to prepare the catalyst. The catalyst contains TiO2-SiO2-Al2O3 65-85 wt%, RE oxide 5-15 wt%, and transition oxide 5-30 wt%. The preparation process of the catalyst includes preparing carrier powder with the carrier components and through precipitation, homogenization, ageing, filtering, washing, pulping, dispersing, fluidizing at supercritical condition to eliminate water and activating; forming the carrier, soaking, fluidizing and drying, and activating to obtain the catalyst. The catalyst is used in acid organic waste water treatment and has COD degrading rate higher than 95 %, ammonia nitrogen oxidizing conversion rate higher than 99 % and chroma eliminating rate higher than 95 %.

The invention relates to the field of fabrication of a high-quality semiconductor single-walled carbon nanotube, in particular to a method for directly growing the high-quality semiconductor single-walled carbon nanotube through in-situ weak hydrogen etching. A metallic and small-diameter single-walled carbon nanotube can be etched in situ at a certain reaction temperature by regulating and optimizing a flow of carrier gas, namely hydrogen and under the conditions of taking dicyclopentadienyl iron as a catalyst precursor, sulfur powder as a growth promoter and organic low-carbon hydrocarbon as a carbon source; and the high-quality semiconductor-superior single-walled carbon nanotube is finally obtained. The content of the semiconductor single-walled carbon nanotube is greater than or equal to 91wt%, the diameter distribution is between 1.5nm and 2.5nm, and the highest concentrated oxidation temperature reaches 800 DEG. With the adoption of the method, the massive, fast and low-cost controlled growth of the semiconductor single-walled carbon nanotube with the narrower diameter distribution and the high quality is realized, and the problems such as serious damages to a sample due to a strong etching agent, complexity of a fabrication process, low output and high cost during a selective fabrication course of a conduction-superior single-walled carbon nanotube can be effectively solved.

The semiconductive roller according to the present invention includes: a roller body having an outer peripheral surface made of a semiconductive rubber composition; and an oxide film covering the outer peripheral surface of the roller body, while the semiconductive rubber composition contains a base polymer and a crosslinking component for crosslinking the base polymer, the base polymer is a mixture of a bicopolymer E containing epichlorohydrin and nitrile-butadiene rubber N, the mass ratio E / N of the bicopolymer E and the nitrile-butadiene rubber N in the mixture is 50 / 50 to 80 / 20, and the crosslinking component includes a thiourea-based crosslinking component for crosslinking the bicopolymer E and a sulfur-based vulcanizing component for vulcanizing the nitrile-butadiene rubber N.

A semiconductor unit of certain aspects of the invention includes electrically conductive plates in the shape of the letter L, each consisting of a horizontally disposed leg portion and a vertically disposed flat body portion that is perpendicular to a cooling plate adhered to the bottom of the semiconductor unit. A pair of the vertically disposed flat body portions sandwiches a semiconductor chip. Owing to this construction, the heat generated in the semiconductor chip can be conducted away through the both surfaces of the chip, thus improving cooling performance. Since the heat is conducted away through the leg portions of the L-shaped electrically conductive plates a projected planar area occupied by the cooling plate required for cooling the semiconductor unit is reduced. Therefore, the size of the semiconductor unit can be reduced.

A method is disclosed of repairing wirebond damage on semiconductor chips such as high speed semiconductor microprocessors, application specific integrated circuits (ASICs), and other high speed integrated circuit devices, particularly devices using low-k dielectric materials. The method involves surface modification using reactive liquids. In a preferred embodiment, the method comprises applying a silicon-containing liquid reagent precursor such as TEOS to the surface of the chip and allowing the liquid reagent to react with moisture to form a solid dielectric plug or film (50) to produce a barrier against moisture ingress, thereby enhancing the temperature / humidity / bias (THB) performance of such semiconductor devices.

The invention relates to the technical field of organic materials and provides a thienothiophene quinoid organic photoelectric material. The material is a compound which is shown as a structural formula (I); in the formula, R1, R2, R3, R4, R5 and R6 are selected from H, C1-C20 alkyl group or C1-C20 alkoxyl group; and m and n are integers of 0-10. The invention also provides a preparation method and application of the thienothiophene quinoid organic photoelectric material. Since the thienothiophene quinoid organic photoelectric material has a quinoid thiophene ring and a cyano group, wider spectral response is guaranteed, the photoelectric conversion efficiency of the material is increased, and better thermal stability and environmental stability are shown.

A semiconductor integrated circuit system has a control target circuit executing a program, a system information monitor unit for outputting system information indicating a state of the control target circuit, a circuit characteristic monitor unit for determining a circuit characteristic of the control target circuit and outputting the circuit characteristic as circuit characteristic information, a malfunction determination unit for determining whether or not the control target circuit is normally operating based on the system information, a reference circuit characteristic holding unit for holding the circuit characteristic information as reference circuit characteristic information when the control target circuit is normally operating, a malfunction factor determination unit for determining a malfunction factor based on the circuit characteristic information and on the reference circuit characteristic information when the control target circuit is not normally operating, and a correction target determination unit for determining a correction target in the control target circuit.

The present invention provides a semiconductor structure, comprising: a substrate; a gate stack located on the substrate and comprising at least a gate dielectric layer and a gate electrode layer; source / drain regions, located in the substrate on both sides of the gate stack; an STI structure, located in the substrate on both sides of the source / drain regions, wherein the cross-section of the STI structure is trapezoidal, Sigma-shaped or inverted trapezoidal depending on the type of the semiconductor structure. Correspondingly, the present invention further to provides a method of manufacturing the semiconductor structure. In the present invention, STI structures having different shapes can be combined with different stress fillers to apply tensile stress or compressive stress laterally to the channel, which will produce a positive impact on the electron mobility of NMOS and the hole mobility of PMOS and increase the channel current of the device, thereby effectively improving the performance of the semiconductor structure.

A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a conductive casing, a semiconductor die, a conductive connector, an insulating encapsulant, a redistribution structure, and a first conductive terminal. The conductive casing has a cavity. The semiconductor die is disposed in the cavity of the conductive casing. The conductive connector is disposed on a periphery of the conductive casing. The insulating encapsulant encapsulates the conductive connector, the semiconductor die and the cavity. The redistribution structure is formed on the insulating encapsulant and is electrically connected to the conductive connector and the semiconductor die. The first conductive terminal is disposed in openings of the redistribution structure and is physically in contact with a portion of the conductive casing.

The invention discloses a touch LCD screen, which comprises an upper substrate, a lower substrate, and a liquid crystal layer, wherein the upper substrate comprises a touch screen; the lower substrate and the upper substrate are oppositely arranged; the lower substrate comprises a thin film transistor panel; the liquid crystal layer is arranged between the upper substrate and the lower substrate; a conducting layer of the touch screen comprises a first carbon nanotube layer; and a semiconductor layer of a thin film transistor on the thin film transistor panel comprises a second carbon nanotube layer.

The invention discloses a boron-doping diamond film modification-based PEMFC (Proton Exchange Membrane Fuel Cell) bipolar plate and a preparation method thereof, belonging to the field of batteries. In the boron-doping diamond film modification-based PEMFC bipolar plate, after a stainless steel plate is subjected to surface pretreatment, a layer of TI film is sputtered on the stainless steel plate by using magnetron sputtering; a boron-doping diamond film is deposited on the TI film by using heat wire CVD (Chemical Vapor Deposition) equipment; and a diamond film and TI film compounded modification layer is formed on the surface of stainless steel. The stainless steel plate treated by the method has high corrosion resistance and a favorable conductive and heat-conducting property; and according to the stainless steel plate, the battery ratio power can be greatly improved and the PEMFC can achieve the aims of prolonging the service life and reducing the weight, the volume and the cost.

A semiconductor device includes a substrate, a gate structure, a sidewall spacer, and an epitaxial layer. The gate structure is disposed on the substrate, and the substrate has at least one recess disposed adjacent to the gate structure. The sidewall spacer is disposed on at least two sides of the gate structure. The sidewall spacer includes a first spacer layer and a second spacer layer, and the first spacer layer is disposed between the gate structure and the second spacer layer. The epitaxial layer is disposed in the recess, and the recess is a circular shaped recess. A distance between an upmost part of the recess and the gate structure is less than a width of the sidewall spacer.

First bump electrodes are arrayed in a straight line along a first side of a semiconductor chip. Second bump electrodes are more narrowly arrayed in a zigzag arrangement along a second side of the chip. By carrying out an injection of a sealing resin from the second side on which the second bump electrodes are arrayed, a surface of the semiconductor chip that is subjected to face-down mounting on a film substrate is sealed.